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    • 2. 发明授权
    • Integrated electrostatic discharge (ESD) device
    • 集成静电放电(ESD)器件
    • US08891213B2
    • 2014-11-18
    • US13244292
    • 2011-09-24
    • Chi Kang LiuTa Lee YuQuan Li
    • Chi Kang LiuTa Lee YuQuan Li
    • H02H9/00H01L27/02H01L29/78H02H3/22H02H3/02H02H3/08
    • H01L27/0259H01L29/7835
    • A semiconductor device for ESD protection includes a semiconductor substrate of a first conductivity type and a well region of a second conductivity type formed within the substrate. The well region is characterized by a first depth. The device includes an MOS transistor, a first bipolar transistor, and a second bipolar transistor. The MOS transistor includes a first lightly doped drain (LDD) region of a second depth within the well region, and a drain region and an emitter region within in the first LDD region. The emitter region is characterized by a second conductivity type. The first bipolar transistor is associated with the emitter region, the first LDD region, and the well region, and is characterized by a first trigger voltage. The second bipolar transistor is associated with the first LDD region, the well region, and the substrate, and is characterized by a second trigger voltage.
    • 用于ESD保护的半导体器件包括形成在衬底内的第一导电类型的半导体衬底和第二导电类型的阱区。 井区的特征在于第一深度。 该器件包括MOS晶体管,第一双极晶体管和第二双极晶体管。 MOS晶体管包括在阱区内的第二深度的第一轻掺杂漏极(LDD)区域,以及在第一LDD区域内的漏极区域和发射极区域。 发射极区域的特征在于第二导电类型。 第一双极晶体管与发射极区域,第一LDD区域和阱区域相关联,并且其特征在于第一触发电压。 第二双极晶体管与第一LDD区,阱区和衬底相关联,并且其特征在于第二触发电压。
    • 3. 发明申请
    • Micro Damper Device
    • 微型阻尼器
    • US20140092548A1
    • 2014-04-03
    • US13762494
    • 2013-02-08
    • Kun-Ta Lee
    • Kun-Ta Lee
    • H05K7/00
    • H05K7/00G11B33/08
    • A micro damper device comprising a main body, a cover, a sensor component and a control component is provided. The main body has a first surface, a second surface, a convex and a coil. A current is introduced to the coil to form a magnetic field with a first and a second magnetic pole. The cover has a first end, a second end and a first magnetic component. The sensor component is disposed on a side opposite the convex to measure a first vibration direction of the second surface. The control component is electrically connected between the sensor component and the coil and controls the current for adjusting the polarity and the strength of the first magnetic pole for producing a force between the first magnetic pole and a third magnetic pole, which makes the main body move along a second vibration direction opposite the first vibration direction.
    • 提供一种包括主体,盖,传感器部件和控制部件的微型阻尼器装置。 主体具有第一表面,第二表面,凸起和线圈。 电流被引入线圈以与第一和第二磁极形成磁场。 盖具有第一端,第二端和第一磁性部件。 传感器部件设置在与凸部相对的一侧,以测量第二表面的第一振动方向。 控制部件电连接在传感器部件和线圈之间,并且控制用于调节第一磁极的极性和强度的电流,以在第一磁极和第三磁极之间产生力,这使得主体移动 沿着与第一振动方向相反的第二振动方向。
    • 5. 发明申请
    • IMPACT ASSEMBLY
    • 冲击装配
    • US20130283885A1
    • 2013-10-31
    • US13530877
    • 2012-06-22
    • Kun Ta LEE
    • Kun Ta LEE
    • G01N3/30
    • G01M7/022G01M7/08G01N3/307
    • An impact assembly including an impact platform and at least two impact generating devices is provided. The at least two impact generating devices are disposed adjacent to each other in pair and detachably mounted to the impact platform. Each of the at least two impact generating devices has a housing and an impact generating unit. The housing is adapted to form a compartment where the impact generating unit is disposed. The impact generating units of the at least two impact generating devices provide at least two impact forces to the impact platform according to the at least two corresponding timings.
    • 提供了包括冲击平台和至少两个冲击产生装置的冲击组件。 所述至少两个冲击产生装置彼此相邻设置并且可拆卸地安装到冲击平台。 所述至少两个冲击产生装置中的每一个具有壳体和冲击产生单元。 壳体适于形成设置有冲击产生单元的隔间。 至少两个冲击产生装置的冲击产生单元根据至少两个对应的定时向冲击平台提供至少两个冲击力。
    • 6. 发明授权
    • Microelectronic device and fabricating method thereof and MEMS package structure and fabricating method thereof
    • 微电子器件及其制造方法和MEMS封装结构及其制造方法
    • US08372675B2
    • 2013-02-12
    • US12756558
    • 2010-04-08
    • Hsin-Hui HsuSheng-Ta LeeChuan-Wei Wang
    • Hsin-Hui HsuSheng-Ta LeeChuan-Wei Wang
    • H01L21/00
    • B81B3/0018B81C1/00015B81C1/00246B81C1/00333B81C2203/0145B81C2203/0714H01L21/768H01L27/1443H01L27/14632
    • A fabricating method of a microelectronic device including the following steps is provided. First, a substrate is provided. Second, a semi-conductor element is formed in a CMOS circuit region of the substrate. Next, a plurality of metallic layer, a plurality of contact plugs and a plurality of oxide layer are formed on the substrate. The metallic layers and the oxide layers are interlaced with each other and the contact plugs are formed in the oxide layers and connected with the metallic layers correspondingly so as to form a micro electromechanical system (MEMS) structure within a MEMS region and an interconnecting structure within the CMOS circuit region. Then, a first protective layer is formed on at least one of the oxide layers and a second protective layer is formed on the interconnecting structure. Predetermined portions of the oxide layers located within the MEMS region are removed and thereby the MEMS structure is partially suspended above the substrate. The present invention also provides a microelectronic device, a MEMS package structure and a fabricating method thereof.
    • 提供了一种包括以下步骤的微电子器件的制造方法。 首先,提供基板。 第二,半导体元件形成在衬底的CMOS电路区域中。 接下来,在基板上形成多个金属层,多个接触插塞和多个氧化物层。 金属层和氧化物层彼此交织并且接触塞形成在氧化物层中并且相应地与金属层连接,以便在MEMS区域内形成微机电系统(MEMS)结构,并且在MEMS区域内形成互连结构 CMOS电路区域。 然后,在至少一个氧化物层上形成第一保护层,在互连结构上形成第二保护层。 位于MEMS区域内的氧化物层的预定部分被去除,从而将MEMS结构部分地悬置在衬底上。 本发明还提供一种微电子器件,一种MEMS封装结构及其制造方法。
    • 9. 发明授权
    • MEMS device and MEMS spring element
    • MEMS器件和MEMS弹簧元件
    • US08183650B2
    • 2012-05-22
    • US12756305
    • 2010-04-08
    • Chuan-Wei WangSheng-Ta LeeHsin-Hui Hsu
    • Chuan-Wei WangSheng-Ta LeeHsin-Hui Hsu
    • H01L21/02
    • B81B3/0072B81B2201/025B81B2203/0118
    • A micro electromechanical system (MEMS) spring element is disposed on a substrate, and includes a fixing portion and a moveable portion. The fixing portion is fixed on the substrate, and includes an insulating layer, a plurality of metal-fixing layers and a plurality of supporting-fixing layers. The insulating layer is disposed on the substrate. The metal-fixing layers are disposed above the insulating layer. The supporting-fixing layers are connected between the metal-fixing layers. The moveable portion has a first end and a second end. The first end is connected with the fixing portion, and the second end is suspended above the substrate. The moveable portion includes a plurality of metal layers and at least a supporting layer. The supporting layer is connected between the adjacent metal layers, and a hollow region is formed between the supporting layer and the adjacent metal layers. The deformation of the MEMS spring element generated because of the different thermal expansion may be avoided and the working performance of the MEMS spring element can be improved.
    • 微机电系统(MEMS)弹簧元件设置在基板上,并且包括固定部分和可移动部分。 固定部固定在基板上,具有绝缘层,多个金属固定层和多个支撑固定层。 绝缘层设置在基板上。 金属固定层设置在绝缘层的上方。 支撑固定层连接在金属固定层之间。 可移动部分具有第一端和第二端。 第一端与固定部分连接,第二端悬挂在基板上。 可移动部分包括多个金属层和至少一个支撑层。 支撑层连接在相邻的金属层之间,并且在支撑层和相邻金属层之间形成中空区域。 可以避免由于不同的热膨胀而产生的MEMS弹簧元件的变形,并且可以提高MEMS弹簧元件的工作性能。