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1. 发明申请

US20050258570A1 Imprinting of supported and free-standing 3-D micro- or nano-structures 有权
标题翻译：支持和独立的3-D微结构或纳米结构的印刷
公开(公告)号：US20050258570A1
公开(公告)日：2005-11-24
申请号：US10852448
申请日：2004-05-24
申请人： Yen Kong , Hong Low , Stella Pang , Albert Yee
发明人： Yen Kong , Hong Low , Stella Pang , Albert Yee
IPC分类号： B28B11/08 , B29C59/02 , B81C1/00 , B81C99/00 , B82B3/00 , G03C5/00 , G03F7/00
CPC分类号： A61M25/00 , B27N3/08 , B28B3/06 , B81C99/0085 , B81C2201/034 , B81C2203/032 , B81C2203/038 , B82Y10/00 , B82Y40/00 , G03F7/0002 , Y10T428/24479 , Y10T428/254
摘要： The present invention is directed to micro- and nano-scale imprinting methods and the use of such methods to fabricate supported and/or free-standing 3-D micro- and/or nano-structures of polymeric, ceramic, and/or metallic materials. In some embodiments, a duo-mold approach is employed in the fabrication of these structures. In such methods, surface treatments are employed to impart differential surface energies to different molds and/or different parts of the mold(s). Such surface treatments permit the formation of three-dimensional (3-D) structures through imprinting and the transfer of such structures to a substrate. In some or other embodiments, such surface treatments and variation in glass transition temperature of the polymers used can facilitate separation of the 3-D structures from the molds to form free-standing micro- and/or nano-structures individually and/or in a film. In some or other embodiments, a “latch-on” assembly technique is utilized to form supported and/or free-standing stacked micro- and/or nano-structures that enable the assembly of polymers without a glass transition temperature and eliminate the heating required to assemble thermoplastic polymers.
摘要翻译：本发明涉及微尺度和纳米级压印方法，并且使用这种方法来制造聚合物，陶瓷和/或金属材料的负载和/或独立的3-D微观和/或纳米结构。在一些实施例中，在制造这些结构中采用双模方法。在这种方法中，使用表面处理以将不同的表面能赋予模具的不同模具和/或模具的不同部分。这种表面处理允许通过压印形成三维（3-D）结构并将这种结构转移到基底上。在一些或其它实施方案中，所使用的聚合物的这种表面处理和玻璃化转变温度的变化可促进3-D结构与模具的分离，以单独形成独立的和/或纳米结构，并且/ 电影。在一些或其它实施方案中，使用“闭锁”组装技术来形成支撑和/或独立堆叠的微结构和/或纳米结构，其能够组装聚合物而不具有玻璃化转变温度并消除所需的加热组装热塑性聚合物。

2. 发明申请

US20070059497A1 Reversal imprint technique 审中-公开
标题翻译：反转印记技术
公开(公告)号：US20070059497A1
公开(公告)日：2007-03-15
申请号：US10513704
申请日：2002-05-08
申请人： Xudong Huang , Li-Rong Bao , Xing Cheng , Lingjie Guo , Stella Pang
发明人： Xudong Huang , Li-Rong Bao , Xing Cheng , Lingjie Guo , Stella Pang
IPC分类号： B05D5/12 , B41M5/00 , B05D3/12
CPC分类号： G03F7/0002 , B29C33/42 , B82Y10/00 , B82Y40/00 , H05K3/0079 , Y10T428/24802
摘要： The present invention relates to a method for imprinting a micro-/nano-structure on a substrate, the method comprising (a) providing a mold containing a desired pattern or relief for a microstructure; (b) applying a polymer coating to the mold; and (c) transferring the polymer coating from the mold to a substrate under suitable temperature and pressure conditions to form an imprinted substrate having a desired micro-/nano-structure thereon.
摘要翻译：本发明涉及一种用于将微/纳米结构压印在基底上的方法，所述方法包括（a）提供含有微结构的所需图案或凹凸的模具; （b）将聚合物涂层施加到模具上; 和（c）在合适的温度和压力条件下将聚合物涂层从模具转移到基底上以形成其上具有所需微/纳米结构的印迹基底。

3. 发明申请

US20070056680A1 Imprinting polymer film on patterned substrate 失效
标题翻译：图案化基材上的压印聚合物膜
公开(公告)号：US20070056680A1
公开(公告)日：2007-03-15
申请号：US10558032
申请日：2004-05-20
申请人： Li Tan , Yen-Peng Kong , Stella Pang , Albert Yee
发明人： Li Tan , Yen-Peng Kong , Stella Pang , Albert Yee
IPC分类号： B29C37/00 , B44C1/17 , B05C11/00
CPC分类号： B81C1/0046
摘要： A method of applying a pattern on a topography includes first applying a polymer film to an elastomer member, such as PDMS, to form a pad. The pad is then applied to a substrate having a varying topography under pressure. The polymer film is transferred to the substrate due to the plastic deformation of the polymer film under pressure compared to the elastic deformation of the PDMS member. Thus, upon removal of the pad from the substrate, the PDMS member pulls away from the polymer layer, thereby depositing the polymer layer upon the substrate.
摘要翻译：在图形上施加图案的方法包括首先将聚合物膜施加到诸如PDMS的弹性体构件上以形成垫。然后将该垫施加到在压力下具有变化的形貌的基底。与PDMS构件的弹性变形相比，由于聚合物膜在压力下的塑性变形，聚合物膜被转移到基底。因此，在从衬底移除衬垫时，PDMS构件从聚合物层拉开，从而将聚合物层沉积在衬底上。

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