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    • 1. 发明授权
    • Automated multi-PC-motherboard memory-module test system with robotic handler and in-transit visual inspection
    • 自动化多PC主板内存模块测试系统,具有机器人处理器和过境视觉检查
    • US06415397B1
    • 2002-07-02
    • US09660714
    • 2000-09-13
    • Ramon S. CoSteve Si-Yu ChenFred Yen KongThang Nguyen
    • Ramon S. CoSteve Si-Yu ChenFred Yen KongThang Nguyen
    • H02H305
    • G01R31/01G01R31/31713G01R31/31905G11C5/04G11C29/028G11C29/56G11C29/56016G11C2029/5004H05K1/141
    • A test station for testing memory modules uses multiple personal computer (PC) motherboards for performing functional tests on the modules. The motherboards are mounted upside-down with the solder-side up at the desktop level of the test station frame. One or more of the memory-module sockets on each motherboard is removed. A test adaptor board is plugged into the holes of the removed socket, but mounted on the reverse, solder side of the motherboard rather than the component side. The test adaptor board has a test socket that receives a module being tested. An overhead robotic arm picks up memory modules from an input tray and inserts them into test sockets for testing by the motherboards. Since the cables, components, and expansion boards of the motherboards are hidden below the solder-side surface of the motherboards, while the test adaptor board is above, the overhead robotic arm can easily navigate to the test socket without obstruction. Modules that pass are inspected in transit when the robotic arm holds the module in front of a camera that sends images to an image inspection processor.
    • 用于测试内存模块的测试站使用多台个人计算机(PC)主板对模块进行功能测试。 主板安装在测试台框架的桌面级上方,上面是焊接面朝上。 每个主板上的一个或多个内存模块插槽都被删除。 测试适配器板插入已卸下的插座的孔中,但安装在主板的反面焊接面,而不是组件侧。 测试适配器板有一个测试插座,可以接收正在测试的模块。 顶置机器人手臂从进纸盒中取出内存模块,将其插入测试插座,以便主板进行测试。 由于主板的电缆,组件和扩展板被隐藏在主板的焊接侧表面之下,而测试适配器板位于上方,则架空机器人手臂可以轻松地导航到测试插座而无障碍。 当机器手臂将模块保持在将图像发送到图像检查处理器的相机前面时,通过的模块被检查。
    • 5. 发明申请
    • Liquid delivering device
    • 液体输送装置
    • US20060064052A1
    • 2006-03-23
    • US10488338
    • 2002-08-07
    • Xuan ZhangYuan XuYen KongKui YaoXu He
    • Xuan ZhangYuan XuYen KongKui YaoXu He
    • A61N1/30
    • A61M5/145A61M5/1452A61M5/14586A61M5/1483A61M2005/14204
    • An electrochemically actuated liquid delivering device which is capable of releasing specific volumes of liquid at desired flow rates. The device includes a sealed electrolytic chamber which is adapted to contain an electrolyte and has at least one pair of electrodes which are at least partially in contact with the electrolyte. It also has a liquid chamber formed of a rigid material which is housed at least partially within the electrolytic chamber and is adapted to contain a liquid. It has pressure transfer means separating the electrolytic chamber from the liquid chamber and administering means which is adapted to release the liquid from the liquid chamber under the influence of pressure applied to the liquid chamber. The device is arranged so that when current is passed through the electrolyte via the electrodes, gas is generated from the electrolyte thereby increasing pressure inside the electrolytic chamber. That increase in pressure is transferred to the liquid chamber via the pressure transfer means and a determinable amount of the liquid is released from the liquid chamber via the administering means. The device has particular application in liquid drug delivery systems such as insulin infusion.
    • 一种电化学驱动的液体输送装置,其能够以期望的流速释放特定体积的液体。 该装置包括密封的电解室,其适于容纳电解质并具有至少部分与电解质接触的至少一对电极。 它还具有由刚性材料形成的液体室,其至少部分容纳在电解室内并且适于容纳液体。 其具有将电解室与液体室分离的压力传递装置和适于在施加到液体室的压力的影响下从液体室释放液体的施用装置。 该装置被布置成使得当电流经由电极通过电解质时,从电解液产生气体,从而增加电解室内的压力。 压力的增加通过压力传递装置转移到液体室,并且通过给药装置从液体室释放出可确定量的液体。 该装置在诸如胰岛素输注的液体药物递送系统中具有特别的应用。
    • 6. 发明申请
    • Imprinting of supported and free-standing 3-D micro- or nano-structures
    • 支持和独立的3-D微结构或纳米结构的印刷
    • US20050258570A1
    • 2005-11-24
    • US10852448
    • 2004-05-24
    • Yen KongHong LowStella PangAlbert Yee
    • Yen KongHong LowStella PangAlbert Yee
    • B28B11/08B29C59/02B81C1/00B81C99/00B82B3/00G03C5/00G03F7/00
    • A61M25/00B27N3/08B28B3/06B81C99/0085B81C2201/034B81C2203/032B81C2203/038B82Y10/00B82Y40/00G03F7/0002Y10T428/24479Y10T428/254
    • The present invention is directed to micro- and nano-scale imprinting methods and the use of such methods to fabricate supported and/or free-standing 3-D micro- and/or nano-structures of polymeric, ceramic, and/or metallic materials. In some embodiments, a duo-mold approach is employed in the fabrication of these structures. In such methods, surface treatments are employed to impart differential surface energies to different molds and/or different parts of the mold(s). Such surface treatments permit the formation of three-dimensional (3-D) structures through imprinting and the transfer of such structures to a substrate. In some or other embodiments, such surface treatments and variation in glass transition temperature of the polymers used can facilitate separation of the 3-D structures from the molds to form free-standing micro- and/or nano-structures individually and/or in a film. In some or other embodiments, a “latch-on” assembly technique is utilized to form supported and/or free-standing stacked micro- and/or nano-structures that enable the assembly of polymers without a glass transition temperature and eliminate the heating required to assemble thermoplastic polymers.
    • 本发明涉及微尺度和纳米级压印方法,并且使用这种方法来制造聚合物,陶瓷和/或金属材料的负载和/或独立的3-D微观和/或纳米结构 。 在一些实施例中,在制造这些结构中采用双模方法。 在这种方法中,使用表面处理以将不同的表面能赋予模具的不同模具和/或模具的不同部分。 这种表面处理允许通过压印形成三维(3-D)结构并将这种结构转移到基底上。 在一些或其它实施方案中,所使用的聚合物的这种表面处理和玻璃化转变温度的变化可促进3-D结构与模具的分离,以单独形成独立的和/或纳米结构,并且/ 电影。 在一些或其它实施方案中,使用“闭锁”组装技术来形成支撑和/或独立堆叠的微结构和/或纳米结构,其能够组装聚合物而不具有玻璃化转变温度并消除所需的加热 组装热塑性聚合物。
    • 8. 发明授权
    • Connector assembly for testing memory modules from the solder-side of a PC motherboard with forced hot air
    • 连接器组件,用于通过强制热空气从PC主板的焊料侧测试内存模块
    • US06357023B1
    • 2002-03-12
    • US09702017
    • 2000-10-30
    • Ramon S. CoSteve Si-Yu ChenFred Yen KongThang Nguyen
    • Ramon S. CoSteve Si-Yu ChenFred Yen KongThang Nguyen
    • H02H305
    • G01R31/01G01R31/31713G01R31/31905G11C5/04G11C29/028G11C29/56G11C29/56016G11C2029/5004H05K1/141
    • Memory modules are tested using a test assembly with a personal computer (PC) motherboard. The motherboard is mounted upside-down with its solder-side up to a metal plate using standoffs. A memory-module socket on the motherboard is removed. An opening is made in the metal plate above the removed socket. A well is attached to the metal plate at the opening. The well supports a test adaptor board below the metal plate so that the test adaptor board has a closer spacing to the motherboard than does the metal plate. The test adaptor board has a test socket that receives a module being tested. Pins from the test adaptor board are plugged into the holes of the removed socket on the motherboard, but mounted on the reverse, solder side of the motherboard rather than the component side. The cables, components, and expansion boards of the motherboards are hidden below the metal plate and motherboard, and can be cooled without cooling the memory module in the test socket. A top plate or air guide can be added above the metal plate to blow hot air on the memory module being tested in the test socket, while the cooling air is blown on the motherboard.
    • 使用具有个人计算机(PC)主板的测试组件测试内存模块。 主板使用对接方式将其焊接侧倒置到金属板上。 主板上的内存模块插槽被拆除。 在拆卸的插座上方的金属板上形成一个开口。 一个井在开口处附着在金属板上。 该井在金属板下面支撑测试适配器板,使得测试适配器板与母板相比,具有比金属板更近的间隔。 测试适配器板有一个测试插座,可以接收正在测试的模块。 来自测试适配器板的引脚插入主板上拆卸的插槽的孔中,但安装在母板的反面焊接面,而不是组件侧。 主板的电缆,组件和扩展板隐藏在金属板和主板下面,可以在不对测试插座内的内存模块进行冷却的情况下进行冷却。 可以在金属板上方添加顶板或空气引导件,以将吹入测试插座中的被测试的存储器模块上的热空气吹到主板上。