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    • 1. 发明授权
    • Resist composition and method of forming resist pattern
    • 抗蚀剂图案的抗蚀剂组成和方法
    • US08034536B2
    • 2011-10-11
    • US12453857
    • 2009-05-26
    • Jun IwashitaShogo MatsumaruSho Abe
    • Jun IwashitaShogo MatsumaruSho Abe
    • G03F7/004G03F7/30
    • G03F7/0397G03F7/0045G03F7/0382Y10S430/111
    • A novel resist composition and method of forming a resist pattern that can be used in lithography applications. The resist composition includes a base component (A) that exhibits changed solubility in an alkali developing solution under action of acid, and an acid generator component (B) that generates acid upon exposure, wherein the base component (A) contains a polymer compound (A1) having a structural unit (a0) represented by general formula (a0-1) shown below, wherein R1 represents a hydrogen atom, an alkyl group of 1 to 5 carbon atoms or a fluorinated alkyl group of 1 to 5 carbon atoms, R2 and R3 each independently represents a hydrogen atom or an alkyl group that may include an oxygen atom at an arbitrary position, or R2 and R3 are bonded together to form an alkylene group, and W represents a cyclic alkylene group that may include an oxygen atom at an arbitrary position.
    • 形成可用于光刻应用的抗蚀剂图案的新型抗蚀剂组合物和方法。 抗蚀剂组合物包括在酸的作用下在碱性显影液中显示改变的溶解性的基础组分(A)和暴露时产生酸的酸产生剂组分(B),其中所述碱性组分(A)含有高分子化合物 A1)具有下述通式(a0-1)表示的结构单元(a0),其中R1表示氢原子,1〜5个碳原子的烷基或1〜5个碳原子的氟化烷基,R2 和R 3各自独立地表示氢原子或可以在任意位置含有氧原子的烷基,或者R 2和R 3结合在一起形成亚烷基,W表示可以包含氧原子的环状亚烷基 任意的位置
    • 7. 发明申请
    • FILM-FORMING MATERIAL AND METHOD OF FORMING PATTERN
    • 成膜材料和形成图案的方法
    • US20090134119A1
    • 2009-05-28
    • US11997300
    • 2006-08-24
    • Shogo MatsumaruHideo HadaFujikawa ShigenoriToyoki Kunitake
    • Shogo MatsumaruHideo HadaFujikawa ShigenoriToyoki Kunitake
    • C23F1/02
    • H01L21/0273C09D183/04G03F7/0755G03F7/40H01L21/31138H01L21/31144
    • A film-forming material that is capable of forming, at a low temperature, a film having a high degree of etching resistance and a high etching selectivity ratio relative to an organic film, as well as a method of forming a pattern that uses the film-forming material. The film-forming material includes a metal compound (W) capable of generating a hydroxyl group upon hydrolysis, and a solvent (S) in which the metal compound is dissolved, wherein the solvent (S) includes a solvent (S1) with a boiling point of at least 155° C. that contains no functional groups that react with the metal compound (W). The method of forming a pattern includes the steps of: coating a pattern, which has been formed on top of an organic film of a laminate that includes a substrate and the organic film, using the above film-forming material, and then conducting etching of the organic film using the pattern as a mask.
    • 能够在低温下形成相对于有机膜具有高耐蚀刻性和高蚀刻选择比的膜的成膜材料以及形成使用该膜的图案的方法 形成材料。 成膜材料包括水解时能够产生羟基的金属化合物(W)和其中溶解有金属化合物的溶剂(S),其中溶剂(S)包括沸腾的溶剂(S1) 至少155℃,不含与金属化合物(W)反应的官能团。 形成图案的方法包括以下步骤:使用上述成膜材料涂覆已经形成在包括基材和有机膜的层压体的有机膜的顶部上的图案,然后进行蚀刻 使用该图案作为掩模的有机膜。