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    • 5. 发明授权
    • Electrostatic discharge protection circuit
    • 静电放电保护电路
    • US08610169B2
    • 2013-12-17
    • US13476908
    • 2012-05-21
    • Wei-Fan Chen
    • Wei-Fan Chen
    • H01L29/66
    • H01L27/0262H01L2924/0002H01L2924/00
    • The invention discloses an ESD protection circuit, comprising a P-type substrate; an N-well formed on the P-type substrate; a P-doped region formed on the N-well, wherein the P-doped region is electrically connected to an input/output terminal of a circuit under protection; a first N-doped region formed on the P-type substrate, the first N-doped region is electrically connected to a first node, and the P-doped region, the N-well, the P-type substrate, and the first N-doped region constitute a silicon controlled rectifier; and a second N-doped region formed on the N-well and electrically connected to a second node, wherein a part of the P-doped region and the second N-doped region constitute a discharging path, and when an ESD event occurs at the input/output terminal, the silicon controlled rectifier and the discharging path bypass electrostatic charges to the first and second nodes respectively.
    • 本发明公开了一种ESD保护电路,包括P型衬底; 在P型衬底上形成的N阱; 形成在所述N阱上的P掺杂区域,其中所述P掺杂区域电连接到保护电路的输入/输出端子; 形成在P型基板上的第一N掺杂区域,第一N掺杂区域电连接到第一节点,P掺杂区域,N阱,P型衬底和第一N掺杂区域 掺杂区域构成可控硅整流器; 以及形成在所述N阱上并电连接到第二节点的第二N掺杂区域,其中所述P掺杂区域和所述第二N掺杂区域的一部分构成放电路径,并且当在所述第二N掺杂区域处发生ESD事件时 输入/输出端子,可控硅整流器和放电路径分别将静电电荷分别连接到第一和第二节点。
    • 6. 发明申请
    • ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT
    • 静电放电保护电路
    • US20130307017A1
    • 2013-11-21
    • US13476908
    • 2012-05-21
    • Wei-Fan Chen
    • Wei-Fan Chen
    • H01L27/088
    • H01L27/0262H01L2924/0002H01L2924/00
    • The invention discloses an ESD protection circuit, comprising a P-type substrate; an N-well formed on the P-type substrate; a P-doped region formed on the N-well, wherein the P-doped region is electrically connected to an input/output terminal of a circuit under protection; a first N-doped region formed on the P-type substrate, the first N-doped region is electrically connected to a first node, and the P-doped region, the N-well, the P-type substrate, and the first N-doped region constitute a silicon controlled rectifier; and a second N-doped region formed on the N-well and electrically connected to a second node, wherein a part of the P-doped region and the second N-doped region constitute a discharging path, and when an ESD event occurs at the input/output terminal, the silicon controlled rectifier and the discharging path bypass electrostatic charges to the first and second nodes respectively.
    • 本发明公开了一种ESD保护电路,包括P型衬底; 在P型衬底上形成的N阱; 形成在所述N阱上的P掺杂区域,其中所述P掺杂区域电连接到保护电路的输入/输出端子; 形成在P型基板上的第一N掺杂区域,第一N掺杂区域电连接到第一节点,P掺杂区域,N阱,P型衬底和第一N掺杂区域 掺杂区域构成可控硅整流器; 以及形成在所述N阱上并电连接到第二节点的第二N掺杂区域,其中所述P掺杂区域和所述第二N掺杂区域的一部分构成放电路径,并且当在所述第二N掺杂区域处发生ESD事件时 输入/输出端子,可控硅整流器和放电路径分别将静电电荷分别连接到第一和第二节点。
    • 8. 发明申请
    • SELECTING METHOD OF LIGHT GUIDE PLATE OF BACKLIGHT MODULE
    • 背光模组光导板的选择方法
    • US20130158956A1
    • 2013-06-20
    • US13380889
    • 2011-12-15
    • Chechang HuKuangyao ChangLei SunWei Fan
    • Chechang HuKuangyao ChangLei SunWei Fan
    • G06F17/50
    • G02B6/0043G02B6/0051G02B6/0053G02B6/0065G02F1/133615
    • A selecting method of light guide plate of backlight module is described. The selecting method includes the steps of: calculating a plurality of mura indexes (MI) corresponding to a plurality of mura statuses of a plurality of first light guide plate (LGP) types, respectively; defining a plurality of film structures, wherein each of the film structures corresponds to each of mura indexes for mapping the mura indexes (MI) of the first LGP types with the film structures to construct a mapping database; and selecting one of the film structures and one of the mura indexes (MI) correspondingly from the mapping database for determining a critical dot dimension (CDD) of a second LGP type of the selected film structure. The selecting method avoids the mura, speed up the research and development procedure of the backlight module, labor cost and manufacturing cost when the LGP is assembled with the film structure.
    • 描述背光模块的导光板的选择方法。 所述选择方法包括以下步骤:分别计算与多个第一导光板(LGP)类型的多个mura状态对应的多个mura索引(MI); 定义多个胶片结构,其中每个胶片结构对应于每个mura索引,用于将第一LGP类型的mura索引(MI)与胶片结构映射以构建映射数据库; 以及从所述映射数据库相应地选择所述胶片结构之一和所述mura索引(MI)中的一个,以确定所选择的胶片结构的第二LGP类型的临界点尺寸(CDD)。 选择方法避免了光环,加快了背光模块的研发过程,人造成本和制造成本,当LGP与胶片结构组装时。