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1. 发明授权

US06963124B1 Locking of mold compound to conductive substrate panels 有权
标题翻译：将模具化合物锁定到导电基板面板上
公开(公告)号：US06963124B1
公开(公告)日：2005-11-08
申请号：US10943476
申请日：2004-09-17
申请人： Harry Kam Cheng Hong , Hu Ah Lek , Santhiran Nadarajah , Sharon Ko Mei Wan , Chan Peng Yeen , Jaime Bayan , Peter Howard Spalding
发明人： Harry Kam Cheng Hong , Hu Ah Lek , Santhiran Nadarajah , Sharon Ko Mei Wan , Chan Peng Yeen , Jaime Bayan , Peter Howard Spalding
IPC分类号： H01L23/02 , H01L23/31 , H01L23/495
CPC分类号： H01L23/3121 , H01L23/3142 , H01L23/49548 , H01L24/97 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： A panel assembly of packaged integrated circuit devices including a conductive substrate panel having an array of device areas and a plurality of locking passageways. The locking passageways are positioned about an inactive buffer area which surrounds the periphery of the array of device areas. The panel assembly also includes a molded cap that is molded over the topside of the panel to encapsulate the array of device areas and the inactive buffer area. The molded cap includes conforming locking stem portions that extend into each of the locking passageways in a manner locking the molded cap to the substrate panel such that during singulation of the device areas, the molded cap will not separate from the substrate panel at the inactive buffer area. In another aspect of the invention, a method for producing the panel assembly having the locking passageways is described.
摘要翻译：一种封装集成电路器件的面板组件，包括具有一组器件区域的导电衬底面板和多个锁定通道。锁定通道围绕围绕装置区域阵列的周边的非活动缓冲区域定位。面板组件还包括模制顶盖，其模制在面板的顶部以封装装置区域阵列和非活动缓冲区域。模制帽包括符合锁定杆部分，其以将模制帽锁定到衬底面板的方式延伸到每个锁定通道中，使得在单元化设备区域期间，模制帽不会在非活动缓冲器处与衬底面板分离区。在本发明的另一方面，描述了一种用于制造具有锁定通道的面板组件的方法。

2. 发明授权

US06576989B1 Locking of mold compound to conductive substrate panels 失效
标题翻译：将模具化合物锁定到导电基板面板上
公开(公告)号：US06576989B1
公开(公告)日：2003-06-10
申请号：US09724727
申请日：2000-11-28
申请人： Harry Kam Cheng Hong , Hu Ah Lek , Santhiran Nadarajah , Sharon Ko Mei Wan , Chan Peng Yeen , Jaime Bayan , Peter Howard Spalding
发明人： Harry Kam Cheng Hong , Hu Ah Lek , Santhiran Nadarajah , Sharon Ko Mei Wan , Chan Peng Yeen , Jaime Bayan , Peter Howard Spalding
IPC分类号： H01L2302
CPC分类号： H01L23/13 , H01L23/3121 , H01L24/97 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： A panel assembly of packaged integrated circuit devices including conductive substrate panel having an array of device areas and a plurality of locking passageways. The locking passageways are positioned about an inactive buffer area which surrounds the periphery of the array of device areas. The locking passageways extend from a topside of the panel toward a bottom side of the panel. The panel assembly also includes a molded cap that is molded over the topside of the panel to encapsulate the array of device areas and the inactive buffer area. The molded cap includes conforming locking stem portions that extend into each of the locking passageways in a manner locking the molded cap to the substrate panel such that during singulation of the device areas, the molded cap will not separate from the substrate panel at the inactive buffer area. In another aspect of the invention, a method for producing the panel assembly having the locking passageways is described. The method involves providing a conductive substrate panel having the locking passageways and applying molding material to the topside of the substrate panel such that the solidified molding material forms stems that conform to the passageways.
摘要翻译：一种封装集成电路器件的面板组件，包括具有一组器件区域和多个锁定通道的导电衬底面板。锁定通道围绕围绕装置区域阵列的周边的非活动缓冲区域定位。锁定通道从面板的顶部朝向面板的底侧延伸。面板组件还包括模制顶盖，其模制在面板的顶部以封装装置区域阵列和非活动缓冲区域。模制帽包括符合锁定杆部分，其以将模制帽锁定到衬底面板的方式延伸到每个锁定通道中，使得在单元化设备区域期间，模制帽不会在非活动缓冲器处与衬底面板分离区。在本发明的另一方面，描述了一种用于制造具有锁定通道的面板组件的方法。该方法包括提供具有锁定通道的导电基板面板，并将模塑材料施加到基板面板的顶侧，使得固化的模制材料形成符合通道的阀杆。

3. 发明授权

US06933174B1 Leadless leadframe package design that provides a greater structural integrity 有权
标题翻译：无铅引线框封装设计，提供更大的结构完整性
公开(公告)号：US06933174B1
公开(公告)日：2005-08-23
申请号：US10956268
申请日：2004-09-30
申请人： Harry Kam Cheng Hong , Hu Ah Lek , Santhiran Nadarajah , Sharon Ko Mei Wan , Chan Peng Yeen , Jaime Bayan , Peter Howard Spalding
发明人： Harry Kam Cheng Hong , Hu Ah Lek , Santhiran Nadarajah , Sharon Ko Mei Wan , Chan Peng Yeen , Jaime Bayan , Peter Howard Spalding
IPC分类号： H01L21/50 , H01L21/56 , H01L23/31 , H01L23/495
CPC分类号： H01L23/49548 , H01L21/561 , H01L23/3107 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/00014 , H01L2924/14 , H01L2924/15747 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A leadless leadframe semiconductor package having a plurality of contacts, which have contact surfaces on the bottom surface of the package. At least some of the contacts have integrally formed stems that extend outward to the peripheral surface of the package. These stems have heights and widths less than the heights and widths of their corresponding contacts. A molded cap encapsulates at least a portion of the die, the stems and the contacts. Another aspect of the invention pertains to a leadless leadframe panel assembly having a conductive substrate panel that has at least one array of device areas, each array of device areas having a plurality of tie bars and a plurality of contacts. The contacts also have integrally formed stems that extend towards and connect to one of the tie bars. The stems have widths and heights that are less than the widths and heights of their corresponding contacts.
摘要翻译：一种具有多个触点的无引线框架半导体封装，其具有在封装的底表面上的接触表面。至少一些触点具有向外延伸到包装的外周表面的整体形成的杆。这些杆的高度和宽度小于其相应接触件的高度和宽度。模制帽封装了模具，杆和触头的至少一部分。本发明的另一方面涉及一种无引线框架面板组件，其具有导电衬底面板，该导电衬底面板具有至少一个器件区域阵列，每个阵列的器件区域具有多个连接条和多个触点。接触件还具有朝向并连接到一个连接杆的连接件的整体形成的杆。杆的宽度和高度小于其相应接触件的宽度和高度。

4. 发明授权

US06777788B1 Method and structure for applying thick solder layer onto die attach pad 有权
标题翻译：将厚焊料层应用于焊盘上的方法和结构
公开(公告)号：US06777788B1
公开(公告)日：2004-08-17
申请号：US10241363
申请日：2002-09-10
申请人： Sharon Ko Mei Wan , Jaime A. Bayan
发明人： Sharon Ko Mei Wan , Jaime A. Bayan
IPC分类号： H01L23495
CPC分类号： H05K3/341 , H01L23/3107 , H01L23/49503 , H01L23/49548 , H01L23/49582 , H01L24/45 , H01L24/48 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48599 , H01L2224/48639 , H01L2224/48664 , H01L2224/73265 , H01L2224/85439 , H01L2224/85464 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01083 , H01L2924/014 , H01L2924/14 , H01L2924/15747 , H01L2924/181 , H01L2924/30107 , H05K2201/09681 , H05K2201/10727 , H05K2201/10969 , Y02P70/613 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Embodiments of the invention include an integrated circuit package and methods for its construction. An integrated circuit package of the invention includes a die attach pad and a plurality of lead pads. An integrated circuit die is mounted with the front side of the die attach pad and electrically connected to the plurality of lead pads. Additionally, the backside of the die attach pad includes a pattern of mesas formed thereon. Each of the mesas is configured such that they have a top surface area that is substantially the same size as the surface area of the lead pads. A contact layer of reflowable material is formed on the top surface of the mesas and the lead pads, forming an integrated circuit package with an improved contact layer.
摘要翻译：本发明的实施例包括集成电路封装及其构造方法。本发明的集成电路封装包括管芯附接焊盘和多个引线焊盘。集成电路管芯安装有管芯附接焊盘的前侧并电连接到多个引线焊盘。此外，管芯附接垫的背面包括形成在其上的台面的图案。每个台面构造成使得它们具有与引线焊盘的表面积基本上相同的大小的顶表面区域。在台面和引线焊盘的顶表面上形成可回流材料的接触层，形成具有改进的接触层的集成电路封装。

5. 发明授权

US06677667B1 Leadless leadframe package design that provides a greater structural integrity 有权
标题翻译：无铅引线框封装设计，提供更大的结构完整性
公开(公告)号：US06677667B1
公开(公告)日：2004-01-13
申请号：US09724728
申请日：2000-11-28
申请人： Harry Kam Cheng Hong , Hu Ah Lek , Santhiran Nadarajah , Sharon Ko Mei Wan , Chan Peng Yeen , Jaime Bayan , Peter Howard Spalding
发明人： Harry Kam Cheng Hong , Hu Ah Lek , Santhiran Nadarajah , Sharon Ko Mei Wan , Chan Peng Yeen , Jaime Bayan , Peter Howard Spalding
IPC分类号： H01L2306
CPC分类号： H01L23/3107 , H01L23/49548 , H01L24/45 , H01L24/48 , H01L2224/48245 , H01L2224/48247 , H01L2224/97 , H01L2924/00014 , H01L2924/00015 , H01L2924/14 , H01L2924/15747 , H01L2924/181 , H01L2924/00 , H01L2224/05599 , H01L2224/45099 , H01L2224/85499 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A leadless leadframe semiconductor package comprising a plurality of contacts, which have contact surfaces on the bottom surface of the package. At least some of the contacts have integrally formed stems that extend outward to the peripheral surface of the package. These stems have heights and widths less than the heights and widths of their corresponding contacts. A molded cap encapsulates at least a portion of the die, the stems and the contacts. The molded cap leaves the contact surfaces of the contacts exposed on the bottom surface of the package, leaves a peripheral surface of the stems exposed on the peripheral surface of the package, and covers a bottom surface of each of the stems. Another aspect of the invention pertains to a leadless leadframe panel assembly having a conductive substrate panel that has at least one array of device areas, each array of device areas having a plurality of tie bars and a plurality of contacts. The contacts have contact surfaces on the bottom surface of the leadless leadframe panel assembly. The contacts also have integrally formed stems that extend towards and connect to one of the tie bars. The stems have widths and heights that are less than the widths and heights of their corresponding contacts. A molded cap encapsulates at least a portion of each die, the tie bars, the stems and the contacts while leaving the contact surfaces of the contacts exposed and covering a bottom surface of each of the stems.
摘要翻译：一种无引线框架半导体封装，其包括在封装的底表面上具有接触表面的多个触点。至少一些触点具有向外延伸到包装的外周表面的整体形成的杆。这些杆的高度和宽度小于其相应接触件的高度和宽度。模制帽封装了模具，杆和触头的至少一部分。模制帽离开暴露在包装底部表面上的触点的接触表面，离开暴露在包装的外周表面上的茎的外周表面，并覆盖每个茎的底表面。本发明的另一方面涉及一种无引线框架面板组件，其具有导电衬底面板，该导电衬底面板具有至少一个器件区域阵列，每个阵列的器件区域具有多个连接条和多个触点。触点在无引线框架面板组件的底表面上具有接触表面。接触件还具有朝向并连接到一个连接杆的连接件的整体形成的杆。杆的宽度和高度小于其相应接触件的宽度和高度。模制帽封装每个模具，连接杆，杆和触头的至少一部分，同时使触头的接触表面暴露并覆盖每个杆的底表面。

6. 发明授权

US06818970B1 Leadless leadframe package design that provides a greater structural integrity 有权
标题翻译：无铅引线框封装设计，提供更大的结构完整性
公开(公告)号：US06818970B1
公开(公告)日：2004-11-16
申请号：US10639226
申请日：2003-08-11
申请人： Harry Kam Cheng Hong , Hu Ah Lek , Santhiran Nadarajah , Sharon Ko Mei Wan , Chan Peng Yeen , Jaime Bayan , Peter Howard Spalding
发明人： Harry Kam Cheng Hong , Hu Ah Lek , Santhiran Nadarajah , Sharon Ko Mei Wan , Chan Peng Yeen , Jaime Bayan , Peter Howard Spalding
IPC分类号： H01L23495
CPC分类号： H01L23/3107 , H01L23/49548 , H01L24/45 , H01L24/48 , H01L2224/48245 , H01L2224/48247 , H01L2224/97 , H01L2924/00014 , H01L2924/00015 , H01L2924/14 , H01L2924/15747 , H01L2924/181 , H01L2924/00 , H01L2224/05599 , H01L2224/45099 , H01L2224/85499 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A leadless leadframe semiconductor package includes a plurality of contacts, at least some of which have integrally formed stems that extend to the peripheral surface of the package. These stems have heights and widths less than the heights and widths of their corresponding contacts. A molded cap encapsulates the stems and the contacts to leave contact surfaces of the contacts exposed on the bottom surface of the package. Another aspect of the invention pertains to a leadless leadframe panel assembly having a conductive substrate panel that has at least one array of device areas, which has a plurality of tie bars and a plurality of contacts. The contacts have integrally formed stems that extend towards and connect to one of the tie bars. The stems have widths and heights that are less than the widths and heights of their corresponding contacts.
摘要翻译：无引线框架半导体封装包括多个触点，其中至少一些具有延伸到封装的外围表面的整体形成的杆。这些杆的高度和宽度小于其相应接触件的高度和宽度。模制帽封装茎和触点以使暴露在包装底部表面上的触点的接触表面留下。本发明的另一方面涉及一种无引线框架面板组件，其具有导电衬底面板，该导电衬底面板具有至少一个设备区域阵列，该阵列具有多个连接杆和多个触点。触头具有朝向并连接到一个连接杆的一体形成的杆。杆的宽度和高度小于其相应接触件的宽度和高度。

7. 发明授权

US06808961B1 Locking of mold compound to conductive substrate panels 有权
标题翻译：将模具化合物锁定到导电基板面板上
公开(公告)号：US06808961B1
公开(公告)日：2004-10-26
申请号：US10414131
申请日：2003-04-14
申请人： Harry Kam Cheng Hong , Hu Ah Lek , Santhiran Nadarajah , Sharon Ko Mei Wan , Chan Peng Yeen , Jaime Bayan , Peter Howard Spalding
发明人： Harry Kam Cheng Hong , Hu Ah Lek , Santhiran Nadarajah , Sharon Ko Mei Wan , Chan Peng Yeen , Jaime Bayan , Peter Howard Spalding
IPC分类号： H01L2144
CPC分类号： H01L23/13 , H01L23/3121 , H01L24/97 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： A panel assembly of packaged integrated circuit devices comprising a conductive substrate panel having an array of device areas and a plurality of locking passageways. The locking passageways are positioned about an inactive buffer area which surrounds the periphery of the array of device areas. The locking passageways extend from a topside of the panel toward a bottom side of the panel. The panel assembly also includes a molded cap that is molded over the topside of the panel to encapsulate the array of device areas and the inactive buffer area. The molded cap includes conforming locking stem portions that extend into each of the locking passageways in a manner locking the molded cap to the substrate panel such that during singulation of the device areas, the molded cap will not separate from the substrate panel at the inactive buffer area. In another aspect of the invention, a method for producing the panel assembly having the locking passageways is described. The method involves providing a conductive substrate panel having the locking passageways and applying molding material to the topside of the substrate panel such that the solidified molding material forms stems that conform to the passageways.
摘要翻译：一种封装的集成电路器件的面板组件，包括具有一组器件区域的导电衬底面板和多个锁定通道。锁定通道围绕围绕装置区域阵列的周边的非活动缓冲区域定位。锁定通道从面板的顶部朝向面板的底侧延伸。面板组件还包括模制顶盖，其模制在面板的顶部以封装装置区域阵列和非活动缓冲区域。模制帽包括符合锁定杆部分，其以将模制帽锁定到衬底面板的方式延伸到每个锁定通道中，使得在单元化设备区域期间，模制帽不会在非活动缓冲器处与衬底面板分离区。在本发明的另一方面，描述了一种用于制造具有锁定通道的面板组件的方法。该方法包括提供具有锁定通道的导电基板面板，并将模塑材料施加到基板面板的顶侧，使得固化的模制材料形成符合通道的阀杆。

8. 发明授权

US07002239B1 Leadless leadframe packaging panel featuring peripheral dummy leads 有权
标题翻译：无引线框架封装面板，具有外围虚拟引线
公开(公告)号：US07002239B1
公开(公告)日：2006-02-21
申请号：US10367584
申请日：2003-02-14
申请人： Santhiran Nadarajah , Sharon Ko Mei Wan , Chan Peng Yeen
发明人： Santhiran Nadarajah , Sharon Ko Mei Wan , Chan Peng Yeen
IPC分类号： H01L23/495
CPC分类号： H01L23/562 , H01L23/49541 , H01L23/49565 , H01L24/97 , H01L2924/14 , H01L2924/15747 , H01L2924/00
摘要： Methods and apparatuses for providing leadless leadframes with dummy contact leads are disclosed. A leadframe is described that includes an enclosed frame having two lengthwise portions and two widthwise portions. The leadframe also includes a device area array with dummy contact leads formed on the peripheral edges of the device area array. Furthermore, dummy contact leads are positioned along a tie bar such that they are directly opposite corresponding contact leads. By cutting along the tie bar, dummy contact leads are separated from the device area array.
摘要翻译：公开了用于提供带有虚拟接触引线的无引线框架的方法和装置。描述了引线框，其包括具有两个纵向部分和两个宽度方向部分的封闭框架。引线框还包括在器件区域阵列的外围边缘上形成有虚拟接触引线的器件区域阵列。此外，虚拟接触引线沿着连接杆定位，使得它们与相应的接触引线直接相对。通过沿着连接条切割，虚拟接触引线与器件区域阵列分离。

9. 发明授权

US06448107B1 Pin indicator for leadless leadframe packages 有权
标题翻译：无引线框架封装的引脚指示
公开(公告)号：US06448107B1
公开(公告)日：2002-09-10
申请号：US09724729
申请日：2000-11-28
申请人： Harry Kam Cheng Hong , Hu Ah Lek , Santhiran Nadarajah , Sharon Ko Mei Wan , Chan Peng Yeen , Jaime Bayan , Peter Howard Spalding
发明人： Harry Kam Cheng Hong , Hu Ah Lek , Santhiran Nadarajah , Sharon Ko Mei Wan , Chan Peng Yeen , Jaime Bayan , Peter Howard Spalding
IPC分类号： H01L2144
CPC分类号： H01L24/97 , H01L23/3107 , H01L23/49548 , H01L23/544 , H01L24/48 , H01L24/73 , H01L2223/54473 , H01L2223/54486 , H01L2224/05599 , H01L2224/32245 , H01L2224/45099 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/85399 , H01L2224/97 , H01L2924/00014 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01082 , H01L2924/14 , H01L2924/15747 , H01L2924/181 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： Leadframe based packages, such as leadless leadframe packages are described that include an orientation indicator that is integrally formed with the leadframe. In one aspect, the leadframe includes a die attach pad, a plurality of contact fingers, a tie bar extending from the die attach pad, and an indicator stem extending from the tie bar. An integrated circuit die is mounted on the die attach pad and electrically coupled bond to associated contact fingers. A protective cap encapsulates the connectors and covers at least a portion of the die and contact fingers while leaving at least a portion of a bottom surface area of the contact fingers exposed to form external electrical contacts for the package. The protective cap leaves an identifying end of the indicator stem exposed through the surface of the protective cap to facilitate identification of a particular contact or region of the package. The described leadless leadframes may be produced in panel form which facilitates panel based packaging. In some embodiments, the indicator stem extends perpendicularly upward from the tie bar such that the combined thickness of the indicator stem and the tie bar is substantially the same thickness as the thickness of the contact fingers. Such devices may be formed by selectively etching the tie bars during formation of the panels.
摘要翻译：描述了基于引线框的封装，例如无引线框架封装，其包括与引线框架整体形成的定向指示器。一方面，引线框架包括管芯附接垫，多个接触指状物，从管芯附接垫延伸的连接杆以及从连接杆延伸的指示杆。集成电路管芯安装在管芯连接焊盘上，并且电耦合到相关联的接触指状物。保护帽封装连接器并且覆盖裸片和接触指的至少一部分，同时使接触指的底表面区域的至少一部分暴露以形成用于封装的外部电触头。保护帽留下通过保护盖表面暴露的指示器杆的识别端，以便于识别包装的特定接触或区域。所描述的无引线框架可以以面板形式生产，这有助于基于面板的包装。在一些实施例中，指示器杆从连接杆垂直向上延伸，使得指示杆和连接杆的组合厚度基本上与接触指的厚度。这样的装置可以通过在板的形成期间选择性地蚀刻连杆来形成。

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