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    • 5. 发明授权
    • Reduced jitter amplification methods and apparatuses
    • 减少抖动放大方法和装置
    • US07579905B2
    • 2009-08-25
    • US11714637
    • 2007-03-05
    • Zuoguo Wu
    • Zuoguo Wu
    • G06G7/12
    • H03F1/3211G11C7/02G11C7/22G11C7/225H03F3/45183H03F2203/45342H03F2203/45454H03F2203/45511H03F2203/45626H03F2203/45641
    • Apparatuses, circuits, and methods to amplify signals with reduced jitter are disclosed. Embodiments generally comprise amplifiers coupled with apparatuses that adjust peak frequencies of the amplifiers to reduce jitter. In many system and apparatus embodiments, the frequency gain boosters receive one or more feedback signals derived from input signals applied to the amplifiers. The frequency gain boosters generally respond to the feedback signals by manipulating or controlling active loads coupled to the amplifiers. In controlling the active loads, the frequency gain boosters generally cause the active loads to peak at frequencies at or near the input signals, the result being attenuated jitter in an output signal of the amplifier.
    • 公开了以减少抖动放大信号的装置,电路和方法。 实施例通常包括与调节放大器的峰值频率以减少抖动的装置耦合的放大器。 在许多系统和装置实施例中,频率增益增强器接收从施加到放大器的输入信号导出的一个或多个反馈信号。 频率增益增强器通常通过操纵或控制耦合到放大器的有源负载来响应反馈信号。 在控制有源负载时,频率增益增强器通常使有源负载在输入信号处或附近的频率处达到峰值,结果是在放大器的输出信号中衰减了抖动。
    • 6. 发明申请
    • Reduced jitter amplification methods and apparatuses
    • 减少抖动放大方法和装置
    • US20080218254A1
    • 2008-09-11
    • US11714637
    • 2007-03-05
    • Zuoguo Wu
    • Zuoguo Wu
    • H03B1/00
    • H03F1/3211G11C7/02G11C7/22G11C7/225H03F3/45183H03F2203/45342H03F2203/45454H03F2203/45511H03F2203/45626H03F2203/45641
    • Apparatuses, circuits, and methods to amplify signals with reduced jitter are disclosed. Embodiments generally comprise amplifiers coupled with apparatuses that adjust peak frequencies of the amplifiers to reduce jitter. In many system and apparatus embodiments, the frequency gain boosters receive one or more feedback signals derived from input signals applied to the amplifiers. The frequency gain boosters generally respond to the feedback signals by manipulating or controlling active loads coupled to the amplifiers. In controlling the active loads, the frequency gain boosters generally cause the active loads to peak at frequencies at or near the input signals, the result being attenuated jitter in an output signal of the amplifier.
    • 公开了以减少抖动放大信号的装置,电路和方法。 实施例通常包括与调节放大器的峰值频率以减少抖动的装置耦合的放大器。 在许多系统和装置实施例中,频率增益增强器接收从施加到放大器的输入信号导出的一个或多个反馈信号。 频率增益增强器通常通过操纵或控制耦合到放大器的有源负载来响应反馈信号。 在控制有源负载时,频率增益增强器通常使有源负载在输入信号处或附近的频率处达到峰值,结果是在放大器的输出信号中衰减了抖动。
    • 7. 发明申请
    • INVERTER BASED DUTY CYCLE CORRECTION APPARATUSES AND SYSTEMS
    • 基于变频器的占空比校正装置和系统
    • US20080204097A1
    • 2008-08-28
    • US11680614
    • 2007-02-28
    • Zuoguo Wu
    • Zuoguo Wu
    • H03K3/017
    • H03K5/1565H03K3/356104
    • Apparatuses, circuits, and methods to reduce duty cycle errors are disclosed. Embodiments generally comprise buffer circuits coupled with error detection circuits and correction feedback circuits that sense duty cycles errors in output signals from the buffer circuits, generate error signals, and couple the error signals back to the inputs to correct or reduce the duty cycle errors. The error circuits may comprise active low pass filters in various embodiments, while amplifiers generally comprise inverter buffers or other simple buffers which alter or affect the input signals to the buffer circuits in order to reduce the duty cycle errors. In many system and apparatus embodiments, the error circuits comprise a resistor-capacitor circuit coupled with an inverter buffer. The error detection circuits generally function as active low pass filters and generate error signals for the feedback circuits.
    • 公开了减少占空比误差的装置,电路和方法。 实施例通常包括与错误检测电路和校正反馈电路耦合的缓冲电路,校正反馈电路检测来自缓冲电路的输出信号中的占空比误差,产生误差信号,并将误差信号耦合回输入以校正或减少占空比误差。 在各种实施例中,误差电路可以包括有源低通滤波器,而放大器通常包括反相缓冲器或其它简单缓冲器,其改变或影响到缓冲器电路的输入信号,以便减少占空比误差。 在许多系统和装置实施例中,误差电路包括与反相缓冲器耦合的电阻 - 电容电路。 误差检测电路通常用作有源低通滤波器,并产生反馈电路的误差信号。
    • 10. 发明申请
    • INTERCONNECTION OF A PACKAGED CHIP TO A DIE IN A PACKAGE UTILIZING ON-PACKAGE INPUT/OUTPUT INTERFACES
    • 使用包装输入/输出接口的包装中的包装芯片的互连
    • US20130313709A1
    • 2013-11-28
    • US13994919
    • 2011-12-22
    • Todd A. HinckZuoguo WuAaron MartinAndrew W. MartwickJohn B. Halbert
    • Todd A. HinckZuoguo WuAaron MartinAndrew W. MartwickJohn B. Halbert
    • H01L25/065
    • H01L25/0655G06F13/385H01L23/48H01L23/5383H01L23/66H01L25/115H01L2224/16145H01L2224/16225H01L2224/16227H01L2924/00014H01L2924/15192H01L2924/15311H04B1/40Y02D10/14Y02D10/151H01L2224/0401
    • Apparatuses for interconnecting integrated circuit dies. A first set of single-ended transmitter circuits are included on a first die. The transmitter circuits are impedance matched and have no equalization. A first set of single-ended receiver circuits are included on a second die. The receiver circuits have no termination and no equalization. Conductive lines are coupled between the first set of transmitter circuits and the first set of receiver circuits. The lengths of the conductive lines are matched. The first die, the first set of single-ended transmitter circuits, the second die, the first set of single ended receiver circuits and the conductive lines are disposed within a first package. A second set of single-ended transmitter circuits are included on the first die. The transmitter circuits are impedance matched and have no equalization. Data transmitted from the second set of transmitter circuits is transmitted according to a data bus inversion (DBI) scheme. A second set of single-ended receiver circuits is included on a third die. The receiver circuits have termination. Conductive lines are coupled between the second set of transmitter circuits and the second set of receiver circuits. The lengths of the conductive lines are matched and the second set of receiver circuits is disposed within a second package.
    • 用于互连集成电路管芯的装置。 第一组单端发射机电路包括在第一裸片上。 发射机电路阻抗匹配,无均衡。 第一组单端接收器电路包括在第二管芯上。 接收器电路没有终端,没有均衡。 导电线耦合在第一组发射器电路和第一组接收器电路之间。 导线的长度相匹配。 第一芯片,第一组单端发射机电路,第二芯片,第一组单端接收器电路和导线布置在第一封装内。 第一组芯片包括第二组单端发射机电路。 发射机电路阻抗匹配,无均衡。 根据数据总线反转(DBI)方案发送从第二组发射机电路发送的数据。 第三组裸片包括第二组单端接收机电路。 接收器电路具有端接。 导电线耦合在第二组发射器电路和第二组接收器电路之间。 导线的长度匹配,第二组接收器电路设置在第二封装内。