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1. 发明授权

US09633162B2 Method and system for the modular design and layout of integrated circuits 有权
公开(公告)号：US09633162B2
公开(公告)日：2017-04-25
申请号：US14849512
申请日：2015-09-09
申请人： Active-Semi, Inc.
发明人： Steven Huynh , David Kunst
IPC分类号： G06F17/50
CPC分类号： G06F17/5072 , H01L2224/49171 , H01L2924/0002 , H01L2924/00
摘要： An integrated circuit (IC) and fabrication method thereof is provided that include the steps of specifying a plurality of required tile modules suitable for a particular end application, each of the modular tiles being configured to perform a predetermined function and constructed to have approximately the same length and width dimensions. The modular tiles are used to form the IC in a standard IC fabrication process. In many implementations, physical layout of the IC does not include the step of routing. Capabilities also include configuring the modular tiles to have programmable performance parameters and configuring the modular tiles to cooperate usefully with one another based on a programmable parameter.

2. 发明申请

US20150379182A1 Method and System for the Modular Design and Layout of Integrated Circuits 有权
标题翻译：集成电路模块化设计与布局方法与系统
公开(公告)号：US20150379182A1
公开(公告)日：2015-12-31
申请号：US14849512
申请日：2015-09-09
申请人： Active-Semi, Inc.
发明人： Steven Huynh , David Kunst
IPC分类号： G06F17/50
CPC分类号： G06F17/5072 , H01L2224/49171 , H01L2924/0002 , H01L2924/00
摘要： An integrated circuit (IC) and fabrication method thereof is provided that include the steps of specifying a plurality of required tile modules suitable for a particular end application, each of the modular tiles being configured to perform a predetermined function and constructed to have approximately the same length and width dimensions. The modular tiles are used to form the IC in a standard IC fabrication process. In many implementations, physical layout of the IC does not include the step of routing. Capabilities also include configuring the modular tiles to have programmable performance parameters and configuring the modular tiles to cooperate usefully with one another based on a programmable parameter.
摘要翻译：提供了一种集成电路（IC）及其制造方法，其包括以下步骤：指定适合于特定终端应用的多个所需的瓦片模块，每个模块化瓦片被配置为执行预定功能并被构造为具有大致相同的功能长度和宽度尺寸。模块化瓦片用于在标准IC制造工艺中形成IC。在许多实现中，IC的物理布局不包括路由的步骤。能力还包括配置模块化瓦片以具有可编程的性能参数，并且配置模块化瓦片，以便基于可编程参数彼此有用地进行协调。

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