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1. 发明授权

US08691685B2 Prevention and control of intermetallic alloy inclusions that form during reflow of Pb free, Sn rich, solders in contacts in microelectronic packaging in integrated circuit contact structures where electroless Ni(P) metallization is present 有权
标题翻译：预防和控制在无铅Ni（P）金属化的集成电路接触结构中的无铅，富含Sn的焊料在微电子封装的接触中形成的金属间合金夹杂物
公开(公告)号：US08691685B2
公开(公告)日：2014-04-08
申请号：US11657000
申请日：2007-01-23
申请人： Sung Kwon Kang , Da-Yuan Shih , Yoon-Chul Son
发明人： Sung Kwon Kang , Da-Yuan Shih , Yoon-Chul Son
IPC分类号： H01L21/44
CPC分类号： H01L24/11 , H01L2224/13099 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H05K3/3463
摘要： In using Ni(P) and Sn-rich solders in Pb free interconnections, the prevention and control of the formation of intermetallic compound inclusions can be achieved through a reaction-preventative or control layer that is positioned on top of an electroless Ni(P) metallization, such as by application of a thin layer of Sn on the Ni(P) or through the application of a thin layer of Cu on the Ni(P).
摘要翻译：在无铅互连中使用Ni（P）和富Sn焊料时，可以通过位于无电Ni（P）的顶部的反应预防或控制层来实现金属间化合物夹杂物形成的预防和控制，金属化，例如通过在Ni（P）上施加薄层的Sn或通过在Ni（P）上施加薄的Cu层）。

2. 发明申请

US20130222510A1 RESISTANCE HEATING COMPOSITION, HEATING COMPOSITE USING THE COMPOSITION, METHOD OF PREPARING THE HEATING COMPOSITE, AND HEATING APPARATUS AND FUSING APPARATUS USING THE SAME 有权
标题翻译：电阻加热组合物，使用组合物的加热复合物，加热复合材料的制备方法，加热装置和使用该加热装置的加热装置
公开(公告)号：US20130222510A1
公开(公告)日：2013-08-29
申请号：US13565510
申请日：2012-08-02
申请人： Dong-ouk KIM , Dong-earn KIM , Ha-Jin KIM , Sung-hoon PARK , Min-jong BAE , Yoon-chul SON , Sang-eui LEE , Kun-mo CHU , In-taek HAN
发明人： Dong-ouk KIM , Dong-earn KIM , Ha-Jin KIM , Sung-hoon PARK , Min-jong BAE , Yoon-chul SON , Sang-eui LEE , Kun-mo CHU , In-taek HAN
IPC分类号： H01B1/04 , B41J2/435 , H01B13/00 , H05B3/20 , B82Y30/00
CPC分类号： B82Y30/00 , B41J2/435 , G03G13/20 , G03G15/206 , G03G2215/2054 , H01B1/24 , H05B3/14 , H05B3/26 , H05B2214/04
摘要： A resistance heating composition including a silicon emulsion particle, a carbon nanotube, and an aqueous medium.
摘要翻译：一种电阻加热组合物，包括硅乳液颗粒，碳纳米管和水性介质。

3. 发明授权

US08314539B2 Field electron emitter including nucleic acid-coated carbon nanotube and method of manufacturing the same 有权
标题翻译：包括核酸包被碳纳米管的场电子发射体及其制造方法
公开(公告)号：US08314539B2
公开(公告)日：2012-11-20
申请号：US12533144
申请日：2009-07-31
申请人： Yoon-chul Son , Yong-chul Kim , Jeong-na Heo , Byeong-kwon Ju
发明人： Yoon-chul Son , Yong-chul Kim , Jeong-na Heo , Byeong-kwon Ju
IPC分类号： H01J1/00 , H01J9/00
CPC分类号： H01J9/025 , H01J1/304 , H01J29/04 , H01J31/127 , H01J63/02 , H01J2201/30469 , H01J2235/062 , H01J2235/068 , H01J2329/0455
摘要： A field electron emitter includes a thin film layer including a carbon nanotube (“CNT”) disposed on a substrate, wherein the thin film layer includes nucleic acid.
摘要翻译：场电子发射器包括薄膜层，其包括设置在基板上的碳纳米管（CNT），其中薄膜层包括核酸。

4. 发明申请

US20120207525A1 RESISTANCE HEATING COMPOSITION AND HEATING COMPOSITE, HEATING APPARATUS, AND FUSING APPARATUS, INCLUDING RESISTANCE HEATING COMPOSITION 审中-公开
标题翻译：电阻加热组合物和加热复合材料，加热装置和加热装置，包括电阻加热组合物
公开(公告)号：US20120207525A1
公开(公告)日：2012-08-16
申请号：US13372140
申请日：2012-02-13
申请人： Dong-ouk KIM , Ha-Jin KIM , In-taek HAN , Yoon-chul SON , Sang-soo JEE , Dong-earn KIM , Sang-eui LEE , Kun-mo CHU
发明人： Dong-ouk KIM , Ha-Jin KIM , In-taek HAN , Yoon-chul SON , Sang-soo JEE , Dong-earn KIM , Sang-eui LEE , Kun-mo CHU
IPC分类号： G03G15/20 , C09K5/10 , H05B3/10 , H05B3/46 , B82Y30/00
CPC分类号： G03G15/2057 , B82Y30/00 , C09K5/14 , H05B3/145 , H05B2214/04
摘要： A resistance heating composition including carbon nanotubes, an ionic liquid, and a binder resin.
摘要翻译：包括碳纳米管，离子液体和粘合剂树脂的电阻加热组合物。

5. 发明申请

US20100159331A1 NEGATIVE ACTIVE MATERIAL, NEGATIVE ELECTRODE INCLUDING THE SAME, METHOD OF MANUFACTURING THE NEGATIVE ELECTRODE, AND LITHIUM BATTERY INCLUDING THE NEGATIVE ELECTRODE 审中-公开
标题翻译：负极活性材料，包括它们的负极，负极电极的制造方法以及包括负极的锂电池
公开(公告)号：US20100159331A1
公开(公告)日：2010-06-24
申请号：US12575031
申请日：2009-10-07
申请人： Jeong-hee Lee , In-taek Han , Yoon-chul Son , Ho-suk Kang , Jeong-na Heo , Joon-won Bae
发明人： Jeong-hee Lee , In-taek Han , Yoon-chul Son , Ho-suk Kang , Jeong-na Heo , Joon-won Bae
IPC分类号： H01B1/04 , H01M4/58 , B05D5/12
CPC分类号： H01B1/24 , H01M4/133 , H01M4/587 , H01M10/0525
摘要： A negative active material, a negative electrode including the negative active material, a method of manufacturing the negative electrode, and a lithium battery including the negative electrode. The negative active material includes a composite including a non-carbonaceous material, carbon nanotubes (CNTs), and carbon nanoparticles. The carbon nanoparticles are formed by carbonizing a polymer of carbonizable monomers.
摘要翻译：负极活性物质，包含负极活性物质的负极，负极的制造方法以及包含该负极的锂电池。负极活性材料包括包含非碳质材料，碳纳米管（CNT）和碳纳米颗粒的复合材料。碳纳米颗粒通过碳化可碳化单体的聚合物形成。

6. 发明申请

US20090166511A1 IMAGE SENSOR MODULE HAVING ELECTRIC COMPONENT AND FABRICATION METHOD THEREOF 有权
标题翻译：具有电气元件的图像传感器模块及其制造方法
公开(公告)号：US20090166511A1
公开(公告)日：2009-07-02
申请号：US12185910
申请日：2008-08-05
申请人： Jong-oh KWON , Yoon-chul Son , Kyu-dong Jung , Woon-bae Kim
发明人： Jong-oh KWON , Yoon-chul Son , Kyu-dong Jung , Woon-bae Kim
IPC分类号： G01J1/44
CPC分类号： G01J1/02 , G01J1/0204 , G01J1/0219 , G01J1/0271 , G01J1/04 , G01J1/0411 , H01L27/14618 , H01L27/14625 , H01L2924/0002 , H04N5/2253 , H04N5/2254 , H04N5/2257 , H01L2924/00
摘要： An image sensor module capable of facilitating an electrical and mechanical connection of an electric component and a fabrication thereof are disclosed. The image sensor module includes a sensor chip; at least one lens disposed above the sensor chip; at least one electric component disposed with respect to the at least one lens to adjust optical characteristics of the at least one lens; a housing accommodating and closing up the sensor chip, the at least one lens and the at least one electric component, and having an opening to expose the at least one lens to an outside thereof; and a wiring part longitudinally disposed on an inner surface of the housing, and including at least one conducting wire having a first connecting terminal exposed to the outside of the housing to allow the at least one conducting wire to electrically connect a terminal pad of the at least one electric component with an external electronic device and a second connecting terminal connected to the terminal pad of the at least one electric component.
摘要翻译：公开了能够促进电气部件的电气和机械连接及其制造的图像传感器模块。图像传感器模块包括传感器芯片; 设置在所述传感器芯片上方的至少一个透镜; 相对于所述至少一个透镜布置的至少一个电气部件，以调节所述至少一个透镜的光学特性; 容纳和封闭传感器芯片的壳体，所述至少一个透镜和所述至少一个电气部件，并且具有用于将所述至少一个透镜暴露于其外部的开口; 以及纵向设置在所述壳体的内表面上的布线部分，并且包括至少一个导线，其具有暴露于所述壳体的外部的第一连接端子，以允许所述至少一根导线电连接所述壳体的端子垫至少一个具有外部电子设备的电气部件和连接到所述至少一个电气部件的端子焊盘的第二连接端子。

7. 发明申请

US20070199826A1 Method for manufacturing metal/carbon nanotube nano-composite using electroplating 审中-公开
标题翻译：使用电镀制造金属/碳纳米管纳米复合材料的方法
公开(公告)号：US20070199826A1
公开(公告)日：2007-08-30
申请号：US11589305
申请日：2006-10-30
申请人： Yoon-Chul Son , Jung-Joon Yoo , Jin Yu
发明人： Yoon-Chul Son , Jung-Joon Yoo , Jin Yu
IPC分类号： C25D3/56
CPC分类号： C25D15/02
摘要： Disclosed herein is a method for manufacturing metal/carbon nanotube nano-composite using electroplating, more particularly, to a method for manufacturing metal/carbon nanotube nano-composite comprising: adding carbon nanotubes and cationic surfactants in metal plating solution including metal or metal salt and performing electroplating in the cathode.According to the present invention, the method for manufacturing metal/carbon nanotube nano-composite using electroplating comprises: immersing carbon nanotubes in acid solution and filtering the solution and carrying out heat treatment; adding the heat treated carbon nanotubes and cationic surfactants in metal plating solution including metal or metal salt and dispersing the carbon nanotubes; and providing a cathode and an anode in the metal plating solution including the carbon nanotubes and the cationic surfactant, to which current is applied and carrying out electroplating in order to obtain metal/carbon nanotube nano-composite(complex material).
摘要翻译：本文公开了一种使用电镀制造金属/碳纳米管纳米复合材料的方法，更具体地说，涉及一种金属/碳纳米管纳米复合材料的制造方法，其特征在于，包括：在包括金属或金属盐的金属电镀溶液中添加碳纳米管和阳离子表面活性剂，在阴极进行电镀。根据本发明，使用电镀制造金属/碳纳米管纳米复合物的方法包括：将碳纳米管浸入酸溶液中并过滤溶液并进行热处理; 将热处理的碳纳米管和阳离子表面活性剂加入包括金属或金属盐在内的金属电镀溶液中并分散碳纳米管; 并在包括碳纳米管和阳离子表面活性剂的金属电镀溶液中提供阴极和阳极，向其施加电流并进行电镀以获得金属/碳纳米管纳米复合材料（复合材料）。

8. 发明申请

US20060024943A1 Prevention and control of intermetallic alloy inclusions that form during reflow of Pb free, Sn rich, solders in contacts in microelectronic packaging in integrated circuit contact structures where electroless Ni(P) metallization is present 审中-公开
标题翻译：预防和控制在无铅Ni（P）金属化的集成电路接触结构中的无铅，富含Sn的焊料在微电子封装的接触中形成的金属间合金夹杂物
公开(公告)号：US20060024943A1
公开(公告)日：2006-02-02
申请号：US10903365
申请日：2004-07-30
申请人： Sung Kang , Da-Yuan Shih , Yoon-Chul Son
发明人： Sung Kang , Da-Yuan Shih , Yoon-Chul Son
IPC分类号： H01L21/44
CPC分类号： H01L24/11 , H01L2224/13099 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H05K3/3463
摘要： In using Ni(P) and Sn-rich solders in Pb free interconnections, the prevention and control of the formation of intermetallic compound inclusions, can be achieved through a reaction preventive or control layer that is positioned on top of an electroless Ni(P) metallization, such as by application of a thin layer of Sn on the Ni(P) or through the application of a thin layer of Cu on the Ni(P
摘要翻译：在无铅互连中使用Ni（P）和富含Sn的焊料，可以通过位于无电Ni（P）的顶部的反应预防或控制层来实现金属间化合物夹杂物形成的预防和控制，例如通过在Ni（P）上施加Sn的薄层，或者通过在Ni（P）上施加薄层的Cu，

9. 发明授权

US08593049B2 Field electron emitter, field electron emission device including the same, and method of manufacturing the field electron emitter 有权
标题翻译：场电子发射体，包括其的场电子发射装置以及制造场电子发射体的方法
公开(公告)号：US08593049B2
公开(公告)日：2013-11-26
申请号：US12562470
申请日：2009-09-18
申请人： Yoon-chul Son , Yong-chul Kim , Jeong-na Heo , Woo-sung Cho , Byeong-kwon Ju
发明人： Yoon-chul Son , Yong-chul Kim , Jeong-na Heo , Woo-sung Cho , Byeong-kwon Ju
IPC分类号： H01J1/304
CPC分类号： H01J9/025 , H01J1/304 , H01J2201/30449 , H01J2201/30469 , H01J2329/0442 , H01J2329/0455
摘要： A field electron emitter including a metal electrode; and a plurality of carbon nanotubes, wherein a portion of the plurality of carbon nanotubes protrude from a surface of the metal electrode and a portion of the plurality of carbon nanotubes are in the metal electrode. Also disclosed is a field electron emission device including the field electron emitter and a method of manufacturing the field electron emitter.
摘要翻译：包括金属电极的场电子发射体; 和多个碳纳米管，其中所述多个碳纳米管的一部分从所述金属电极的表面突出，并且所述多个碳纳米管的一部分在所述金属电极中。还公开了包括场电子发射体的场电子发射装置和制造场电子发射体的方法。

10. 发明授权

US08517249B2 Soldering structure and method using Zn 有权
标题翻译：焊接结构及其使用方法
公开(公告)号：US08517249B2
公开(公告)日：2013-08-27
申请号：US11872066
申请日：2007-10-15
申请人： Won-kyoung Choi , Chang-youl Moon , Yoon-chul Son , Young-ho Kim , Hee-ra Roh , Chang-yul Oh
发明人： Won-kyoung Choi , Chang-youl Moon , Yoon-chul Son , Young-ho Kim , Hee-ra Roh , Chang-yul Oh
IPC分类号： B23K35/14
CPC分类号： B23K1/0016 , B23K35/262 , B23K35/282 , B23K2101/42 , H01L24/11 , H01L2224/05001 , H01L2224/0501 , H01L2224/05011 , H01L2224/05023 , H01L2224/05111 , H01L2224/05118 , H01L2224/05139 , H01L2224/05147 , H01L2224/05568 , H01L2224/05572 , H01L2224/05573 , H01L2224/05611 , H01L2224/05639 , H01L2224/05647 , H01L2224/1134 , H05K3/244 , H05K3/3463 , Y10T428/12493 , H01L2924/00014 , H01L2924/0103 , H01L2924/01029 , H01L2924/01028 , H01L2924/01047
摘要： A soldering structure using Zn includes a bonding layer which contains Zn; and a lead-free solder which bonds and reacts to the bonding layer. The bonding layer can be a Zn alloy layer or a multilayer including a Zn layer. Accordingly, the characteristics of the soldering structure can be improved by involving the high reactive Zn to the interfacial reaction of the soldering.
摘要翻译：使用Zn的焊接结构包括含有Zn的结合层; 以及与接合层结合并反应的无铅焊料。接合层可以是Zn合金层或包含Zn层的多层。因此，可以通过将高反应性Zn引入焊接的界面反应来提高焊接结构的特性。

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