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    • 1. 发明授权
    • Semiconductor device with (110)-oriented silicon
    • 具有(110)取向硅的半导体器件
    • US08101500B2
    • 2012-01-24
    • US12174030
    • 2008-07-16
    • Qi WangMinhua LiYuri Sokolov
    • Qi WangMinhua LiYuri Sokolov
    • H01L21/30
    • H01L29/7813H01L21/30608H01L21/76254H01L29/045H01L29/407H01L29/41741H01L29/66348H01L29/66363H01L29/66734
    • A method of forming a semiconductor device on a heavily doped P-type (110) semiconductor layer over a metal substrate includes providing a first support substrate and forming a P-type heavily doped (110) silicon layer overlying the first support substrate. At least a top layer of the first support substrate is removable by a selective etching process with respect to the P-type heavily doped (110) silicon layer. A vertical semiconductor device structure is formed in and over the (110) silicon layer. The vertical device structure includes a top metal layer and is characterized by a current conduction in a direction. The method includes bonding a second support substrate to the top metal layer and removing the first support substrate using a mechanical grinding and a selective etching process to expose a surface of the P-type heavily doped (110) silicon layer and to allow a metal layer to be formed on the surface.
    • 在金属衬底上的重掺杂P型(110)半导体层上形成半导体器件的方法包括提供第一支撑衬底并形成覆盖在第一支撑衬底上的P型重掺杂(110)硅层。 至少第一支撑衬底的顶层可通过相对于P型重掺杂(110)硅层的选择性蚀刻工艺而移除。 在(110)硅层中和上方形成垂直半导体器件结构。 垂直装置结构包括顶部金属层,其特征在于沿<110>方向的电流传导。 该方法包括使用机械研磨和选择性蚀刻工艺将第二支撑衬底接合到顶部金属层并去除第一支撑衬底,以暴露P型重掺杂(110)硅层的表面并允许金属层 在表面上形成。
    • 2. 发明申请
    • BPSG FILM DEPOSITION WITH UNDOPED CAPPING
    • BPSG膜沉积与不合适的CAPPING
    • US20110062560A1
    • 2011-03-17
    • US12953258
    • 2010-11-23
    • Yuri Sokolov
    • Yuri Sokolov
    • H01L29/06H01L21/31
    • H01L21/3105H01L21/02129H01L21/02271H01L21/02304H01L21/02362H01L21/31144H01L21/31612H01L21/31625H01L21/76828H01L21/76829
    • Semiconductor devices containing a CVD BPSG layer and an undoped CVD oxide cap layer are described. The cap layer can be any silicon oxide material with a thickness between about 50 Å and about 350 Å. The cap layer may be formed using a low temperature CVD process that is controlled for density by adjusting the amount of silicon precursor in the gas-phase. In some embodiments, the cap layer is deposited on the BPSG layer followed immediately by the BPSG film deposition prior to any annealing of the BPSG layer. The cap layer may prevent dopant out-diffusion and/or out-gassing during storage and high-temperature annealing, and moisture penetration into the BPSG layer, as well as suppress defect nucleation on the as-deposited BPSG surface and defect formation during high temperature annealing, while still allowing flow ability of the BPSG layer. Other embodiments are also described.
    • 描述了包含CVD BPSG层和未掺杂的CVD氧化物覆盖层的半导体器件。 盖层可以是厚度在约和之间的任何氧化硅材料。 可以使用通过调节气相中硅前体的量来控制密度的低温CVD工艺来形成覆盖层。 在一些实施例中,在BPSG层的任何退火之前,将盖层沉积在BPSG层上,随后通过BPSG膜沉积。 盖层可以防止在储存和高温退火期间的掺杂剂扩散和/或排出气体,以及水分渗透到BPSG层中,并且抑制沉积的BPSG表面上的缺陷成核和高温下的缺陷形成 退火,同时仍然允许BPSG层的流动能力。 还描述了其它实施例。
    • 3. 发明申请
    • SEMICONDUCTOR DEVICE WITH (110)-ORIENTED SILICON
    • 具有(110) - 导电硅的半导体器件
    • US20090179259A1
    • 2009-07-16
    • US12174030
    • 2008-07-16
    • QI WANGMinhua LiYuri Sokolov
    • QI WANGMinhua LiYuri Sokolov
    • H01L29/78H01L21/36
    • H01L29/7813H01L21/30608H01L21/76254H01L29/045H01L29/407H01L29/41741H01L29/66348H01L29/66363H01L29/66734
    • A method of forming a semiconductor device on a heavily doped P-type (110) semiconductor layer over a metal substrate includes providing a first support substrate and forming a P-type heavily doped (110) silicon layer overlying the first support substrate. At least a top layer of the first support substrate is removable by a selective etching process with respect to the P-type heavily doped (110) silicon layer. A vertical semiconductor device structure is formed in and over the (110) silicon layer. The vertical device structure includes a top metal layer and is characterized by a current conduction in a direction. The method includes bonding a second support substrate to the top metal layer and removing the first support substrate using a mechanical grinding and a selective etching process to expose a surface of the P-type heavily doped (110) silicon layer and to allow a metal layer to be formed on the surface
    • 在金属衬底上的重掺杂P型(110)半导体层上形成半导体器件的方法包括提供第一支撑衬底并形成覆盖在第一支撑衬底上的P型重掺杂(110)硅层。 至少第一支撑衬底的顶层可通过相对于P型重掺杂(110)硅层的选择性蚀刻工艺而移除。 在(110)硅层中和上方形成垂直半导体器件结构。 垂直装置结构包括顶部金属层,其特征在于沿<110>方向的电流传导。 该方法包括使用机械研磨和选择性蚀刻工艺将第二支撑衬底接合到顶部金属层并去除第一支撑衬底,以暴露P型重掺杂(110)硅层的表面并允许金属层 在表面上形成
    • 4. 发明申请
    • SEMICONDUCTOR DEVICE WITH (110)-ORIENTED SILICON
    • 具有(110) - 导电硅的半导体器件
    • US20120086051A1
    • 2012-04-12
    • US13328179
    • 2011-12-16
    • Qi WangMinhua LiYuri Sokolov
    • Qi WangMinhua LiYuri Sokolov
    • H01L29/78
    • H01L29/7813H01L21/30608H01L21/76254H01L29/045H01L29/407H01L29/41741H01L29/66348H01L29/66363H01L29/66734
    • A vertical semiconductor device includes a bottom metal layer and a first P-type semiconductor layer overlying the bottom metal layer. The first P-type semiconductor layer is characterized by a surface crystal orientation of (110) and a first conductivity. The first P-type semiconductor layer is heavily doped. The vertical semiconductor device also includes a second P-type semiconductor layer overlying the first P-type semiconductor layer. The second semiconductor layer has a surface crystal orientation of (110) and is characterized by a lower conductivity than the first conductivity. The vertical semiconductor device also has a top metal layer overlying the second P-type semiconductor layer. A current conduction from the top metal layer to the bottom metal layer and through the second p-type semiconductor layer is characterized by a hole mobility along a crystalline orientation and on (110) crystalline plane.
    • 垂直半导体器件包括底金属层和覆盖底部金属层的第一P型半导体层。 第一P型半导体层的特征在于(110)的表面晶体取向和第一导电性。 第一P型半导体层是重掺杂的。 垂直半导体器件还包括覆盖第一P型半导体层的第二P型半导体层。 第二半导体层具有(110)的表面晶体取向,其特征在于比第一导电性低的导电性。 垂直半导体器件还具有覆盖第二P型半导体层的顶部金属层。 从顶部金属层到底部金属层和通过第二p型半导体层的电流传导的特征在于沿着<110>晶体取向和在(110)晶面上的空穴迁移率。
    • 5. 发明申请
    • BPSG FILM DEPOSITION WITH UNDOPED CAPPING
    • BPSG膜沉积与不合适的CAPPING
    • US20090250793A1
    • 2009-10-08
    • US12099348
    • 2008-04-08
    • Yuri Sokolov
    • Yuri Sokolov
    • H01L23/58H01L21/31
    • H01L21/3105H01L21/02129H01L21/02271H01L21/02304H01L21/02362H01L21/31144H01L21/31612H01L21/31625H01L21/76828H01L21/76829
    • Semiconductor devices containing a CVD BPSG layer and an undoped CVD oxide cap layer are described. The cap layer can be any silicon oxide material with a thickness between about 50 Å and about 350 Å. The cap layer may be formed using a low temperature CVD process that is controlled for density by adjusting the amount of silicon precursor in the gas-phase. In some embodiments, the cap layer is deposited on the BPSG layer followed immediately by the BPSG film deposition prior to any annealing of the BPSG layer. The cap layer may prevent dopant out-diffusion and/or out-gassing during storage and high-temperature annealing, and moisture penetration into the BPSG layer, as well as suppress defect nucleation on the as-deposited BPSG surface and defect formation during high temperature annealing, while still allowing flow ability of the BPSG layer. Other embodiments are also described.
    • 描述包含CVD BPSG层和未掺杂的CVD氧化物覆盖层的半导体器件。 盖层可以是厚度在约和之间的任何氧化硅材料。 可以使用通过调节气相中硅前体的量来控制密度的低温CVD工艺来形成覆盖层。 在一些实施例中,在BPSG层的任何退火之前,将盖层沉积在BPSG层上,随后通过BPSG膜沉积。 盖层可以防止在储存和高温退火期间的掺杂剂扩散和/或排出气体,以及水分渗透到BPSG层中,并且抑制沉积的BPSG表面上的缺陷成核和高温下的缺陷形成 退火,同时仍然允许BPSG层的流动能力。 还描述了其它实施例。
    • 6. 发明申请
    • METHOD AND APPARATUS FOR THE COLLECTION OF PHYSIOLOGICAL ELECTRICAL POTENTIALS
    • 收集生理电位的方法和装置
    • US20070179391A1
    • 2007-08-02
    • US11686549
    • 2007-03-15
    • Isaac KURTZYuri SOKOLOV
    • Isaac KURTZYuri SOKOLOV
    • A61B5/04
    • A61B5/0476A61B5/04004A61B5/0428A61B5/0488A61B5/6843
    • An apparatus, method and system for collection of physiological electrical potential signals. In one embodiment, an apparatus for use in measuring electrical potentials in a subject (e.g. an animal or a human), having an amplifier being removably mountable to a ground electrode and electrically coupled to at least two signal electrodes, wherein the amplifier is configured to communicate with a signal processing device and indicate if one of the at least two signal electrodes is poorly affixed to, or detached from, said subject. In another embodiment, the at least two signal electrodes comprise a first signal electrode and a second signal electrode, and the amplifier is configured to detect differential electrical potential signals presented by the first signal electrode and the second signal electrode, amplify the differential electrical potential signals by a predetermined gain level to generate an amplified signal, and transmit the amplified signal to the signal processing device.
    • 用于收集生理电位信号的装置,方法和系统。 在一个实施例中,一种用于测量受试者(例如,动物或人)中的电位的装置,具有可移除地安装到接地电极并电耦合到至少两个信号电极的放大器,其中放大器被配置为 与信号处理装置通信,并且指示所述至少两个信号电极中的一个是否不良地附着于所述被摄体或从所述被摄体分离。 在另一个实施例中,至少两个信号电极包括第一信号电极和第二信号电极,并且放大器被配置为检测由第一信号电极和第二信号电极呈现的差分电位信号,放大差分电位信号 通过预定的增益电平来产生放大的信号,并将放大的信号发送到信号处理装置。
    • 9. 发明申请
    • Method of geometric harmonic signal modulation
    • 几何谐波信号调制方法
    • US20070081600A1
    • 2007-04-12
    • US10578116
    • 2004-10-07
    • Yuri SokolovValery Saharov
    • Yuri SokolovValery Saharov
    • H04L27/00
    • H04L27/18H04B3/542H04B2203/542H04B2203/5433H04B2203/5458H04L27/28
    • The invention relates to electrical network communications engineering and can be used for automatic data acquisition from intrusion and fire-alarm sensors, electric meters, heat, water and gas consumption meters and from the fiscal memory of cash control monitors. Said invention makes it possible to substentially reduce the energy consumption by the slave nodes of a system and/or increase the range of action thereof. In order to encode each symbol of transmitted data, a random or pseudorandom set of differences of initial pairs of nearest harmonic pairs are used. Said difference sets of the initial phases are selected in such a way that the peak factor of an added signal is minimised. When a fire-alarm sensor is actuated, it is sufficient to transmit only one symbol to an alarm panel which, unambiguously identifies the location of the active sensor and as a rule is embodied in the form of a conventional number or address pre-allocated to said sensor.
    • 本发明涉及电网通信工程,可用于从入侵和火灾报警传感器,电表,热水,水和气体消耗量表以及现金控制监视器的财务记录中进行自动数据采集。 所述发明使得可以可靠地降低系统的从节点的能量消耗和/或增加其作用范围。 为了对发送数据的每个符号进行编码,使用最初对的最近谐波对的随机或伪随机差分集合。 所述初始相位的差值集合被选择为使得附加信号的峰值因子最小化。 当启动火灾报警传感器时,仅将一个符号传输到报警面板就足够了,该报警面板明确地标识有源传感器的位置,并且通常以预先分配给的传统数字或地址的形式来体现 传感器。