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1. 发明授权

US08541799B2 Light-emitting element package and fabrication method thereof 有权
标题翻译：发光元件封装及其制造方法
公开(公告)号：US08541799B2
公开(公告)日：2013-09-24
申请号：US13113081
申请日：2011-05-23
申请人： Min-Tsun Hsieh , Wen-Liang Tseng , Lung-Hsin Chen , Chih-Yung Lin , Ching-Lien Yeh , Chi-Wei Liao
发明人： Min-Tsun Hsieh , Wen-Liang Tseng , Lung-Hsin Chen , Chih-Yung Lin , Ching-Lien Yeh , Chi-Wei Liao
IPC分类号： H01L33/00
CPC分类号： H01L33/58 , H01L33/54 , H01L2933/005 , H01L2933/0083
摘要： A light-emitting element package includes a package member for encapsulating a light-emitting element. A plurality of photonic crystal patterns is formed on the package member. A distribution density of the photonic crystal patterns corresponds to light distribution of the light-emitting element. Each photonic crystal pattern consists of a plurality of photonic crystals.
摘要翻译：发光元件封装包括用于封装发光元件的封装构件。在封装构件上形成多个光子晶体图案。光子晶体图案的分布密度对应于发光元件的光分布。每个光子晶体图案由多个光子晶体组成。

2. 发明申请

US20130244355A1 METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE 有权
标题翻译：制造发光二极管封装的方法
公开(公告)号：US20130244355A1
公开(公告)日：2013-09-19
申请号：US13653634
申请日：2012-10-17
申请人： LUNG-HSIN CHEN , WEN-LIANG TSENG
发明人： LUNG-HSIN CHEN , WEN-LIANG TSENG
IPC分类号： H01L33/58
CPC分类号： H01L33/486 , H01L33/501 , H01L2924/0002 , H01L2933/0041 , H01L2924/00
摘要： An exemplary method for manufacturing an LED package includes following steps: providing a substrate; forming a reflector on the substrate with a receiving chamber defined in the reflector; providing an LED chip and mounting the LED chip on the substrate wherein the LED chip is received in the receiving chamber; providing a gelatinous phosphor layer and arranging the gelatinous phosphor layer on a top end of the reflector wherein the gelatinous phosphor layer covers the receiving chamber and phosphor powder is evenly distributed in the gelatinous phosphor layer; providing a pressing mold and arranging the pressing mold on a top end of the gelatinous phosphor layer; pressing the pressing mold toward the gelatinous phosphor layer to make the gelatinous phosphor layer fill in the receiving chamber; solidifying the gelatinous phosphor layer.
摘要翻译：制造LED封装的示例性方法包括以下步骤：提供衬底; 在所述基板上形成反射器，其中所述接收室限定在所述反射器中; 提供LED芯片并将LED芯片安装在基板上，其中LED芯片被容纳在接收室中; 提供凝胶状荧光体层，并将凝胶状磷光体层设置在反射器的顶端，其中，凝胶状磷光体层覆盖接收室，荧光体粉末均匀地分布在凝胶磷光体层中; 提供加压模具并将压模布置在凝胶磷光体层的顶端上; 将压模压向凝胶状磷光体层，使凝胶状磷光体层填充在接收室中; 凝胶化荧光体层。

3. 发明申请

US20130217160A1 METHOD FOR MANUFACTURING PHOSPHOR FILM AND METHOD FOR MAKING LED PACKAGE HAVING THE PHOSPHOR FILM 有权
标题翻译：用于制造磷光体膜的方法和制造具有磷光体膜的LED封装的方法
公开(公告)号：US20130217160A1
公开(公告)日：2013-08-22
申请号：US13600128
申请日：2012-08-30
申请人： LUNG-HSIN CHEN , WEN-LIANG TSENG , PIN-CHUAN CHEN
发明人： LUNG-HSIN CHEN , WEN-LIANG TSENG , PIN-CHUAN CHEN
IPC分类号： H01L33/50 , B44C1/22 , B29C45/02
CPC分类号： C09K11/02 , C09K11/08 , H01L33/50 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/92247 , H01L2933/0041 , H01L2924/00014 , H01L2924/00
摘要： A method for manufacturing a phosphor film for use in the an LED package, includes following steps: providing a mold comprising a first and a second molding part, the first molding part and the second molding part cooperatively forming a molding chamber, the first molding part defining an opening communicating with the molding chamber; filling a mixture of phosphor particles and a transparent glue into the first opening; moving a piston in the first opening along a direction from the first molding part to the second molding part, thereby pressing the mixture into the molding chamber; solidifying the mixture to form a phosphor film; and removing the phosphor film from the mold. The phosphor film is used to be attached to a top face of an LED chip opposite a substrate on which the LED chip is mounted.
摘要翻译：一种制造用于LED封装的荧光膜的方法，包括以下步骤：提供包括第一和第二成型部件的模具，第一模制部件和第二模制部件协同地形成模制室，第一模制部件限定与所述模制室连通的开口; 将荧光体颗粒和透明胶的混合物填充到第一开口中; 沿着从第一成型部到第二成型部的方向在第一开口中移动活塞，从而将混合物压入成型室; 使混合物固化形成荧光膜; 并从模具中去除荧光膜。荧光体膜用于与安装有LED芯片的基板相对的LED芯片的顶面附着。

4. 发明授权

US08470621B2 Method for fabricating a flip-chip semiconductor optoelectronic device 失效
标题翻译：制造倒装芯片半导体光电器件的方法
公开(公告)号：US08470621B2
公开(公告)日：2013-06-25
申请号：US12722231
申请日：2010-03-11
申请人： Chester Kuo , Lung Hsin Chen , Wen Liang Tseng , Shih Cheng Huang , Po Min Tu , Ying Chao Yeh , Wen Yu Lin , Peng Yi Wu , Shih Hsiung Chan
发明人： Chester Kuo , Lung Hsin Chen , Wen Liang Tseng , Shih Cheng Huang , Po Min Tu , Ying Chao Yeh , Wen Yu Lin , Peng Yi Wu , Shih Hsiung Chan
IPC分类号： H01L33/48 , H01L27/15 , H01L33/00
CPC分类号： H01L33/62 , H01L27/156 , H01L33/0079 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H01L2924/00014
摘要： A method for fabricating flip-chip semiconductor optoelectronic devices initially flip-chip bonds a semiconductor optoelectronic chip attached to an epitaxial substrate to a packaging substrate. The epitaxial substrate is then separated using lift-off technology.
摘要翻译：用于制造倒装芯片半导体光电器件的方法首先将连接到外延衬底的半导体光电芯片倒装芯片结合到封装衬底。然后使用剥离技术分离外延衬底。

5. 发明授权

US08459838B2 Traffic light 失效
标题翻译：红绿灯
公开(公告)号：US08459838B2
公开(公告)日：2013-06-11
申请号：US12900502
申请日：2010-10-08
申请人： Chi-Wei Liao , Wen-Liang Tseng , Min-Tsun Hsieh , Chih-Yung Lin , Ching-Lien Yeh
发明人： Chi-Wei Liao , Wen-Liang Tseng , Min-Tsun Hsieh , Chih-Yung Lin , Ching-Lien Yeh
IPC分类号： F21V33/00
CPC分类号： F21V15/00 , G08G1/095
摘要： A traffic light assembly includes at least one light module, at least one lens located in front of the at least one light module, a transparent housing located in front of the at least one lens, and a cleaning device. The cleaning device includes a wiper located on an outer surface of the transparent housing, and a driver which drives the wiper to brush the transparent housing.
摘要翻译：交通灯组件包括至少一个灯模块，位于所述至少一个灯模块前面的至少一个透镜，位于所述至少一个透镜前面的透明壳体和清洁装置。清洁装置包括位于透明壳体的外表面上的擦拭器和驱动刮水器以刷透透明壳体的驱动器。

6. 发明申请

US20130065332A1 METHOD FOR MANUFACTURING LED WITH AN ENCAPSULANT HAVING A FLAT TOP FACE 审中-公开
标题翻译：用具有平坦顶部表面的封装制造LED的方法
公开(公告)号：US20130065332A1
公开(公告)日：2013-03-14
申请号：US13593473
申请日：2012-08-23
申请人： HSIN-CHIANG LIN , WEN-LIANG TSENG
发明人： HSIN-CHIANG LIN , WEN-LIANG TSENG
IPC分类号： H01L33/52 , H01L33/50
CPC分类号： H01L33/486 , H01L24/97 , H01L33/54 , H01L2224/48091 , H01L2224/97 , H01L2924/01322 , H01L2924/12041 , H01L2924/15787 , H01L2933/005 , H01L2924/00014 , H01L2924/00 , H01L2224/85
摘要： A method for manufacturing LEDs is disclosed. A base is firstly provided. The base includes a plate, sidewalls formed on the plate and pairs of leads connected to the plate. The sidewalls enclose cavities above the plate. Light emitting chips are fixed in the cavities and electrically connected to the leads, respectively. Encapsulants are formed in the cavities to seal the light emitting chips. Each encapsulant has a convex top face protruding beyond top faces of the sidewalls. The convex top faces of the encapsulants are grinded to become flat. Finally, the base is cut to form individual LEDs.
摘要翻译：公开了一种用于制造LED的方法。首先提供基地。底座包括板，形成在板上的侧壁和连接到板的引线对。侧壁包围板上方的空腔。发光芯片固定在空腔中并分别与引线电连接。密封剂形成在空腔中以密封发光芯片。每个密封剂具有突出超过侧壁顶面的凸顶面。将密封剂的凸起的顶面研磨成平坦的。最后，将基座切割成单独的LED。

7. 发明授权

US08242519B2 Package structure of light emitting diode for backlight 有权
标题翻译：用于背光的发光二极管的封装结构
公开(公告)号：US08242519B2
公开(公告)日：2012-08-14
申请号：US12814943
申请日：2010-06-14
申请人： Jian Shihn Tsang , Wen Liang Tseng , Yao Te Tseng , Shih Hsiung Chan
发明人： Jian Shihn Tsang , Wen Liang Tseng , Yao Te Tseng , Shih Hsiung Chan
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L33/483 , H01L33/504 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48465 , H01L2924/09701 , H01L2924/00014 , H01L2924/00
摘要： A package structure of a light emitting diode for a backlight comprises a long-wavelength LED die and a short-wavelength LED die. The lights emitted from the two LED dies are mixed with the light emitted from excited fluorescent powders for serving as the backlight of a liquid crystal display. A partition plate is disposed between the two LED dies for separating them from each other. The effective light output of the package structure is increased because each of the two LED dies cannot absorb the light from the other.
摘要翻译：用于背光源的发光二极管的封装结构包括长波长LED管芯和短波长LED管芯。从两个LED管芯发射的光与从激发的荧光粉末发射的光混合，用作液晶显示器的背光。分隔板设置在两个LED管芯之间，用于将它们彼此分开。由于两个LED管芯中的每一个都不能吸收另一个LED的光，因此封装结构的有效光输出增加。

8. 发明申请

US20120074827A1 LED LAMP STRUCTURE 有权
标题翻译： LED灯结构
公开(公告)号：US20120074827A1
公开(公告)日：2012-03-29
申请号：US13167704
申请日：2011-06-24
申请人： MIN-TSUN HSIEH , WEN-LIANG TSENG , LUNG-HSIN CHEN , CHIH-YUNG LIN , CHING-LIEN YEH
发明人： MIN-TSUN HSIEH , WEN-LIANG TSENG , LUNG-HSIN CHEN , CHIH-YUNG LIN , CHING-LIEN YEH
IPC分类号： H01J7/24
CPC分类号： F21V29/004 , F21K9/233 , F21V7/0083 , F21V13/04 , F21V17/102 , F21V29/773 , F21Y2105/10 , F21Y2115/10
摘要： An LED lamp structure includes a heat sink and a base. The heat sink includes a first receiving cavity, a second receiving cavity opposite to the first receiving cavity and a partition. A light board having LED modules is mounted on the partition. The partition defines two first threaded through holes therein. The base has two positioning protrusions engaging in two positioning grooves of the heat sink. Thus, second screw holes of two screw pillars of the base are aligned at the first screw holes of the partition of the heat sink. Screws are used to threadedly engage in the first screw holes, the second screw holes and third screw holes in the light board to thereby assemble the heat sink, the base and the light board together.
摘要翻译： LED灯结构包括散热器和基座。散热器包括第一接收腔，与第一接收腔相对的第二接收腔和隔板。具有LED模块的灯板安装在隔板上。隔板在其中限定了两个第一螺纹通孔。基座具有两个定位突起，该突起与散热器的两个定位槽啮合。因此，基座的两个螺柱的第二螺钉孔在散热器的隔板的第一螺钉孔处对准。螺丝用于螺纹接合灯板中的第一螺钉孔，第二螺钉孔和第三螺钉孔，从而将散热器，基座和灯板组装在一起。

9. 发明申请

US20110266574A1 LED PACKAGE 审中-公开
标题翻译： LED封装
公开(公告)号：US20110266574A1
公开(公告)日：2011-11-03
申请号：US13007677
申请日：2011-01-17
申请人： CHI-WEI LIAO , WEN-LIANG TSENG , CHIH-YUNG LIN , MIN-TSUN HSIEH , CHING-LIEN YEH
发明人： CHI-WEI LIAO , WEN-LIANG TSENG , CHIH-YUNG LIN , MIN-TSUN HSIEH , CHING-LIEN YEH
IPC分类号： H01L33/54
CPC分类号： H01L33/508 , H01L33/507 , H01L2224/48091 , H01L2933/0091 , H01L2924/00014
摘要： An LED package includes a substrate, an LED die, and an encapsulating layer. The LED die is arranged on the substrate. The encapsulating layer covers the LED die and at least a part of the substrate. The encapsulating layer includes a light dispersing element. A light scattering intensity of the light dispersing element is proportional to the light intensity of light generated by the LED die and illuminated at the encapsulating layer. A luminance at a center of the LED package is substantially identical to that at a circumference of the LED package.
摘要翻译： LED封装包括基板，LED管芯和封装层。 LED芯片设置在基板上。封装层覆盖LED管芯和至少一部分衬底。封装层包括光分散元件。光散射元件的光散射强度与由LED管芯产生的光的光强度成比例，并在封装层处照射。 LED封装的中心处的亮度基本上与LED封装的周边相同。

10. 发明授权

US07989237B2 Package structure for solid-state lighting devices and method of fabricating the same 有权
标题翻译：固体照明装置的封装结构及其制造方法
公开(公告)号：US07989237B2
公开(公告)日：2011-08-02
申请号：US12232882
申请日：2008-09-25
申请人： Wen Liang Tseng , Lung Hsin Chen
发明人： Wen Liang Tseng , Lung Hsin Chen
IPC分类号： H01L33/00
CPC分类号： H01L33/641 , H01L33/60 , H01L33/62 , H01L33/647 , H01L2224/16 , H01L2224/48091 , H01L2224/48227 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： Silicon substrates are applied to the package structure of solid-state lighting devices. Wet etching is performed to both top and bottom surfaces of the silicon substrate to form reflecting cavity and electrode access holes. Materials of the reflecting layer and electrode can be different from each other whose preferred materials can be chosen in accordance with a correspondent function. Formation of the electrode can be patterned by an etching method or a lift-off method.
摘要翻译：将硅衬底应用于固态照明器件的封装结构。对硅基板的顶表面和底表面进行湿蚀刻以形成反射腔和电极访问孔。反射层和电极的材料可以彼此不同，其优选的材料可以根据相应的功能来选择。电极的形成可以通过蚀刻方法或剥离法进行图案化。

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