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    • 5. 发明申请
    • METHODS OF MANUFACTURING A SEMICONDUCTOR DEVICE
    • 制造半导体器件的方法
    • US20140199815A1
    • 2014-07-17
    • US14156781
    • 2014-01-16
    • Sung-Min HWANGHan-Soo KIMWoon-Kyung LEEWon-Seok CHO
    • Sung-Min HWANGHan-Soo KIMWoon-Kyung LEEWon-Seok CHO
    • H01L29/66
    • H01L27/1157H01L27/11573H01L27/11575H01L27/11582H01L29/66833H01L29/7926
    • A method of manufacturing a vertical type memory device includes stacking a first lower insulating layer, one layer of a lower sacrificial layer and a second lower insulating layer on a substrate, forming a stacking structure by stacking sacrificial layers and insulating layers, and etching an edge portion of the stacking structure to form a preliminary stepped shape pattern structure. The preliminary stepped shape pattern structure has a stepped shape edge portion. A pillar structure making contact with a surface of the substrate is formed. The preliminary stepped shape pattern structure, the lower sacrificial layer, and the first and second lower insulating layers are partially etched to form a first opening portion and a second opening portion to form a stepped shape pattern structure. The second opening portion cuts at least an edge portion of the lower sacrificial layer.
    • 制造垂直型存储装置的方法包括在基板上堆叠第一下绝缘层,一层下牺牲层和第二下绝缘层,通过堆叠牺牲层和绝缘层形成堆叠结构,并蚀刻边缘 部分堆叠结构以形成初步阶形状图案结构。 初步阶形形状图案结构具有阶梯形边缘部分。 形成与基板表面接触的柱结构。 部分地蚀刻初步阶形状图案结构,下牺牲层和第一下绝缘层和第二下绝缘层,以形成第一开口部分和第二开口部分,以形成台阶状图形结构。 第二开口部分切割下牺牲层的至少边缘部分。
    • 10. 发明授权
    • Methods of forming nand-type nonvolatile memory devices
    • 形成非易失性存储器件的方法
    • US07709323B2
    • 2010-05-04
    • US12474896
    • 2009-05-29
    • Hoo-Sung ChoSoon-Moon JungWon-Seok ChoJong-Hyuk KimJae-Hun JeongJae-Hoon Jang
    • Hoo-Sung ChoSoon-Moon JungWon-Seok ChoJong-Hyuk KimJae-Hun JeongJae-Hoon Jang
    • H01L21/336
    • H01L27/11524H01L27/0688H01L27/11551
    • Methods of forming a NAND-type nonvolatile memory device include: forming first common drains and first common sources alternatively in an active region which is defined in a semiconductor substrate and extends one direction, forming a first insulating layer covering an entire surface of the semiconductor substrate, patterning the first insulating layer to form seed contact holes which are arranged at regular distance and expose the active region, forming a seed contact structure filling each of the seed contact holes and a semiconductor layer disposed on the first insulating layer and contacting the seed contact structures, patterning the semiconductor layer to form a semiconductor pattern which extends in the one direction and is disposed over the active region, forming second common drains and second common sources disposed alternatively in the semiconductor pattern in the one direction, forming a second insulating layer covering an entire surface of the semiconductor substrate, forming a source line pattern continuously penetrating the second insulating layer, the semiconductor pattern and the first insulating layer, the source line pattern being connected with the first and second common sources, wherein a grain boundary of the semiconductor layer is positioned at a center between the one pair of seed contact structures adjacent to each other, and is positioned over the first common drain or the first common source.
    • 形成NAND型非易失性存储器件的方法包括:在半导体衬底中限定的有源区域中交替形成第一公共漏极和第一公共源,并延伸一个方向,形成覆盖半导体衬底的整个表面的第一绝缘层 图案化第一绝缘层以形成以规则距离布置的暴露有源区域的种子接触孔,形成填充每个种子接触孔的种子接触结构以及设置在第一绝缘层上并接触种子接触的半导体层 结构,图案化所述半导体层以形成在所述一个方向上延伸并设置在所述有源区上方的半导体图案,形成沿所述一个方向交替设置在所述半导体图案中的第二公共漏极和第二公共源,形成第二绝缘层覆盖层 半导体衬底的整个表面 使源极线图案连续地穿过第二绝缘层,半导体图案和第一绝缘层,源极线图案与第一和第二共用源连接,其中半导体层的晶界位于第二绝缘层之间的中心 一对种子接触结构彼此相邻,并且位于第一公共漏极或第一公共源的上方。