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1. 发明公开

US20240363370A1 DRYING APPARATUS AND METHOD BASED ON SUPERCRITICAL FLUID 审中-公开
公开(公告)号：US20240363370A1
公开(公告)日：2024-10-31
申请号：US18682639
申请日：2021-08-09
申请人： ACM RESEARCH (SHANGHAI), INC.
发明人： Hui Wang , Shena Jia , Xiaofeng Tao , Bin He , Xin Zhao , Yingnan Sun , Bin Li , Jun Wang , Jian Wang , Fuping Chen , Xiaoyan Zhang , Zhenming Chu , Deyun Wang
IPC分类号： H01L21/67 , B08B3/08 , B08B7/00
CPC分类号： H01L21/67034 , B08B3/08 , B08B7/0021
摘要： A drying apparatus is based on supercritical fluid. The drying apparatus includes: an upper cover; a base, arranged below the upper cover and the base and the upper cover; a substrate tray, arranged on the base; a first fluid supply tube, arranged on the top wall of the upper cover; a fluid disturbance plate, arranged below the first fluid supply tube; a second fluid supply tube, arranged on a first side wall of the upper cover; and a fluid discharge tube, arranged on a second side wall of the upper cover. The inner space of the closed chamber can be minimized by using the drying apparatus, thereby saving the usage amount of the supercritical fluid, and reducing the usage costs.

2. 发明公开

US20240266192A1 SUBSTRATE TREATMENT APPARATUS 审中-公开
公开(公告)号：US20240266192A1
公开(公告)日：2024-08-08
申请号：US18568743
申请日：2022-05-20
申请人： ACM RESEARCH (SHANGHAI), INC.
发明人： Hui Wang , Yinxiao Lu , Shena Jia , Xiaofeng Tao , Yang Han
IPC分类号： H01L21/67 , H01L21/687
CPC分类号： H01L21/67103 , H01L21/67023 , H01L21/67248 , H01L21/68764
摘要： Disclosed in an embodiment of the present invention is a substrate heating apparatus, comprising a holding unit, a rotating unit, a heating unit, and a control unit. The heating unit comprises multiple fluid supply pipes and multiple groups of fluid cartridges, a substrate region heated by the fluid cartridges in the same group is a circular ring or a circle, and substrate regions heated by the fluid cartridges in different groups are not overlapped with each other and are concentric. The control unit can measure and adjust the temperatures of the substrate regions in real time. Because the structure of the heating unit is optimally designed and the control unit is added, the substrate heating apparatus of the present invention can adjust the temperatures of the regions on the substrate in real time, so that the temperatures of the regions on the substrate tend to be consistent, and high substrate heating efficiency and high temperature adjustment response speed are achieved. Further disclosed in another embodiment of the present invention is a substrate drying apparatus.

3. 发明公开

US20240105496A1 SUBSTRATE SUPPORTING APPARATUS 审中-公开
公开(公告)号：US20240105496A1
公开(公告)日：2024-03-28
申请号：US18257973
申请日：2020-12-16
申请人： ACM RESEARCH (SHANGHAI), INC.
发明人： Hui Wang , Feng Liu , Xiaofeng Tao , Shena Jia , Fuping Chen , Haibo Hu , Yang Liu
IPC分类号： H01L21/687 , H01L21/67
CPC分类号： H01L21/68764 , H01L21/6708 , H01L21/6715 , H01L21/68735 , H01L21/68742
摘要： The present invention provides a substrate supporting apparatus having a spin chuck and a plurality of locating pins. The spin chuck configured to support and rotate a substrate has a supporting surface. The locating pins are disposed at the periphery of the supporting surface for limiting the substrate horizontal displacement. The supporting surface defines a first annular region. The first annular region is divided into a plurality of pin regions and a plurality of non-pin regions. The pin regions and the non-pin regions are arranged alternatively in a circumferential direction of the first annular region. Each of the pin regions is corresponding to one locating pin. A plurality of Bernoulli holes are set in the first annular region and is configured as an uneven structure in the first annular region so as to supply stronger gas flow in the pin regions than in the non-pin regions.

4. 发明申请

US20210138513A1 APPARATUS FOR CLEANING SEMICONDUCTOR SUBSTRATES 有权
公开(公告)号：US20210138513A1
公开(公告)日：2021-05-13
申请号：US16491802
申请日：2017-03-06
申请人： ACM Research (Shanghai) Inc.
发明人： Hui Wang , Xiaofeng Tao , Fuping Chen , Shena Jia , Xi Wang , Xiaoyan Zhang , Xuejun Li
IPC分类号： B08B3/12 , H01L21/02
摘要： An apparatus for cleaning semiconductor substrates includes a chamber (101), a chuck (102), a liquid collector (104), an enclosing wall (105), at least one driving mechanism (106), at least one internal dispenser (111), and at least one external dispenser (118). The chamber (101) has a top wall (1011), a side wall (1012) and a bottom wall (1013). The chuck (102) is disposed in the chamber (101) for holding a semiconductor substrate (103). The liquid collector (104) surrounds the chuck (102). The enclosing wall (105) surrounds the liquid collector (104). The at least one driving mechanism (106) drives the enclosing wall (105) to move up and down, wherein when the at least one driving mechanism (106) drives the enclosing wall (105) to move up, a seal room (110) is formed by the liquid collector (104), the enclosing wall (105), the top wall (1011) of the chamber (101), and the bottom wall (1013) of the chamber (101). The at least one internal dispenser (111) is disposed inside the seal room (110). The at least one external dispenser (118) is disposed outside the seal room (110). The at least one external dispenser (118) gets in and out the seal room (110) after the enclosing wall (105) is driven to move down.

5. 发明公开

US20240282644A1 DEVIATION MEASUREMENT DEVICE 审中-公开
公开(公告)号：US20240282644A1
公开(公告)日：2024-08-22
申请号：US18571068
申请日：2022-05-20
申请人： ACM RESEARCH (SHANGHAI), INC.
发明人： Hui Wang , Wenbo Liu , Han Han , Shena Jia , Xiaofeng Tao
IPC分类号： H01L21/66 , H01L21/67 , H01L21/68 , H01L21/687
CPC分类号： H01L22/12 , H01L21/67259 , H01L21/68 , H01L21/68721
摘要： A deviation measurement device, which is used for measuring the deviation between the center (O) of a substrate (W) and a standard center (O′), and comprises a reference arm (101), a moving arm (103) and a first linear module (102), wherein the moving arm (103) is provided with a first positioning claw (104), and the first positioning claw (104) is used for abutting against two points on an edge of the substrate (W); the reference arm (101) is provided with a second positioning claw (105), and the second positioning claw (105) is used for abutting against two points on the edge of the substrate (W); and the moving arm (103) is arranged opposite the reference arm (101). A connecting line between the center (x1) of the first positioning claw (104) and the center (x2) of the second positioning claw (105) is a straight line L, and the straight line L passes through the standard center (O′); the moving arm (103) can translate along the straight line L under the driving of the first linear module (102); and the first positioning claw (104) pushes the substrate (W) until the first positioning claw (104) and the second positioning claw (105) are simultaneously brought into contact with the edge of the substrate, and at this time, the center (O) of the substrate is located on the straight line L. The deviation between the center (O) of the substrate and the standard center (O′) can be calculated according to the coordinates of the reference arm (101) and the coordinates of the moving arm (103). The substrate (W) may be an oval substrate or a circular substrate having a notch or a flat edge.

6. 发明授权

US11498100B2 Apparatus for cleaning semiconductor substrates 有权
公开(公告)号：US11498100B2
公开(公告)日：2022-11-15
申请号：US16491802
申请日：2017-03-06
申请人： ACM Research (Shanghai) Inc.
发明人： Hui Wang , Xiaofeng Tao , Fuping Chen , Shena Jia , Xi Wang , Xiaoyan Zhang , Xuejun Li
IPC分类号： B08B3/12 , H01L21/02 , H01L21/67 , H01L21/76
摘要： An apparatus for cleaning semiconductor substrates including a chamber, a chuck, a liquid collector, an enclosing wall, at least one driving mechanism, at least one internal dispenser, and at least one external dispenser. The chamber has a top wall, a side wall and a bottom wall. The chuck is disposed in the chamber. The liquid collector surrounds the chuck. The enclosing wall surrounds the liquid collector. The driving mechanism drives the enclosing wall to move up and down, wherein when the enclosing wall is driven to move up, a seal room is formed by the liquid collector, the enclosing wall, the top wall and bottom wall of the chamber. The internal dispenser is disposed inside the seal room. The external dispenser is disposed outside the seal room and capable of getting in and out of the seal room after the enclosing wall is driven to move down.

7. 发明公开

US20240347361A1 FLIPPING APPARATUS 审中-公开
公开(公告)号：US20240347361A1
公开(公告)日：2024-10-17
申请号：US18579151
申请日：2022-06-17
申请人： ACM RESEARCH (SHANGHAI), INC.
发明人： He Wang , Yazhou Li , Shena Jia , Xiaofeng Tao , Hui Wang
IPC分类号： H01L21/677 , H01L21/67 , H01L21/68 , H01L21/687
CPC分类号： H01L21/67718 , H01L21/67051 , H01L21/68 , H01L21/68721 , H01L21/68742 , H01L21/68785
摘要： Provided in the present invention is a flipping apparatus, comprising a bracket body, a rotary driver, and a clamping apparatus, a plurality of partition plates being formed on inner side surfaces of two side walls of the bracket body, a carrier slot for the placement of a wafer being formed between each two adjacent partition plates, and rotating shafts being formed on outer side surfaces of the two side walls of the bracket body. The rotary driver is connected to at least one rotating shaft to drive the bracket body to rotate, and the clamping apparatus is disposed on the side wall of the bracket body and is used for pressing or releasing the wafers placed in the carrier slots. In the present invention, by means of the arrangement of the clamping apparatus on the bracket body holding the wafers, the wafers are fixed by the clamping apparatus when the bracket body rotates, effectively avoiding fragments or surface scratches caused by the wafers shaking in the bracket body when the wafers changes posture with the bracket body.

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