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    • 1. 发明授权
    • High-speed interconnects
    • 高速互连
    • US07978030B2
    • 2011-07-12
    • US12030142
    • 2008-02-12
    • Yuheng LeeJianying ZhouYan Yang ZhaoChristopher R. ColeBernd Huebner
    • Yuheng LeeJianying ZhouYan Yang ZhaoChristopher R. ColeBernd Huebner
    • H01P1/00
    • H01P5/028
    • In one example embodiment, a high-speed transponder includes a printed circuit board having a set of coplanar high-speed traces, and a high-speed circuit and a package mounted to the printed circuit board. The package includes an outside housing and a second high-speed circuit positioned inside the housing. The high-speed transponder also includes a high-speed feed thru which includes an inside coplanar structure positioned inside the housing, a strip line structure positioned through the housing, and an outside coplanar structure positioned outside the housing. The second high-speed circuit is operably coupled to the inside coplanar structure, which is operably coupled to the strip line structure, which is operably coupled to the outside coplanar structure, which is operably coupled to the first high-speed circuit via the set of coplanar high-speed traces. The signal plane of the outside coplanar structure is flipped with respect to a signal plane of the inside coplanar structure.
    • 在一个示例性实施例中,高速应答器包括具有一组共面高速迹线的印刷电路板,以及安装到印刷电路板的高速电路和封装。 该包装包括位于壳体内的外壳和第二高速电路。 高速转发器还包括高速进给器,其包括位于壳体内部的内部共面结构,通过壳体定位的带状线结构以及位于壳体外部的外部共面结构。 第二高速电路可操作地耦合到内部共面结构,其可操作地耦合到带状线结构,其可操作地耦合到外部共面结构,其可操作地耦合到第一高速电路,该组合 共面高速轨迹。 外部共面结构的信号平面相对于内部共面结构的信号平面翻转。
    • 4. 发明申请
    • HIGH-SPEED INTERCONNECTS
    • 高速互联
    • US20080191818A1
    • 2008-08-14
    • US12030142
    • 2008-02-12
    • Yuheng LeeJianying ZhouYan Yang ZhaoChristopher R. ColeBernd Huebner
    • Yuheng LeeJianying ZhouYan Yang ZhaoChristopher R. ColeBernd Huebner
    • H01P1/00
    • H01P5/028
    • In one example embodiment, a high-speed transponder includes a printed circuit board having a set of coplanar high-speed traces, and a high-speed circuit and a package mounted to the printed circuit board. The package includes an outside housing and a second high-speed circuit positioned inside the housing. The high-speed transponder also includes a high-speed feed thru which includes an inside coplanar structure positioned inside the housing, a strip line structure positioned through the housing, and an outside coplanar structure positioned outside the housing. The second high-speed circuit is operably coupled to the inside coplanar structure, which is operably coupled to the strip line structure, which is operably coupled to the outside coplanar structure, which is operably coupled to the first high-speed circuit via the set of coplanar high-speed traces. The signal plane of the outside coplanar structure is flipped with respect to a signal plane of the inside coplanar structure.
    • 在一个示例性实施例中,高速应答器包括具有一组共面高速迹线的印刷电路板,以及安装到印刷电路板的高速电路和封装。 该包装包括位于壳体内的外壳和第二高速电路。 高速转发器还包括高速进给器,其包括位于壳体内部的内部共面结构,通过壳体定位的带状线结构以及位于壳体外部的外部共面结构。 第二高速电路可操作地耦合到内部共面结构,其可操作地耦合到带状线结构,其可操作地耦合到外部共面结构,其可操作地耦合到第一高速电路,该组合 共面高速轨迹。 外部共面结构的信号平面相对于内部共面结构的信号平面翻转。
    • 7. 发明申请
    • FEED THRU WITH FLIPPED SIGNAL PLANE USING GUIDED VIAS
    • 使用指南VIAS进行拖动信号平面的进给
    • US20090267712A1
    • 2009-10-29
    • US12259202
    • 2008-10-27
    • Jianying ZhouYuheng LeeYan Yang ZhaoBernd Huebner
    • Jianying ZhouYuheng LeeYan Yang ZhaoBernd Huebner
    • H01P3/08
    • H01P3/003H01P1/04H01P3/006H05K1/0201H05K1/0237
    • An embodiment of the invention includes a high speed feed thru connecting a first circuit outside a housing to a second circuit inside the housing. The first circuit includes a first high speed integrated circuit chip and the second circuit includes a second high speed integrated circuit chip or optoelectronic device. The high speed feed thru includes an inside coplanar structure positioned at least partially inside the housing, the inside coplanar structure connected to the second circuit. The high speed feed thru also includes an outside coplanar structure positioned at least partially outside the housing, the outside coplanar structure connected to the first circuit. A material separates the inside coplanar structure and the outside coplanar structure. At least one guided via extends through the material, connecting the inside coplanar structure and the outside coplanar structure.
    • 本发明的实施例包括通过将外壳外部的第一电路连接到壳体内的第二电路的高速馈电。 第一电路包括第一高速集成电路芯片,第二电路包括第二高速集成电路芯片或光电子器件。 高速馈送包括至少部分地位于壳体内部的内部共面结构,内部共面结构连接到第二电路。 高速进料通过还包括至少部分地位于壳体外部的外共面结构,外共面结构连接到第一回路。 一种材料将内部共面结构和外部共面结构分开。 至少一个导向孔延伸穿过材料,连接内部共面结构和外部共面结构。
    • 8. 发明授权
    • Feed thru with flipped signal plane using guided vias
    • 通过引导通孔使用翻转的信号平面进行馈送
    • US07880570B2
    • 2011-02-01
    • US12259202
    • 2008-10-27
    • Jianying ZhouYuheng LeeYan Yang ZhaoBernd Huebner
    • Jianying ZhouYuheng LeeYan Yang ZhaoBernd Huebner
    • H01P3/00
    • H01P3/003H01P1/04H01P3/006H05K1/0201H05K1/0237
    • An embodiment of the invention includes a high speed feed thru connecting a first circuit outside a housing to a second circuit inside the housing. The first circuit includes a first high speed integrated circuit chip and the second circuit includes a second high speed integrated circuit chip or optoelectronic device. The high speed feed thru includes an inside coplanar structure positioned at least partially inside the housing, the inside coplanar structure connected to the second circuit. The high speed feed thru also includes an outside coplanar structure positioned at least partially outside the housing, the outside coplanar structure connected to the first circuit. A material separates the inside coplanar structure and the outside coplanar structure. At least one guided via extends through the material, connecting the inside coplanar structure and the outside coplanar structure.
    • 本发明的实施例包括通过将外壳外部的第一电路连接到壳体内的第二电路的高速馈电。 第一电路包括第一高速集成电路芯片,第二电路包括第二高速集成电路芯片或光电子器件。 高速馈送包括至少部分地位于壳体内部的内部共面结构,内部共面结构连接到第二电路。 高速进料通过还包括至少部分地位于壳体外部的外共面结构,外共面结构连接到第一回路。 一种材料将内部共面结构和外部共面结构分开。 至少一个导向孔延伸穿过材料,连接内部共面结构和外部共面结构。