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    • 1. 发明授权
    • Method for multi-step temperature control of a substrate
    • 基板多步温度控制方法
    • US07952049B2
    • 2011-05-31
    • US11929288
    • 2007-10-30
    • Yuji Tsukamoto
    • Yuji Tsukamoto
    • B23K10/00
    • H01L21/67103H01L21/67109
    • A method of changing the temperature of a substrate during processing of the substrate includes providing the substrate on a substrate holder, the substrate holder including a temperature controlled substrate support for supporting the substrate, a temperature controlled base support for supporting the substrate support and a thermal insulator interposed between the temperature controlled substrate support and the temperature controlled base support. The method further includes setting the temperature of the base support to a first base temperature corresponding to a first processing temperature of said substrate, setting the substrate support to a first support temperature corresponding to said first processing temperature of said substrate, setting the temperature of the base support to a second base temperature corresponding to a second processing temperature of said substrate, and setting the substrate support to a second support temperature corresponding to said second processing temperature of said substrate.
    • 在衬底处理期间改变衬底的温度的方法包括在衬底保持器上设置衬底,衬底保持器包括用于支撑衬底的温度控制的衬底支撑件,用于支撑衬底支撑件的温度受控的底座支撑件和热 介于温度控制的基板支架和温度控制的基座支架之间的绝缘体。 该方法还包括将基座支撑件的温度设定为与所述基板的第一处理温度相对应的第一基座温度,将基板支撑件设置为对应于所述基板的所述第一处理温度的第一支撑温度, 基底支撑件对应于所述基板的第二处理温度的第二基板温度,以及将所述基板支撑件设置为对应于所述基板的所述第二处理温度的第二支撑温度。
    • 3. 发明申请
    • METHOD FOR MULTI-STEP TEMPERATURE CONTROL OF A SUBSTRATE
    • 一种基板多级温度控制方法
    • US20080073335A1
    • 2008-03-27
    • US11929288
    • 2007-10-30
    • Yuji TSUKAMOTO
    • Yuji TSUKAMOTO
    • H05B3/20
    • H01L21/67103H01L21/67109
    • A method of changing the temperature of a substrate during processing of the substrate includes providing the substrate on a substrate holder, the substrate holder including a temperature controlled substrate support for supporting the substrate, a temperature controlled base support for supporting the substrate support and a thermal insulator interposed between the temperature controlled substrate support and the temperature controlled base support. The method further includes setting the temperature of the base support to a first base temperature corresponding to a first processing temperature of said substrate, setting the substrate support to a first support temperature corresponding to said first processing temperature of said substrate, setting the temperature of the base support to a second base temperature corresponding to a second processing temperature of said substrate, and setting the substrate support to a second support temperature corresponding to said second processing temperature of said substrate.
    • 在衬底处理期间改变衬底的温度的方法包括在衬底保持器上设置衬底,衬底保持器包括用于支撑衬底的温度控制的衬底支撑件,用于支撑衬底支撑件的温度受控的底座支撑件和热 介于温度控制的基板支架和温度控制的基座支架之间的绝缘体。 该方法还包括将基座支撑件的温度设定为与所述基板的第一处理温度相对应的第一基座温度,将基板支撑件设置为对应于所述基板的所述第一处理温度的第一支撑温度, 基底支撑件对应于所述基板的第二处理温度的第二基板温度,以及将所述基板支撑件设置为对应于所述基板的所述第二处理温度的第二支撑温度。
    • 4. 发明授权
    • Method for multi-step temperature control of a substrate
    • 基板多步温度控制方法
    • US07297894B1
    • 2007-11-20
    • US11526119
    • 2006-09-25
    • Yuji Tsukamoto
    • Yuji Tsukamoto
    • B23K10/00
    • H01L21/67103H01L21/67109
    • A method of changing the temperature of a substrate during processing of the substrate includes providing the substrate on a substrate holder, the substrate holder including a temperature controlled substrate support for supporting the substrate, a temperature controlled base support for supporting the substrate support and a thermal insulator interposed between the temperature controlled substrate support and the temperature controlled base support. The method further includes setting the temperature of the base support to a first base temperature corresponding to a first processing temperature of the substrate, setting the substrate support to a first support temperature corresponding to the first processing temperature of the substrate, setting the temperature of the base support to a second base temperature corresponding to a second processing temperature of the substrate, and setting the substrate support to a second support temperature corresponding to the second processing temperature of the substrate.
    • 在衬底处理期间改变衬底的温度的方法包括在衬底保持器上设置衬底,衬底保持器包括用于支撑衬底的温度控制的衬底支撑件,用于支撑衬底支撑件的温度受控的底座支撑件和热 介于温度控制的基板支架和温度控制的基座支架之间的绝缘体。 该方法还包括将基底支撑件的温度设定为与衬底的第一处理温度相对应的第一基底温度,将衬底支撑件设置为对应于衬底的第一处理温度的第一支撑温度, 基底支撑件对应于对应于衬底的第二处理温度的第二基底温度,以及将衬底支撑件设置为对应于衬底的第二处理温度的第二支撑温度。