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1. 发明申请

US20090011373A1 METHOD OF MANUFACTURING MECHANICAL AND MICROMECHANICAL PARTS 有权
标题翻译：制造机械和微生物部件的方法
公开(公告)号：US20090011373A1
公开(公告)日：2009-01-08
申请号：US12167691
申请日：2008-07-03
申请人： Yvan Gonin , Vittorio Emilio Marsico
发明人： Yvan Gonin , Vittorio Emilio Marsico
IPC分类号： G03F7/20
CPC分类号： B81C1/00214 , B81C99/008
摘要： The invention concerns a method of manufacturing parts of a first material able to be etched, from a substrate including at least one superficial layer of said first material. The method includes the following steps: forming a substantially uniform superficial layer of a second material at the surface of said superficial layer of the first material, said second material being able to resist a selective etch of the first material, forming a bead of said second material at the periphery of said superficial layer of said second material, structuring the layer of second material and the bead by a standard photolithographic process including an etch step of sufficient duration to etch the superficial layer of second material over the entire thickness thereof, but insufficient to etch said bead over the entire thickness thereof, so as to obtain a mask of said second material extending as far as the periphery of said layer of first material, cutting out the parts made of the first material through said mask of said second material, by directional etching.
摘要翻译：本发明涉及一种从包括所述第一材料的至少一个表面层的衬底制造能够被蚀刻的第一材料的部件的方法。该方法包括以下步骤：在第一材料的所述表面层的表面处形成第二材料的基本均匀的表面层，所述第二材料能够抵抗对第一材料的选择性蚀刻，形成所述第二材料的珠粒在所述第二材料的所述表层的周边处的材料，通过标准光刻工艺来构造第二材料层和珠粒，该标准光刻工艺包括具有足够持续时间的蚀刻步骤以在整个厚度上蚀刻第二材料的表层，但不足在其整个厚度上蚀刻所述珠，以便获得所述第二材料的掩模，其延伸到所述第一材料层的周边，通过所述第二材料的掩模切割由第一材料制成的部件，通过定向蚀刻。

2. 发明授权

US08137902B2 Method of manufacturing mechanical and micromechanical parts 有权
标题翻译：制造机械和微机械部件的方法
公开(公告)号：US08137902B2
公开(公告)日：2012-03-20
申请号：US12167691
申请日：2008-07-03
申请人： Yvan Gonin , Vittorio Emilio Marsico
发明人： Yvan Gonin , Vittorio Emilio Marsico
IPC分类号： G03F7/26
CPC分类号： B81C1/00214 , B81C99/008
摘要： A method of manufacturing parts of a first material able to be etched from a substrate including at least one superficial layer of the first material, includes (a) forming a substantially uniform superficial layer of a second material at the surface of the superficial layer of the first material, wherein the second material resists a selective etch of the first material, (b) forming a bead of second material at the periphery of the superficial layer of second material, (c) structuring the layer of second material and the bead by a photolithographic process including an etch step of sufficient duration to etch the superficial layer of second material over the entire thickness thereof, but insufficient to etch the bead over the entire thickness thereof, so as to obtain a mask, and (d) cutting out parts made of the first material through the mask of the second material, by directional etching.
摘要翻译：一种制造能够从包括第一材料的至少一个表面层的基板中蚀刻的第一材料的部件的方法包括：（a）在第一材料的表面层的表面上形成基本上均匀的第二材料表面层第一材料，其中所述第二材料抵抗所述第一材料的选择性蚀刻，（b）在所述第二材料的所述表面层的周围形成第二材料的珠粒，（c）通过第二材料的所述第二材料层和所述珠粒的结构光刻工艺包括具有足够持续时间的蚀刻步骤，以在其整个厚度上蚀刻第二材料的表面层，但不足以在其整个厚度上蚀刻珠粒，以便获得掩模，以及（d）切割部件的第一材料通过第二材料的掩模，通过定向蚀刻。

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