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    • 2. 发明授权
    • Semiconductor memory device and method of testing the device
    • 半导体存储器件及其测试方法
    • US06985395B2
    • 2006-01-10
    • US10884105
    • 2004-07-01
    • Takanori YoshimatsuTakehiko HojoKaoru Tokushige
    • Takanori YoshimatsuTakehiko HojoKaoru Tokushige
    • G11C7/00
    • G11C29/44
    • A semiconductor memory device is disclosed, which includes a memory cell array including memory cells arranged in rows and columns, a word line, a bit line, a row decoder and a column decoder, a sense amplifier provided for each of the columns of the memory cell array, a write latch circuit configured to store externally input data and sets data of one row of the memory cell array in the sense amplifiers in test mode, a read latch circuit configured to store data of one row, which is read from the memory cell array and set in the sense amplifiers in test mode, a first comparison circuit configured to compare the data stored in the write latch circuit and the data stored in the read latch circuit, and a first comparison result register configured to store a comparison result of the first comparison circuit.
    • 公开了一种半导体存储器件,其包括存储单元阵列,该存储单元阵列包括以行和列排列的存储单元,字线,位线,行解码器和列解码器,为存储器的每列提供的读出放大器 单元阵列,写锁存电路,被配置为存储外部输入数据,并以测试模式设置读出放大器中的一行存储单元阵列的数据;读锁存器电路,被配置为存储从存储器读取的一行数据 单元阵列,并且在测试模式下设置在读出放大器中,第一比较电路,被配置为将存储在写入锁存电路中的数据与存储在读取锁存电路中的数据进行比较;第一比较结果寄存器,被配置为存储比较结果 第一个比较电路。
    • 4. 发明申请
    • Semiconductor memory device and method of testing the device
    • 半导体存储器件及其测试方法
    • US20050068816A1
    • 2005-03-31
    • US10884105
    • 2004-07-01
    • Takanori YoshimatsuTakehiko HojoKaoru Tokushige
    • Takanori YoshimatsuTakehiko HojoKaoru Tokushige
    • G11C29/12G11C11/401G11C29/04G11C29/44G11C7/00
    • G11C29/44
    • A semiconductor memory device is disclosed, which comprises a memory cell array including memory cells arranged in rows and columns, a word line, a bit line, a row decoder and a column decoder, a sense amplifier provided for each of the columns of the memory cell array, a write latch circuit configured to store externally input data and sets data of one row of the memory cell array in the sense amplifiers in test mode, a read latch circuit configured to store data of one row, which is read from the memory cell array and set in the sense amplifiers in test mode, a first comparison circuit configured to compare the data stored in the write latch circuit and the data stored in the read latch circuit, and a first comparison result register configured to store a comparison result of the first comparison circuit.
    • 公开了一种半导体存储器件,其包括存储单元阵列,该存储单元阵列包括以行和列排列的存储单元,字线,位线,行解码器和列解码器,为存储器的每列提供的读出放大器 单元阵列,写锁存电路,被配置为存储外部输入数据,并以测试模式设置读出放大器中的一行存储单元阵列的数据;读锁存器电路,被配置为存储从存储器读取的一行数据 单元阵列,并且在测试模式下设置在读出放大器中,第一比较电路,被配置为将存储在写入锁存电路中的数据与存储在读取锁存电路中的数据进行比较;第一比较结果寄存器,被配置为存储比较结果 第一个比较电路。
    • 7. 发明授权
    • Semiconductor integrated circuit and redundancy method thereof
    • 半导体集成电路及其冗余方法
    • US07908527B2
    • 2011-03-15
    • US12186899
    • 2008-08-06
    • Koji KoharaTakehiko Hojo
    • Koji KoharaTakehiko Hojo
    • G11C29/00
    • G11C29/848G11C29/802
    • A semiconductor integrated circuit includes a main memory cell array, redundancy memory cell array, memory macro and repair information transferring circuit. A repair information analyzing circuit fetches repair information of transferred unit repair information therein, outputs the repair information to the memory macro having a redundancy repair mechanism and subjects the memory macro to a redundancy repair process by the redundancy repair mechanism of the memory macro in a case where memory identification information of the transferred unit repair information coincides with memory identification information stored in a nonvolatile memory element.
    • 半导体集成电路包括主存储单元阵列,冗余存储单元阵列,存储器宏和修复信息传送电路。 维修信息分析电路取出传送的单元修复信息的修复信息,将修复信息输出到具有冗余修复机构的存储器宏,并通过存储器宏的冗余修复机制将存储器宏进行冗余修复处理 所传送的单元修复信息的存储器识别信息与存储在非易失性存储元件中的存储器识别信息一致。
    • 8. 发明申请
    • SEMICONDUCTOR INTEGRATED CIRCUIT AND REDUNDANCY METHOD THEREOF
    • 半导体集成电路及其冗余方法
    • US20090044045A1
    • 2009-02-12
    • US12186899
    • 2008-08-06
    • Koji KoharaTakehiko Hojo
    • Koji KoharaTakehiko Hojo
    • G06F11/20
    • G11C29/848G11C29/802
    • A semiconductor integrated circuit includes a main memory cell array, redundancy memory cell array, memory macro and repair information transferring circuit. A repair information analyzing circuit fetches repair information of transferred unit repair information therein, outputs the repair information to the memory macro having a redundancy repair mechanism and subjects the memory macro to a redundancy repair process by the redundancy repair mechanism of the memory macro in a case where memory identification information of the transferred unit repair information coincides with memory identification information stored in a nonvolatile memory element.
    • 半导体集成电路包括主存储单元阵列,冗余存储单元阵列,存储器宏和修复信息传送电路。 维修信息分析电路取出传送的单元修复信息的修复信息,将修复信息输出到具有冗余修复机构的存储器宏,并通过存储器宏的冗余修复机制将存储器宏进行冗余修复处理 所传送的单元修复信息的存储器识别信息与存储在非易失性存储元件中的存储器识别信息一致。