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    • 7. 发明申请
    • METHOD FOR MANUFACTURING AN ARTIFICIAL LIGHTWEIGHT AGGREGATE CONTAINING BOTTOM ASH
    • 用于制造包含底部灰尘的人造光聚集体的方法
    • US20090325781A1
    • 2009-12-31
    • US12298027
    • 2007-04-03
    • Young Ho Jeong
    • Young Ho Jeong
    • C04B33/00B29C47/00
    • C04B18/023C04B33/025C04B33/135C04B33/32C04B35/6263C04B2235/3201C04B2235/3206C04B2235/3208C04B2235/3232C04B2235/3244C04B2235/3272C04B2235/5427C04B2235/5445C04B2235/6021C04B2235/72C04B2235/727C04B2235/77Y02P40/69Y02W30/92C04B14/28C04B18/06C04B18/08
    • The present invention relates to a method for producing an artificial lightweight aggregate containing bottom ash, and more particularly to a method for producing an artificial lightweight aggregate containing bottom ash, the method comprises the steps of: (a) mixing 100 parts by weight of clay and 10-100 parts by weight of bottom ash to obtain a mixture; (b) extrusion-molding the mixture by using an extruder and cutting the extrusion-molded mixture to form a molded article; (c) drying the molded article by using a rotary drier; and (d) Sintering the dried article at 1050-1150° C. for 15-45 minutes to produce the artificial lightweight aggregate. The lightweight aggregate according to the present invention is produced by mixing bottom ash that did not satisfy a desired physical property of an aggregate with clay and dust in an optimum mixture ratio, so that the problem that there is a great deviation in water absorptions of a lightweight aggregates that are mass produced using existing fly ash was solved so as to reduce a deviation in water absorptions depending on a change in the amount of raw material added during mass production, thereby making it possible to produce an artificial lightweight aggregate having uniform water absorption. In addition, bottom ash that was difficult to dispose is disposed in a large quantity and thus the cost required for installation of an ash pond is reduced and the bottom ash is recycled so that the produced artificial lightweight aggregate is economically efficient. Also, it is possible to solve environment-related problems.
    • 本发明涉及一种生产含有底灰的人造轻质骨料的方法,更具体地说,涉及一种含有底灰的人造轻骨料的制造方法,该方法包括以下步骤:(a)将100重量份的粘土 和10-100重量份的底灰,得到混合物; (b)使用挤出机挤压成型该混合物并切割挤出模制的混合物以形成模塑制品; (c)使用旋转干燥器干燥模塑制品; 和(d)将干燥物品在1050-1150℃下烧结15-45分钟以制备人造轻质骨料。 根据本发明的轻质骨料通过将不满足骨料的所需物理性质的底灰与粘土和粉尘以最佳混合比混合而制备,使得存在着大量的吸水偏差 解决了使用现有的飞灰大量生产的轻质聚集体,以便根据批量生产中添加的原料量的变化减少吸水偏差,从而可以制造具有均匀吸水性的人造轻质骨料 。 此外,难以处置的底灰被大量排放,因此灰渣的安装所需的成本降低,并且底灰再循环,使得生产的人造轻质骨料在经济上是有效的。 另外,可以解决与环境有关的问题。
    • 10. 发明申请
    • METHOD OF PRODUCING THIN FILM TRANSISTOR SUBSTRATE
    • 生产薄膜晶体管基板的方法
    • US20080093334A1
    • 2008-04-24
    • US11874098
    • 2007-10-17
    • Seung-ha ChoiSang-gab KimMin-seok OhShin-il ChoiDae-ok KimHong-kee ChinYoung-ho JeongYu-gwang Jeong
    • Seung-ha ChoiSang-gab KimMin-seok OhShin-il ChoiDae-ok KimHong-kee ChinYoung-ho JeongYu-gwang Jeong
    • H01B13/00
    • H01L27/1288H01L27/1214
    • A method of producing a thin film transistor substrate to prevent an interconnection from being corroded during a dry etching process includes sequentially forming on an insulating substrate a gate interconnection, a gate insulating layer, an active layer, a conductive layer for a data interconnection, and a photoresist pattern including a first region and a second region, etching the conductive layer for the data interconnection using the photoresist pattern as an etching mask to form a conductive layer pattern for source/drain electrodes, etching the active layer using the photoresist pattern as the etching mask to form an active layer pattern, removing the second region of the photoresist pattern, dry etching the conductive layer pattern for the source/drain electrodes under the second region using the photoresist pattern as the etching mask and etching gas, etching a portion of the active layer pattern using the photoresist pattern as the etching mask, and physically removing the reaction byproduct using a reaction byproduct removal agent so that external force is applied to the etching gas and the reaction byproduct of the conductive layer pattern for the source/drain electrodes.
    • 制造薄膜晶体管基板以防止在干法蚀刻工艺中被互连的腐蚀的方法包括:在绝缘基板上依次形成栅极互连,栅极绝缘层,有源层,用于数据互连的导电层,以及 包括第一区域和第二区域的光致抗蚀剂图案,使用光致抗蚀剂图案蚀刻用于数据互连的导电层作为蚀刻掩模,以形成用于源/漏电极的导电层图案,使用光致抗蚀剂图案蚀刻活性层作为 蚀刻掩模以形成有源层图案,去除光致抗蚀剂图案的第二区域,使用光致抗蚀剂图案作为蚀刻掩模和蚀刻气体,在第二区域下干蚀刻用于源/漏电极的导电层图案,蚀刻部分 使用光致抗蚀剂图案作为蚀刻掩模的有源层图案,并物理去除r 使用反应副产物除去剂的副产物使得外力施加到蚀刻气体和用于源/漏电极的导电层图案的反应副产物。