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1. 发明公开

US20240298712A1 AEROSOL GENERATING DEVICE AND METHOD 审中-公开
公开(公告)号：US20240298712A1
公开(公告)日：2024-09-12
申请号：US18563698
申请日：2023-06-20
申请人： Ju Eon PARK , Tae Hun KIM , Sung Wook YOON , Hyung Jin JUNG , Jung Ho HAN
发明人： Ju Eon PARK , Tae Hun KIM , Sung Wook YOON , Hyung Jin JUNG , Jung Ho HAN
IPC分类号： A24F40/53 , A24F40/40
CPC分类号： A24F40/53 , A24F40/40
摘要： An aerosol generating device includes: a main body including a semi-exterior portion on a surface of which a 1-1st contact electrode and a 1-2nd contact electrode are formed to be apart from each other; a cover detachably coupled to the main body and including a 2-1st contact electrode corresponding to the 1-1st contact electrode and a 2-2nd contact electrode corresponding to the 1-2nd contact electrode; and a controller configured to determine that the cover is mounted on the main body when the 1-1st contact electrode and the 1-2nd contact electrode are electrically connected to each other.

2. 发明授权

US09108594B2 Multi-adapter for a vehicle wiper 有权
标题翻译：汽车雨刮器的多适配器
公开(公告)号：US09108594B2
公开(公告)日：2015-08-18
申请号：US13392342
申请日：2010-08-24
申请人： Tae Hun Kim
发明人： Tae Hun Kim
IPC分类号： B60S1/40 , B60S1/38
CPC分类号： B60S1/387 , B60S1/3881 , B60S1/4003 , B60S1/4006 , B60S1/4009 , B60S1/407 , B60S1/4074 , B60S1/4077 , B60S2001/408
摘要： A multi-adapter for a vehicle wiper, having a joining portion coupled to a wiper blade with a pair of side plates protruding from the joining portion such that the side plates are parallel to each other. The side plates have a plurality of pin coupling portions formed at the pair of side plates, and to which wiper arm with pins of different sizes are selectively coupled. A plurality of protrusions are formed, on at least one of the pair of the side plates so as to maintain a gap between the wiper arm and the pair of side plates.
摘要翻译：一种用于车辆刮水器的多适配器，具有连接部分，该接合部分与从刮片连接的一对侧板连接到刮水片上，使得侧板彼此平行。所述侧板具有形成在所述一对侧板上的多个销联接部，并且具有不同尺寸的销的刮水臂被选择性地联接到该对。在一对侧板中的至少一个上形成有多个突起，以便在刮水臂和一对侧板之间保持间隙。

3. 发明授权

US08946748B2 Semiconductor light emitting device including rear reflective part 有权
标题翻译：半导体发光器件包括后反射部分
公开(公告)号：US08946748B2
公开(公告)日：2015-02-03
申请号：US13478849
申请日：2012-05-23
申请人： Tae Hun Kim , Seung Wan Chae , Yong Il Kim , Seung Jae Lee , Tae Sung Jang , Jong Rak Sohn , Bo Kyoung Kim
发明人： Tae Hun Kim , Seung Wan Chae , Yong Il Kim , Seung Jae Lee , Tae Sung Jang , Jong Rak Sohn , Bo Kyoung Kim
IPC分类号： H01L33/00 , H01L27/15 , H01L33/46 , H01L33/20
CPC分类号： H01L33/46 , H01L33/20 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49107 , H01L2224/73265 , H01L2224/83385 , H01L2924/00014 , H01L2924/00
摘要： There is provided a semiconductor light emitting device including: a light transmissive substrate; a light emitting part; first and second electrodes electrically connected to the first and second conductivity type semiconductor layers, respectively; and a rear reflective part including a reflective metallic layer, and a light transmissive dielectric layer interposed between the light transmissive substrate and the reflective metallic layer.
摘要翻译：提供了一种半导体发光器件，包括：透光衬底; 发光部分; 分别与第一和第二导电类型半导体层电连接的第一和第二电极; 以及包括反射金属层的后反射部分和介于透光基板和反射金属层之间的透光电介质层。

4. 发明授权

US08839482B2 Method of assembling metal clamp and body springs of wiper blade for vehicle and assembly 有权
标题翻译：用于车辆和组件的刮水片组装金属夹和本体弹簧的方法
公开(公告)号：US08839482B2
公开(公告)日：2014-09-23
申请号：US12618738
申请日：2009-11-15
申请人： Tae Hun Kim , Sang Cheol Lee , Dong Geun Lee , Yong Ki Choi
发明人： Tae Hun Kim , Sang Cheol Lee , Dong Geun Lee , Yong Ki Choi
IPC分类号： B60S1/02 , B60S1/38
CPC分类号： B60S1/3858 , B60S1/3855 , B60S1/3879 , Y10T29/49826
摘要： Disclosed is a method of assembling a metal clamp and body springs of a wiper blade for vehicles, and an assembly. The method includes forming a plurality of through holes at major sides of the body springs, forming a plurality of protrusions corresponding to the through holes at a major side of the clamp such that the protrusions extend outward from the major side of the clamp, inserting the protrusions of the clamp into the respective through holes of the body springs, fixing the protrusions, which are located in the respective through holes, in the respective through holes by pressure welding or riveting such that the clamp is mounted to the body springs.
摘要翻译：公开了一种组装用于车辆的刮水片的金属夹具和主体弹簧的组装方法。该方法包括在主体弹簧的主侧面上形成多个通孔，在夹具的主侧形成与通孔相对应的多个突起，使得突起从夹具的主侧向外延伸，将夹具的突出物插入主体弹簧的相应通孔中，通过压力焊接或铆接将位于各个通孔中的突起固定在相应的通孔中，使得夹具安装到主体弹簧。

5. 发明授权

US08653640B2 Semiconductor package apparatus 有权
标题翻译：半导体封装设备
公开(公告)号：US08653640B2
公开(公告)日：2014-02-18
申请号：US13440817
申请日：2012-04-05
申请人： Tae-hun Kim , Dae-young Choi , Yang-hoon Ahn , Sun-hye Lee
发明人： Tae-hun Kim , Dae-young Choi , Yang-hoon Ahn , Sun-hye Lee
IPC分类号： H01L23/488
CPC分类号： H01L23/49811 , H01L23/49816 , H01L24/13 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/105 , H01L2224/13111 , H01L2224/13116 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13169 , H01L2224/16225 , H01L2224/32225 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/45157 , H01L2224/45164 , H01L2224/45166 , H01L2224/45169 , H01L2224/45171 , H01L2224/48227 , H01L2224/73253 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2225/1082 , H01L2924/01047 , H01L2924/12042 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/18161 , H01L2924/00012 , H01L2924/0105 , H01L2924/01029 , H01L2924/01013 , H01L2924/00 , H01L2924/00014
摘要： A semiconductor package apparatus includes a first semiconductor package including a first semiconductor chip, a first substrate, a first terminal, and a first signal transfer medium, and a second semiconductor package including a second semiconductor chip, a second substrate, a second terminal, and a second signal transfer medium. At least one package connecting solder ball is located between the first terminal and the second terminal. A first solder ball guide member is positioned around the first terminal of the first substrate and includes a first guide surface for guiding a shape of the package connecting solder ball.
摘要翻译：半导体封装装置包括：第一半导体封装，包括第一半导体芯片，第一基板，第一端子和第一信号传输介质;以及第二半导体封装，包括第二半导体芯片，第二基板，第二端子和第二信号传送介质。至少一个连接焊球的封装位于第一端子和第二端子之间。第一焊球引导构件围绕第一基板的第一端子定位，并且包括用于引导封装连接焊球的形状的第一引导表面。

6. 发明授权

US08558814B2 Mobile terminal and control method thereof 有权
标题翻译：移动终端及其控制方法
公开(公告)号：US08558814B2
公开(公告)日：2013-10-15
申请号：US13218351
申请日：2011-08-25
申请人： Tae Hun Kim
发明人： Tae Hun Kim
IPC分类号： G06F3/045
CPC分类号： G06F3/165 , G06F3/041 , G06F3/04883 , G06F3/04886 , G06F17/30752
摘要： An electronic device and a method for inputting information through touch input device of an electronic device is provided. The method inputs information including at least one of symbols and characters through touching of a screen displayed on the touch input device, and executes a specific application capable of processing the input information.
摘要翻译：提供了一种通过电子设备的触摸输入设备输入信息的电子设备和方法。该方法通过触摸在触摸输入设备上显示的屏幕来输入包括符号和字符中的至少一个的信息，并执行能够处理输入信息的特定应用。

7. 发明申请

US20130240937A1 SEMICONDUCTOR LIGHT-EMITTING DIODE CHIP, LIGHT-EMITTING DEVICE, AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：半导体发光二极管芯片，发光器件及其制造方法
公开(公告)号：US20130240937A1
公开(公告)日：2013-09-19
申请号：US13820459
申请日：2011-09-01
申请人： Seung Wan Chae , Tae Hun Kim , Su Yeol Lee , Jin Bock Lee , Jin Hwan Kim , Seung Jae Lee , Bo Kyoung Kim , Jong Ho Lee
发明人： Seung Wan Chae , Tae Hun Kim , Su Yeol Lee , Jin Bock Lee , Jin Hwan Kim , Seung Jae Lee , Bo Kyoung Kim , Jong Ho Lee
IPC分类号： H01L33/46
CPC分类号： H01L33/46 , H01L24/32 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/15788 , H01L2924/00014 , H01L2924/00
摘要： There is provided a semiconductor light emitting diode (LED) chip including: a semiconductor light emitting diode unit including a light-transmissive substrate, and a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer sequentially formed on an upper surface of the light-transmissive substrate; a rear reflective laminate including an auxiliary optical layer formed on a lower surface of the light-transmissive substrate and made of a material having a predetermined refractive index and a metal reflective film formed on a lower surface of the auxiliary optical layer; and a bonding laminate provided on a lower surface of the rear reflective laminate and including a bonding metal layer made of a eutectic metal material and an anti-diffusion film formed to prevent diffusion of elements between the bonding metal layer and the metal reflective film.
摘要翻译：提供了一种半导体发光二极管（LED）芯片，其包括：半导体发光二极管单元，包括透光基板，以及顺序形成的第一导电型半导体层，有源层和第二导电类型半导体层在所述透光性基板的上表面上; 后反光层叠体，其包括形成在所述透光性基板的下表面上并由具有预定折射率的材料制成的辅助光学层和形成在所述辅助光学层的下表面上的金属反射膜; 以及设置在后反射层叠体的下表面上并包括由共晶金属材料制成的接合金属层和形成为防止元件在接合金属层和金属反射膜之间扩散的防扩散膜的接合层压体。

8. 发明授权

US08494356B2 Compact pop-up camera flashes 有权
标题翻译：紧凑型弹出式相机闪烁
公开(公告)号：US08494356B2
公开(公告)日：2013-07-23
申请号：US13271545
申请日：2011-10-12
申请人： Tae-hun Kim , Seung-tack Noh
发明人： Tae-hun Kim , Seung-tack Noh
IPC分类号： G03B15/03
CPC分类号： G03B17/566 , G03B2215/0507 , G03B2215/056
摘要： Example pop-up camera flashes are disclosed. A disclosed example pop-up flash of a camera includes a supporting unit; a rotating unit, which is rotatably connected to the supporting unit and is able to rotate between a first position, at which the rotating unit is adjacent to the supporting unit, and a second position, at which the rotating unit is apart from the supporting unit; a sliding unit, which is slidably combined with the rotating unit; a light emitting unit, which is arranged at the sliding unit; a connecting unit, of which a first end is rotatably connected to the sliding unit and a second end is rotatably connected to the supporting unit; and a driving unit, which is connected to the connecting unit and provides a driving force for rotation of the connecting unit.
摘要翻译：公开了示例性的弹出式照相机闪光。照相机的公开示例弹出闪光灯包括支撑单元; 旋转单元，其可旋转地连接到支撑单元，并且能够在旋转单元邻近支撑单元的第一位置和第二位置之间旋转，旋转单元与支撑单元分离 ; 滑动单元，其与所述旋转单元可滑动地组合; 布置在滑动单元处的发光单元; 连接单元，其第一端可旋转地连接到滑动单元，第二端可旋转地连接到支撑单元; 以及驱动单元，其连接到连接单元并且提供用于连接单元的旋转的驱动力。

9. 发明授权

US08487334B2 Semiconductor light emitting diode chip and light emitting device using the same 失效
标题翻译：半导体发光二极管芯片和发光装置使用相同
公开(公告)号：US08487334B2
公开(公告)日：2013-07-16
申请号：US13279782
申请日：2011-10-24
申请人： Seung Wan Chae , Tae Hun Kim , Su Yeol Lee , Sung Tae Kim , Jong Ho Lee
发明人： Seung Wan Chae , Tae Hun Kim , Su Yeol Lee , Sung Tae Kim , Jong Ho Lee
IPC分类号： H01L33/00
CPC分类号： H01L33/46 , H01L33/20
摘要： A semiconductor light emitting device includes: a light emitting diode unit including a light-transmissive substrate having a face sloped upwardly at a lower edge thereof. A rear reflective lamination body is formed on the lower face and the surrounding sloped face of the light-transmissive substrate. The rear reflective lamination body includes an optical auxiliary layer and a metal reflective film formed on a lower face of the optical auxiliary layer. A junction lamination body is provided to a lower face of the rear reflective lamination body. The junction lamination body including a junction metal layer made of a eutectic metal material and a diffusion barrier film.
摘要翻译：一种半导体发光器件包括：发光二极管单元，其包括具有在其下边缘向上倾斜的面的透光基板。背光层叠体形成在透光性基板的下表面和周边的倾斜面上。后反光层叠体包括光辅助层和形成在光辅助层的下表面上的金属反射膜。在后反光层叠体的下表面设置有结层叠体。结合层叠体包括由共晶金属材料制成的结金属层和扩散阻挡膜。

10. 发明授权

US08478349B2 Method for executing menu in mobile terminal and mobile terminal using the same 有权
标题翻译：用于在移动终端和使用其的移动终端中执行菜单的方法
公开(公告)号：US08478349B2
公开(公告)日：2013-07-02
申请号：US12796487
申请日：2010-06-08
申请人： Kyeong-Hye Seo , Jang Jae Jung , Tae Hun Kim
发明人： Kyeong-Hye Seo , Jang Jae Jung , Tae Hun Kim
IPC分类号： G06F3/048 , G06F3/033 , H04W88/02
CPC分类号： H04M1/72583 , G06F3/04883 , H04M1/27455
摘要： The present disclosure is related to a method for executing a menu in a mobile terminal, the method comprising; inputting a drawing pattern on a touch screen of the mobile terminal; displaying a menu corresponding to the drawing pattern and a sub menu thereof on the touch screen by comparing a pre-stored drawing pattern table with the drawing pattern; and executing the sub menu by selecting the sub menu and a mobile terminal thereof.
摘要翻译：本公开涉及一种用于在移动终端中执行菜单的方法，该方法包括：在所述移动终端的触摸屏上输入画图; 通过将预先存储的绘图模式表与绘图模式进行比较，在触摸屏上显示与绘图模式对应的菜单及其子菜单; 以及通过选择子菜单及其移动终端来执行子菜单。

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