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1. 发明申请

US20110140270A1 SEMICONDUCTOR MOUNTING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME 失效
标题翻译：半导体安装基板及其制造方法
公开(公告)号：US20110140270A1
公开(公告)日：2011-06-16
申请号：US13031945
申请日：2011-02-22
申请人： JUNICHI KIMURA , Hideki Niimi , Yuji Fuwa , Tsuyoshi Sakaue
发明人： JUNICHI KIMURA , Hideki Niimi , Yuji Fuwa , Tsuyoshi Sakaue
IPC分类号： H01L23/498
CPC分类号： H01L21/563 , H01L23/3135 , H01L23/3142 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/19105 , H05K1/023 , H05K3/305 , H05K2201/10522 , H05K2201/10636 , H05K2201/10674 , H05K2201/10977 , Y02P70/611 , Y02P70/613 , H01L2924/00 , H01L2224/0401
摘要： A semiconductor mounting substrate according to the present invention comprises: a substrate; a semiconductor device, mounted on this substrate; solder bumps, which connect the semiconductor device and the substrate; a first resin, filled in a space between the semiconductor device and the substrate; and electronic components, mounted on a face side of the semiconductor device where the semiconductor device is mounted, wherein bond strength reinforcing resin section is provided at least between a side face in the vicinity of a corner part of the semiconductor device and a substrate surface of the substrate in a position corresponding to the corner part.
摘要翻译：根据本发明的半导体安装基板包括：基板; 安装在该基板上的半导体器件; 焊料凸块，其连接半导体器件和衬底; 填充在半导体器件和衬底之间的空间中的第一树脂; 以及安装在半导体装置的半导体装置的正面侧的电子部件，其中，接合强度增强树脂部至少设置在半导体装置的角部附近的侧面和所述基板处于与所述角部对应的位置。

2. 发明授权

US08857258B2 Inertial force sensor 有权
标题翻译：惯性力传感器
公开(公告)号：US08857258B2
公开(公告)日：2014-10-14
申请号：US13143099
申请日：2010-02-16
申请人： Hideo Ohkoshi , Shigehiro Yoshiuchi , Tsuyoshi Sakaue
发明人： Hideo Ohkoshi , Shigehiro Yoshiuchi , Tsuyoshi Sakaue
IPC分类号： G01C19/00 , G01C19/5769 , G01C19/574 , G01P15/18 , G01P15/125 , G01P15/08
CPC分类号： G01P3/02 , G01C19/574 , G01C19/5769 , G01P15/02 , G01P15/125 , G01P15/18 , G01P2015/0845 , G01P2015/0857
摘要： An inertial force sensor includes a detector element, a supporting body supporting the detector element, and a case holding the detector element via the first supporting body. The supporting body has flexibility and has a plate shape. The detector element includes a weight, a flexible coupling portion extending along a plane and supporting the weight, a fixing portion holding the weight via the coupling portion, and a detector detecting angular velocities about at least two axes non-parallel to each other. The supporting body extends in parallel with the plane from the detector element, and bends at a bending portion in a direction away from the plane. This inertial force sensor can detect the angular velocities while preventing erroneous detection caused by external impacts and vibrations.
摘要翻译：惯性力传感器包括检测器元件，支撑检测器元件的支撑体以及经由第一支撑体保持检测器元件的壳体。支撑体具有柔性并具有板形。检测器元件包括重物，沿着平面延伸并支撑重物的柔性联接部分，通过联接部分保持重物的固定部分，以及检测围绕彼此不平行的至少两个轴线的角速度的检测器。支撑体与来自检测器元件的平面平行地延伸，并且在远离平面的方向上在弯曲部弯曲。该惯性力传感器可以检测角速度，同时防止由外部冲击和振动引起的错误检测。

3. 发明授权

US08217515B2 Semiconductor mounting substrate and method for manufacturing the same 失效
标题翻译：半导体安装基板及其制造方法
公开(公告)号：US08217515B2
公开(公告)日：2012-07-10
申请号：US13031945
申请日：2011-02-22
申请人： Junichi Kimura , Hideki Niimi , Yuji Fuwa , Tsuyoshi Sakaue
发明人： Junichi Kimura , Hideki Niimi , Yuji Fuwa , Tsuyoshi Sakaue
IPC分类号： H01L23/34
CPC分类号： H01L21/563 , H01L23/3135 , H01L23/3142 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/19105 , H05K1/023 , H05K3/305 , H05K2201/10522 , H05K2201/10636 , H05K2201/10674 , H05K2201/10977 , Y02P70/611 , Y02P70/613 , H01L2924/00 , H01L2224/0401
摘要： A semiconductor mounting substrate according to the present invention comprises: a substrate; a semiconductor device, mounted on this substrate; solder bumps, which connect the semiconductor device and the substrate; a first resin, filled in a space between the semiconductor device and the substrate; and electronic components, mounted on a face side of the semiconductor device where the semiconductor device is mounted, wherein bond strength reinforcing resin section is provided at least between a side face in the vicinity of a corner part of the semiconductor device and a substrate surface of the substrate in a position corresponding to the corner part.
摘要翻译：根据本发明的半导体安装基板包括：基板; 安装在该基板上的半导体器件; 焊料凸块，其连接半导体器件和衬底; 填充在半导体器件和衬底之间的空间中的第一树脂; 以及安装在半导体装置的半导体装置的正面侧的电子部件，其中，接合强度增强树脂部至少设置在半导体装置的角部附近的侧面和所述基板处于与所述角部对应的位置。

4. 发明申请

US20110271760A1 INERTIAL FORCE SENSOR 有权
标题翻译：惯性力传感器
公开(公告)号：US20110271760A1
公开(公告)日：2011-11-10
申请号：US13143099
申请日：2010-02-16
申请人： Hideo Ohkoshi , Shigehiro Yoshiuchi , Tsuyoshi Sakaue
发明人： Hideo Ohkoshi , Shigehiro Yoshiuchi , Tsuyoshi Sakaue
IPC分类号： G01C19/56
CPC分类号： G01P3/02 , G01C19/574 , G01C19/5769 , G01P15/02 , G01P15/125 , G01P15/18 , G01P2015/0845 , G01P2015/0857
摘要： An inertial force sensor includes a detector element, a supporting body supporting the detector element, and a case holding the detector element via the first supporting body. The supporting body has flexibility and has a plate shape. The detector element includes a weight, a flexible coupling portion extending along a plane and supporting the weight, a fixing portion holding the weight via the coupling portion, and a detector detecting angular velocities about at least two axes non-parallel to each other. The supporting body extends in parallel with the plane from the detector element, and bends at a bending portion in a direction away from the plane. This inertial force sensor can detect the angular velocities while preventing erroneous detection caused by external impacts and vibrations.
摘要翻译：惯性力传感器包括检测器元件，支撑检测器元件的支撑体以及经由第一支撑体保持检测器元件的壳体。支撑体具有柔性并具有板形。检测器元件包括重物，沿着平面延伸并支撑重物的柔性联接部分，通过联接部分保持重物的固定部分，以及检测围绕彼此不平行的至少两个轴线的角速度的检测器。支撑体与来自检测器元件的平面平行地延伸，并且在远离平面的方向上在弯曲部弯曲。该惯性力传感器可以检测角速度，同时防止由外部冲击和振动引起的错误检测。

5. 发明授权

US07919359B2 Semiconductor mounting substrate and method for manufacturing the same 失效
标题翻译：半导体安装基板及其制造方法
公开(公告)号：US07919359B2
公开(公告)日：2011-04-05
申请号：US11873618
申请日：2007-10-17
申请人： Junichi Kimura , Hideki Niimi , Yuji Fuwa , Tsuyoshi Sakaue
发明人： Junichi Kimura , Hideki Niimi , Yuji Fuwa , Tsuyoshi Sakaue
IPC分类号： H01L23/52
CPC分类号： H01L21/563 , H01L23/3135 , H01L23/3142 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/19105 , H05K1/023 , H05K3/305 , H05K2201/10522 , H05K2201/10636 , H05K2201/10674 , H05K2201/10977 , Y02P70/611 , Y02P70/613 , H01L2924/00 , H01L2224/0401
摘要： A semiconductor mounting substrate according to the present invention comprises: a substrate; a semiconductor device, mounted on this substrate; solder bumps, which connect the semiconductor device and the substrate; a first resin, filled in a space between the semiconductor device and the substrate; and electronic components, mounted on a face side of the semiconductor device where the semiconductor device is mounted, wherein bond strength reinforcing resin section is provided at least between a side face in the vicinity of a corner part of the semiconductor device and a substrate surface of the substrate in a position corresponding to the corner part.
摘要翻译：根据本发明的半导体安装基板包括：基板; 安装在该基板上的半导体器件; 焊料凸块，其连接半导体器件和衬底; 填充在半导体器件和衬底之间的空间中的第一树脂; 以及安装在半导体装置的半导体装置的正面侧的电子部件，其中，接合强度增强树脂部至少设置在半导体装置的角部附近的侧面和所述基板处于与所述角部对应的位置。

6. 发明授权

US5847489A Piezoelectric device and a package 失效
公开(公告)号：US5847489A
公开(公告)日：1998-12-08
申请号：US708918
申请日：1996-09-06
申请人： Yuki Satoh , Toshio Ishizaki , Tsuyoshi Sakaue , Koji Hashimoto , Tohru Yamada , Tomoki Uwano
发明人： Yuki Satoh , Toshio Ishizaki , Tsuyoshi Sakaue , Koji Hashimoto , Tohru Yamada , Tomoki Uwano
IPC分类号： H01C1/02 , H01L23/08 , H01L41/053 , H03H3/007 , H03H9/02 , H03H9/05 , H03H9/10 , H03H9/13 , H03H9/17 , H03H9/25 , H03H9/56 , H05K5/06 , H01L41/08
CPC分类号： H03H9/1071 , H03H9/1035
摘要： A piezoelectric device includes a piezoelectric plate provided with at least one electrode at almost a central portion of each face; a first plate made of an ionic material having a recessed portion to cover the at least one electrode at one face to face the piezoelectric plate; and a second plate made of an ionic material having a recessed portion to cover the at least one electrode at one face to face the piezoelectric plate. Each of the at least one electrode is packaged by direct bonding the piezoelectric plate with the first plate and the second plate so as to be sandwiched therebetween. A package includes a body member made of an ionic material provided with a recessed portion or an opening, having a flat face around the recessed portion or the opening; and a covering member made of an ionic material having a flat face to cover the body member. The flat face of the body member and the flat face of the covering member are cleaned and attached to each other so as to be direct bonded with each other using hydrogen bonds generated between the ionic materials, thereby packaging the recessed portion or the opening.

7. 发明申请

US20080093739A1 SEMICONDUCTOR MOUNTING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME 失效
标题翻译：半导体安装基板及其制造方法
公开(公告)号：US20080093739A1
公开(公告)日：2008-04-24
申请号：US11873618
申请日：2007-10-17
申请人： Junichi KIMURA , Hideki Niimi , Yuji Fuwa , Tsuyoshi Sakaue
发明人： Junichi KIMURA , Hideki Niimi , Yuji Fuwa , Tsuyoshi Sakaue
IPC分类号： H01L23/52 , H01L21/00
CPC分类号： H01L21/563 , H01L23/3135 , H01L23/3142 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/19105 , H05K1/023 , H05K3/305 , H05K2201/10522 , H05K2201/10636 , H05K2201/10674 , H05K2201/10977 , Y02P70/611 , Y02P70/613 , H01L2924/00 , H01L2224/0401
摘要： A semiconductor mounting substrate according to the present invention comprises: a substrate; a semiconductor device, mounted on this substrate; solder bumps, which connect the semiconductor device and the substrate; a first resin, filled in a space between the semiconductor device and the substrate; and electronic components, mounted on a face side of the semiconductor device where the semiconductor device is mounted, wherein bond strength reinforcing resin section is provided at least between a side face in the vicinity of a corner part of the semiconductor device and a substrate surface of the substrate in a position corresponding to the corner part.
摘要翻译：根据本发明的半导体安装基板包括：基板; 安装在该基板上的半导体器件; 焊料凸块，其连接半导体器件和衬底; 填充在半导体器件和衬底之间的空间中的第一树脂; 以及安装在半导体装置的半导体装置的正面侧的电子部件，其中，接合强度增强树脂部至少设置在半导体装置的角部附近的侧面和所述基板处于与所述角部对应的位置。

8. 发明授权

US5589724A Piezoelectric device and a package 失效
标题翻译：压电器件和封装
公开(公告)号：US5589724A
公开(公告)日：1996-12-31
申请号：US350717
申请日：1994-12-07
申请人： Yuki Satoh , Toshio Ishizaki , Tsuyoshi Sakaue , Koji Hashimoto , Tohru Yamada , Tomoki Uwano
发明人： Yuki Satoh , Toshio Ishizaki , Tsuyoshi Sakaue , Koji Hashimoto , Tohru Yamada , Tomoki Uwano
IPC分类号： H01C1/02 , H01L23/08 , H01L41/053 , H03H3/007 , H03H9/02 , H03H9/05 , H03H9/10 , H03H9/13 , H03H9/17 , H03H9/25 , H03H9/56 , H05K5/06 , H01L41/08
CPC分类号： H03H9/1071 , H03H9/1035
摘要： A piezoelectric device includes a piezoelectric plate provided with at least one electrode at almost a central portion of each face; a first plate made of an ionic material having a recessed portion to cover the at least one electrode at one face to face the piezoelectric plate; and a second plate made of an ionic material having a recessed portion to cover the at least one electrode at one face to face the piezoelectric plate. Each of the at least one electrode is packaged by direct bonding the piezoelectric plate with the first plate and the second plate so as to be sandwiched therebetween. A package includes a body member made of an ionic material provided with a recessed portion or an opening, having a flat face around the recessed portion or the opening; and a covering member made of an ionic material having a flat face to cover the body member. The flat face of the body member and the flat face of the covering member are cleaned and attached to each other so as to be direct bonded with each other using hydrogen bonds generated between the ionic materials, thereby packaging the recessed portion or the opening.
摘要翻译：压电装置包括在每个面的几乎中心部分设置有至少一个电极的压电板; 由离子材料制成的第一板，具有在一个面上覆盖所述至少一个电极的凹部以面对所述压电板; 以及由具有凹部的离子材料制成的第二板，以在一个面上覆盖所述至少一个电极以面对所述压电板。通过将压电板与第一板和第二板直接接合以夹在它们之间来封装至少一个电极中的每一个。一种包装体，包括由设置有凹部或开口的离子性材料制成的本体部件，该凹部或开口具有围绕凹部或开口的平坦面; 以及由具有平坦面的离子材料制成的覆盖部件，以覆盖主体部件。本体构件的平面和覆盖构件的平面被清洁并彼此附接，以便使用在离子材料之间产生的氢键彼此直接接合，从而封装凹部或开口。

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