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1. 发明授权

US11174411B2 Liquid composition, and method for producing a film and a laminate by using the liquid composition 有权
公开(公告)号：US11174411B2
公开(公告)日：2021-11-16
申请号：US16249020
申请日：2019-01-16
申请人： AGC Inc.
发明人： Tomoya Hosoda , Tatsuya Terada , Shigeki Kobayashi , Atsumi Yamabe
IPC分类号： C08J3/12 , C09D127/18 , C08F18/08 , C08F20/04 , C08F16/24 , C08F22/06 , C08L27/18 , B32B15/082 , C08J5/18 , C08F14/26 , C08L101/00 , C08F20/18 , C08F234/00 , C08F20/32 , C08F214/26 , B32B15/08 , H05K1/03 , H05K3/28 , C09D5/00 , H05K3/06
摘要： To provide a liquid composition whereby a resin powder can be uniformly dispersed in a resin or the like without being scattered, and a method for producing a film, a laminate or the like by using the liquid composition. The liquid composition comprises a liquid medium and a resin powder dispersed in the liquid medium, and characterized in that the average particle size of the resin powder is from 0.3 to 6 μm, the volume-based cumulative 90% diameter of the resin powder is at most 8 μm, and the resin powder is a resin containing a fluorinated copolymer having a specific functional group. And, the method is a method for producing a film, a laminate or the like by using the liquid composition.

2. 发明授权

US10677379B2 Laminate 有权
公开(公告)号：US10677379B2
公开(公告)日：2020-06-09
申请号：US15722625
申请日：2017-10-02
申请人： AGC Inc.
发明人： Eiichi Nishi , Tomoya Hosoda , Toru Sasaki
IPC分类号： B32B7/10 , F16L11/12 , B32B27/30 , B32B1/08 , B32B27/08 , B32B27/32 , B32B27/34 , C08F214/26
摘要： To provide a laminate which is formed from resins and is excellent in heat resistance and excellent in flexibility and mechanical properties under high-temperature conditions and which undergoes no separation of layers even when contacted with oil such as engine oil for a long period of time. The laminate comprises a first layer containing a fluorinated copolymer and a second layer containing a polyamide directly laminated on the first layer, wherein the fluorinated copolymer has units based on tetrafluoroethylene, units based on ethylene, units based on a copolymerizable another monomer not having a carbonyl group, and carbonyl group-containing groups, wherein the amounts of the respective units are in specific ranges, and the tensile elongation at 200° C. of the fluorinated copolymer is at least 200%, and the melting point of the polyamide and the flexural elastic modulus at 23° C. of the second layer are in specific ranges.

3. 发明授权

US10448506B2 Wiring substrate and process for producing it 有权
公开(公告)号：US10448506B2
公开(公告)日：2019-10-15
申请号：US16238586
申请日：2019-01-03
申请人： AGC Inc.
发明人： Tomoya Hosoda , Tatsuya Terada
IPC分类号： H05K1/03 , H05K1/11 , H05K3/18 , H05K3/40 , H05K1/02 , H05K3/42 , H01Q1/38
摘要： To provide a wiring substrate having excellent transmission characteristics, of which initial failure of a plating layer formed on an inner wall surface of a hole is suppressed regardless of the type of the pre-treatment applied to the inner wall surface of the hole, and of which the plating layer has favorable heat resistance, and a process for producing it.A wiring substrate 10 comprising an electrical insulator layer 20, a first conductor layer 32 formed on a first surface of the electrical insulator layer 20, a second conductor layer 34 formed on a second surface of the electrical insulator layer 20, and a plating layer 42 provided on an inner wall surface of a hole 40 which opens from the first conductor layer 32 through the second conductor layer 34; wherein the electrical insulator layer 20 has a heat resistant resin layer 22 containing a heat resistant resin and a resin powder; the resin powder is formed from a resin material containing a melt-formable fluororesin having a functional group such as a carbonyl group-containing group; the content of the resin powder is from 5 to 70 mass % to the heat resistant resin layer 22; and the electrical insulator layer 20 has a dielectric constant of from 2.0 to 3.5.

4. 发明申请

US20200317948A1 DISPERSION, AND METHODS FOR PRODUCING METAL LAMINATE AND PRINTED BOARD 审中-公开
公开(公告)号：US20200317948A1
公开(公告)日：2020-10-08
申请号：US16904645
申请日：2020-06-18
申请人： AGC Inc.
发明人： Tatsuya Terada , Tomoya Hosoda , Atsumi Yamabe
IPC分类号： C09D127/18 , B05D7/14 , C08J3/11 , C09D7/65 , H05K3/06 , H05K1/03
摘要： To provide a dispersion excellent in miscibility with varnish, coating properties, dispersibility and dispersion stability; and methods for producing a metal laminate and a printed board. A dispersion comprises an organic solvent and a powder so that the powder is dispersed in the organic solvent, wherein the powder is a powder containing a tetrafluoroethylene type polymer having a melt viscosity at 380° C. of from 1×102 to 1×106 Pa·s; the viscosity is from 50 to 10,000 mPa·s; and the thixotropy ratio calculated by dividing the viscosity measured under the condition of rotational speed of 30 rpm by the viscosity measured under the condition of rotational speed of 60 rpm, is from 1.0 to 2.2.

5. 发明授权

US10716203B2 Adhesive film and flexible metal laminate 有权
公开(公告)号：US10716203B2
公开(公告)日：2020-07-14
申请号：US15140912
申请日：2016-04-28
申请人： AGC Inc.
发明人： Tomoya Hosoda , Eiichi Nishi , Toru Sasaki , Yasuhiko Matsuoka , Wataru Kasai
IPC分类号： H05K1/02 , B32B15/08 , C09J7/30 , C09J127/18 , B32B7/12 , C09J7/22 , H01P11/00 , H05K3/38 , B32B27/28 , C09J179/08 , H01P3/08 , H05K1/03 , H05K3/06 , H05K3/22 , H05K3/46
摘要： To provide an adhesive film comprising a polyimide film and a fluorinated resin layer directly laminated, in which blisters (foaming) in an atmosphere corresponding to reflow soldering at high temperature are suppressed, and a flexible metal laminate.An adhesive film having a fluorinated resin layer containing a fluorinated copolymer (A) directly laminated on one side or both sides of a polyimide film, wherein the fluorinated copolymer (A) has a melting point of at least 280° C. and at most 320° C., is melt-moldable, and has at least one type of functional groups selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, and the fluorinated resin layer has a thickness of from 1 to 20 μm.

6. 发明授权

US10304583B2 Insulating tape for covering, and method for producing structure 有权
公开(公告)号：US10304583B2
公开(公告)日：2019-05-28
申请号：US14944657
申请日：2015-11-18
申请人： AGC Inc.
发明人： Tomoya Hosoda , Yasuhiko Matsuoka , Toru Sasaki , Wataru Kasai
IPC分类号： H01B3/30 , B32B27/08 , H01B3/44 , C08F214/26 , C08J5/12 , B32B27/28 , B29C65/02 , B29C65/00 , H01B13/08 , B32B27/18 , B32B27/20 , B32B27/30 , B32B27/32 , B29K627/18 , B29K679/00 , B29L9/00 , B29L31/34 , B29C63/00 , B29C63/02
摘要： To provide an insulating tape for covering, in which a polyimide film and a fluorinated resin film are laminated with excellent adhesion, and a method for producing a structure, which comprises covering a conductor with such an insulating tape for covering, followed by thermal treatment. The insulating tape for covering, comprises a polyimide film and a fluorinated resin film directly laminated on one or both surfaces of the polyimide film, wherein the fluorinated resin film contains a fluorinated copolymer (A) which has a melting point of from 220 to 320° C. and can be melt-molded and which has at least one type of functional groups selected from the group consisting of carbonyl group-containing groups, hydroxy groups, epoxy groups and isocyanate groups.

7. 发明授权

US11535015B2 Molded product, metal-clad laminate, printed wiring board, and methods for their production 有权
公开(公告)号：US11535015B2
公开(公告)日：2022-12-27
申请号：US16808502
申请日：2020-03-04
申请人： AGC Inc.
发明人： Wataru Kasai , Tomoya Hosoda
IPC分类号： B32B3/24 , B32B27/30 , B32B15/082 , C08J5/18 , H05K1/03 , H05K3/00 , H05K3/02 , B32B3/26
摘要： To provide a molded product, a metal-clad laminate and a printed wiring board, each of which contains a tetrafluoroethylene type polymer, whereby an decrease in electrical characteristics is inhibited and a hole can be easily bored with UV-YAG laser; and methods for their production. A molded product containing a tetrafluoroethylene type polymer, in which the content of components other than the tetrafluoroethylene type polymer is at most 0.9 mass %, and which has a wavelength range where the extinction coefficient becomes to be from 1.2 to 4.5 at from 200 to 380 nm; and a method for its production. A metal-clad laminate having a conductive metal layer and a layer of the molded product; and a method for its production. A printed wiring board provided with the metal-clad laminate and having through-holes in the thickness direction of the polymer layer.

8. 发明授权

US11041053B2 Resin powder, method for its production, composite, molded product, method for producing ceramic molded product, metal laminated plate, printed circuit board and prepreg 有权
公开(公告)号：US11041053B2
公开(公告)日：2021-06-22
申请号：US16709049
申请日：2019-12-10
申请人： AGC Inc.
发明人： Tomoya Hosoda , Eiichi Nishi , Toru Sasaki , Nobutaka Kidera
IPC分类号： C08J3/12 , B32B15/08 , B32B27/28 , B32B27/30 , C08J5/10 , B32B27/38 , B32B15/20 , B32B15/18 , B32B9/00 , C08L79/08 , B32B9/04 , C08L101/00 , B32B27/32 , B32B27/18 , B32B27/08 , C08L63/00 , H05K1/03 , B32B5/16 , B32B7/12 , C08J5/24 , H05K3/00 , H05K3/06 , C08F214/26
摘要： A resin powder having a high bulk density and an average particle size of at most 50 μm from resin particles containing a fluorocopolymer as the main component and having a melting point of 260 to 320° C., where the fluorocopolymer contains a unit containing a carbonyl group-containing group, a unit based on tetrafluoroethylene, and a unit based on a perfluoro(alkyl vinyl ether) or a unit based on hexafluoropropylene. A method of producing the resin powder by subjecting resin particles (A) having an average particle size of at least 100 μm to mechanical pulverization treatment. The resin particles (A) is made of a material (X) having a fluorocopolymer (X1) as the main component, which has a unit (1) based on a monomer containing at least one functional group selected from a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, and a unit (2) based on tetrafluoroethylene.

9. 发明授权

US10920030B2 Prepreg, method for its production, and fiber-reinforced molded product 有权
公开(公告)号：US10920030B2
公开(公告)日：2021-02-16
申请号：US15996966
申请日：2018-06-04
申请人： AGC Inc.
发明人： Tomoya Hosoda , Takashi Sato , Masatoshi Abe
IPC分类号： C08J5/24 , C08L77/02 , C08L79/08 , C08L27/18 , C08L71/00 , C08L101/00 , B29B11/16 , B29C70/42 , B29C70/06 , B29B11/00 , B29K71/00 , B29K77/00 , B29K79/00 , B29K81/00 , B29K307/04 , B29K427/12
摘要： To provide a prepreg excellent in storage stability and capable of obtaining a fiber-reinforced molded product excellent in impact resistance, and a method for its production, as well as a fiber-reinforced molded product excellent in impact resistance. The prepreg comprises reinforcing fibers and a matrix resin, wherein the matrix resin comprises a thermoplastic resin (but excluding the following fluororesin) and a melt-formable fluororesin having a melting point of from 100 to 325° C. and having functional groups of at least one type selected from the group consisting of carbonyl group-containing groups, hydroxy groups, epoxy groups and isocyanate groups, and in 100 mass % of the total of the thermoplastic resin and the fluororesin, the proportion of the thermoplastic resin is from more than 30 to 99 mass % and the proportion of the fluororesin is from 1 to less than 70 mass %.

10. 发明申请

US20200369878A1 RESIN COMPOSITION, MOLDED PRODUCT AND ITS USE 审中-公开
公开(公告)号：US20200369878A1
公开(公告)日：2020-11-26
申请号：US16992180
申请日：2020-08-13
申请人： AGC Inc.
发明人： Norio OZAWA , Tomoya Hosoda , Takashi Sato
IPC分类号： C08L71/00
摘要： To provide a molded product which is excellent in impact resistance, flexibility and bending resistance without impairing the characteristics (heat resistance, mechanical properties, etc.) of a polyaryletherketone, and has little appearance defects, and a resin composition, whereby it is possible to obtain such a molded product. This resin composition comprises a polyaryletherketone and a fluorinated elastomer. The ratio (MFRA/MFRB) of the melt flow rate MFRA of the polyaryletherketone at a temperature of 372° C. under a load of 49 N to the melt flow rate MFRB of the fluorinated elastomer at a temperature of 372° C. under a load of 49 N is from 0.2 to 5.0, and the proportion of the volume of the polyaryletherketone in the total of the volume of the polyaryletherketone and the volume of the fluorinated elastomer is from 60 to 97 vol %.

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