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    • 2. 发明授权
    • Method of fabricating a high voltage semiconductor device using SIPOS
    • 使用SIPOS制造高压半导体器件的方法
    • US06660570B2
    • 2003-12-09
    • US10140181
    • 2002-05-08
    • Jin-kyeong KimJong-min KimKyung-wook KimTae-hoon KimCheol ChoiChang-wook Kim
    • Jin-kyeong KimJong-min KimKyung-wook KimTae-hoon KimCheol ChoiChang-wook Kim
    • H01L21332
    • H01L29/405H01L29/66272H01L29/73H01L29/7322
    • A high voltage semiconductor device including a semiconductor substrate on which a semi-insulating polycrystalline silicon layer is formed to alleviate electric field concentration in a field region, is disclosed. A thermal oxide layer is formed on the semi-insulating polycrystalline silicon layer to serve as a protective layer. The thermal oxide layer forms a good interface with the semi-insulating polycrystalline silicon layer compared to a wet etched oxide layer or a chemical vapor deposition (CVD) oxide layer, thereby decreasing the amount of leakage current. In addition, compared to a dual semi-insulating polycrystalline silicon layer, the thermal oxide layer exhibits a high surface protection effect and a high resistance against dielectric breakdown. It also allows a great reduction in fabrication time. In particular, the semi-insulating polycrystalline silicon layer is removed from the active region, thereby preventing the direct current (DC) gain of a device from being lowered within a low collector current range caused by the semi-insulating polycrystalline silicon layer.
    • 公开了一种包括半导体衬底的高电压半导体器件,半导体衬底上形成有半绝缘多晶硅层以减轻场区域中的电场集中。 在半绝缘多晶硅层上形成热氧化层作为保护层。 与湿蚀刻氧化物层或化学气相沉积(CVD)氧化物层相比,热氧化物层与半绝缘多晶硅层形成良好的界面,从而减少漏电流量。 另外,与双半绝缘多晶硅层相比,热氧化层具有高的表面保护效果和高耐电介质击穿电阻。 它还可以大大减少制造时间。 特别地,从有源区域去除半绝缘多晶硅层,从而防止器件的直流(DC)增益在由半绝缘多晶硅层引起的集电极电流范围内降低。
    • 10. 发明申请
    • DIRECT-HEAT GRILLING PAN AND METHOD OF MANUFACTURING THE SAME
    • 直接热轧板及其制造方法
    • US20160287015A1
    • 2016-10-06
    • US15048667
    • 2016-02-19
    • Tae Suck KIMJung Wook KIMChang Bo Co., Ltd.
    • Tae Suck KIMJung Wook KIM
    • A47J37/10A47J37/06
    • A47J37/10A47J37/06A47J37/067
    • A direct-heat grilling pan includes a bottom plate and a sidewall formed on a circumference of the bottom plate, the bottom plate including multiple upper supports, multiple lower supports, and an edge portion. The multiple upper supports are disposed with a first horizontal interval therebetween. The multiple lower supports are disposed with a second horizontal interval therebetween, are disposed with a vertical interval from the multiple upper supports to be positioned directly under the first horizontal interval, have a width greater than the first horizontal interval, and have on top surfaces thereof concave oil-dripping grooves in which oil drips down through the first horizontal interval. The edge portion surrounds the multiple upper supports and the multiple lower supports while connecting both end portions of the multiple upper supports and both end portions of the multiple lower supports.
    • 直热烤盘包括底板和形成在底板的圆周上的侧壁,底板包括多个上支撑件,多个下支撑件和边缘部分。 多个上支撑件以其间的第一水平间隔设置。 所述多个下部支撑件以其间的第二水平间隔设置,从所述多个上部支撑件以垂直间隔设置,以直接位于所述第一水平间隔之下,具有大于所述第一水平间隔的宽度,并且具有在其顶部表面上 凹入的油滴槽,其中油通过第一水平间隔向下滴落。 边缘部分围绕多个上支撑件和多个下支撑件,同时连接多个上支撑件的两个端部和多个下支撑件的两个端部。