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1. 发明授权

US09689670B2 Thickness and convexity detection device for plate strip 有权
公开(公告)号：US09689670B2
公开(公告)日：2017-06-27
申请号：US14009123
申请日：2012-03-29
申请人： Zhifang Wu , Jigang An , Yuai Zhang , Jichen Miao , Litao Li , Guilai Xing , Liqiang Wang , Zhentao Wang , Ximing Liu , Jian Zheng , Yibin Huang , Xiaojing Guo , Chunming Tan
发明人： Zhifang Wu , Jigang An , Yuai Zhang , Jichen Miao , Litao Li , Guilai Xing , Liqiang Wang , Zhentao Wang , Ximing Liu , Jian Zheng , Yibin Huang , Xiaojing Guo , Chunming Tan
IPC分类号： G01B15/04 , G01B15/02 , G01N33/20
CPC分类号： G01B15/02 , G01B15/04 , G01N33/20
摘要： The invention relates to a device for detecting the thickness and crown of plates and strips, belonging to the field of nuclear technology applications. The device comprises a C-frame; two ray source mounted in an upper arm of the C-frame and distributed at an interval along the width direction of a steel plate/strip; two rows of gas-pressurized ionization chamber detector arrays mounted in a lower arm of the C-frame and distributed at an interval along the moving direction of the plate/strip; collimators mounted below the two ray source, the collimators enabling the rays of each ray source to only irradiate to a corresponding row of detectors; pre-amplifier modules connected with the detector arrays; a data collector connected with the pre-amplifier modules; a data processing and displaying computer connected with the data collector; and a cooling water and pressurized air service system and a control system for ensuring system operation and monitoring. The device of the invention is simple in structure and high in dynamic measurement accuracy, and the detectors have the advantages of small temperature drift, irradiation resistance, high spatial resolution, high cost performance and the like.

2. 发明申请

US20150226549A1 THICKNESS AND CONVEXITY DETECTION DEVICE FOR PLATE STRIP 有权
标题翻译：板条厚度和侵入检测装置
公开(公告)号：US20150226549A1
公开(公告)日：2015-08-13
申请号：US14009123
申请日：2012-03-29
申请人： Zhifang Wu , Jigang An , Yuai Zhang , Jichen Miao , Litao Li , Guilai Xing , Liqiang Wang , Zhentao Wang , Ximing Liu , Jian Zheng , Yibin Huang , Xiaojing Guo , Chunming Tan
发明人： Zhifang Wu , Jigang An , Yuai Zhang , Jichen Miao , Litao Li , Guilai Xing , Liqiang Wang , Zhentao Wang , Ximing Liu , Jian Zheng , Yibin Huang , Xiaojing Guo , Chunming Tan
IPC分类号： G01B15/02 , G01B15/04 , G01N33/20
CPC分类号： G01B15/02 , G01B15/04 , G01N33/20
摘要： The invention relates to a device for detecting the thickness and crown of plates and strips, belonging to the field of nuclear technology applications. The device comprises a C-frame; two ray source mounted in an upper arm of the C-frame and distributed at an interval along the width direction of a steel plate/strip; two rows of gas-pressurized ionization chamber detector arrays mounted in a lower arm of the C-frame and distributed at an interval along the moving direction of the plate/strip; collimators mounted below the two ray source, the collimators enabling the rays of each ray source to only irradiate to a corresponding row of detectors; pre-amplifier modules connected with the detector arrays; a data collector connected with the pre-amplifier modules; a data processing and displaying computer connected with the data collector; and a cooling water and pressurized air service system and a control system for ensuring system operation and monitoring. The device of the invention is simple in structure and high in dynamic measurement accuracy, and the detectors have the advantages of small temperature drift, irradiation resistance, high spatial resolution, high cost performance and the like.
摘要翻译：本发明涉及一种用于检测板材和带材的厚度和表冠的装置，属于核技术应用领域。该装置包括一个C帧; 两个射线源安装在C形框架的上臂中，沿着钢板/条带的宽度方向间隔分布; 两排气体加压电离室检测器阵列，其安装在C形框架的下臂中并沿着板/条的移动方向以间隔分布; 安装在两个射线源下方的准直器，使得每个射线源的射线只能照射到相应的检测器行的准直器; 与检测器阵列连接的前置放大器模块; 与前置放大器模块连接的数据采集器; 与数据收集器连接的数据处理和显示计算机; 以及冷却水和加压空气服务系统以及用于确保系统运行和监控的控制系统。本发明的装置结构简单，动态测量精度高，检测器具有温度漂移小，耐辐照，空间分辨率高，成本高等特点。

3. 发明申请

US20130258306A1 MASK PATTERN ALIGNMENT METHOD AND SYSTEM 有权
标题翻译：掩模图案对齐方法与系统
公开(公告)号：US20130258306A1
公开(公告)日：2013-10-03
申请号：US13686096
申请日：2012-11-27
申请人： YIBIN HUANG , WINNIE LIU
发明人： YIBIN HUANG , WINNIE LIU
IPC分类号： G03F9/00
CPC分类号： G03F9/7049 , G03F9/7003
摘要： An alignment method includes dividing a wafer into a plurality of regions including a first region and a second region, and each region contains a plurality chip areas. The method also includes obtaining alignment offset values for the first region, and determining a first alignment compensation equation for the first region. The method also includes obtaining alignment offset values for the second region, and determining a second alignment compensation equation for the second region. Further, the method includes determining whether a chip area to be exposed is in the first region or the second region, when the chip area is in the first region, using the first alignment compensation equation to adjust alignment of the wafer and, when the chip area is in the second region, using the second alignment compensation equation to adjust the alignment of the wafer.
摘要翻译：对准方法包括将晶片分成包括第一区域和第二区域的多个区域，并且每个区域包含多个芯片区域。该方法还包括获得第一区域的对准偏移值，以及确定第一区域的第一对准补偿方程。该方法还包括获得第二区域的对准偏移值，以及确定第二区域的第二对准补偿方程。此外，该方法包括：使用第一对准补偿方程来调整晶片的对准，当芯片面积在第一区域中时，确定要暴露的芯片面积是否在第一区域或第二区域中，并且当芯片区域在第二区域中，使用第二对准补偿方程来调整晶片的对准。

4. 发明授权

US09348240B2 Mask pattern alignment method and system 有权
标题翻译：掩模图案对准方法和系统
公开(公告)号：US09348240B2
公开(公告)日：2016-05-24
申请号：US13686096
申请日：2012-11-27
申请人： Yibin Huang , Winnie Liu
发明人： Yibin Huang , Winnie Liu
IPC分类号： G03F9/00
CPC分类号： G03F9/7049 , G03F9/7003
摘要： An alignment method includes dividing a wafer into a plurality of regions including a first region and a second region, and each region contains a plurality chip areas. The method also includes obtaining alignment offset values for the first region, and determining a first alignment compensation equation for the first region. The method also includes obtaining alignment offset values for the second region, and determining a second alignment compensation equation for the second region. Further, the method includes determining whether a chip area to be exposed is in the first region or the second region, when the chip area is in the first region, using the first alignment compensation equation to adjust alignment of the wafer and, when the chip area is in the second region, using the second alignment compensation equation to adjust the alignment of the wafer.
摘要翻译：对准方法包括将晶片分成包括第一区域和第二区域的多个区域，并且每个区域包含多个芯片区域。该方法还包括获得第一区域的对准偏移值，以及确定第一区域的第一对准补偿方程。该方法还包括获得第二区域的对准偏移值，以及确定第二区域的第二对准补偿方程。此外，该方法包括：使用第一对准补偿方程来调整晶片的对准，当芯片面积在第一区域中时，确定要暴露的芯片面积是否在第一区域或第二区域中，并且当芯片区域在第二区域中，使用第二对准补偿方程来调整晶片的对准。

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