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1. 发明申请

US20110194267A1 ELECTRONIC ASSEMBLY AND CASE THEREOF 审中-公开
标题翻译：电子总成及其案例
公开(公告)号：US20110194267A1
公开(公告)日：2011-08-11
申请号：US12987162
申请日：2011-01-10
申请人： Zhi-Kai Sun , Ho-Ching Huang , Wen-Bin Li
发明人： Zhi-Kai Sun , Ho-Ching Huang , Wen-Bin Li
IPC分类号： H05K7/00
CPC分类号： H05K9/0015
摘要： This invention provides an electronic assembly and a case thereof. The electronic assembly is used in an electronic device and includes a first cover, a second cover, a plurality of components, a sealing element, and at least one fastening element. The second cover is connected with the first cover to define a containing space. The components are contained in the containing space. The sealing element is sandwiched between the first cover and the second cover and has conductive nonwoven fabric. The fastening element fastens the first cover and the second cover and compresses the conductive nonwoven fabric of the sealing element to allow the first cover to be electrically connected to the second cover. The sealing element with the conductive nonwoven fabric is disposed between the first cover and the second cover of the case in the invention for preventing the components from water and EMI.
摘要翻译：本发明提供电子组件及其壳体。电子组件用于电子设备中，并且包括第一盖，第二盖，多个部件，密封元件和至少一个紧固元件。第二盖与第一盖连接以限定容纳空间。组件包含在容纳空间中。密封元件夹在第一盖和第二盖之间，并且具有导电性无纺布。紧固元件固定第一盖和第二盖，并压缩密封元件的导电性非织造布，以允许第一盖电连接到第二盖。具有导电性无纺布的密封元件设置在本发明的壳体的第一盖和第二盖之间，用于防止部件被水和EMI。

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