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    • 10. 发明授权
    • Method of forming fine patterns using double patterning process
    • 使用双重图案化工艺形成精细图案的方法
    • US07531449B2
    • 2009-05-12
    • US11730264
    • 2007-03-30
    • Sang-joon ParkYong-hyun KwonJun SeoSung-il ChoChang-jin KangJae-kyu Ha
    • Sang-joon ParkYong-hyun KwonJun SeoSung-il ChoChang-jin KangJae-kyu Ha
    • H01L21/4763
    • H01L21/0337H01L21/0338H01L21/31144H01L21/76816H01L21/76897
    • A double pattern method of forming a plurality of contact holes in a material layer formed on a substrate is disclosed. The method forms a parallel plurality of first hard mask patterns separated by a first pitch in a first direction on the material layer, a self-aligned parallel plurality of second hard mask patterns interleaved with the first hard mask patterns and separated from the first hard mask patterns by a buffer layer to form composite mask patterns, and a plurality of upper mask patterns in a second direction intersecting the first direction to mask selected portions of the buffer layer in conjunction with the composite mask patterns. The method then etches non-selected portions of the buffer layer using the composite hard mask patterns and the upper mask patterns as an etch mask to form a plurality of hard mask holes exposing selected portions of the material layer, and then etches the selected portions of the material layer to form the plurality of contact holes.
    • 公开了一种在形成在基板上的材料层中形成多个接触孔的双重图案方法。 该方法形成在材料层上沿第一方向以第一间距分开的平行多个第一硬掩模图案,与第一硬掩模图案交错并与第一硬掩模分离的自对准并行多个第二硬掩模图案 通过缓冲层形成图案以形成复合掩模图案,以及与第一方向相交的第二方向的多个上掩模图案,以与复合掩模图案一起掩蔽缓冲层的选定部分。 然后,该方法使用复合硬掩模图案和上掩模图案作为蚀刻掩模蚀刻缓冲层的未选择部分,以形成暴露材料层的选定部分的多个硬掩模孔,然后蚀刻所选择的部分 所述材料层形成所述多个接触孔。