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    • 6. 发明申请
    • LASER CUTTING METHOD
    • 激光切割方法
    • US20120211923A1
    • 2012-08-23
    • US13030605
    • 2011-02-18
    • Sean Matthew GarnerXinghua Li
    • Sean Matthew GarnerXinghua Li
    • B23K26/38
    • C03B33/091B23K26/082B23K26/40B23K26/60B23K2103/50B23K2103/52C03B33/04
    • A method for cutting a sheet of material having a thickness of at most 400 μm using an electromagnetic wave beam (EWB) such as a laser. The method comprises forming a surface initiation defect and irradiating the sheet along a predetermined path within a short distance from the initiation defect a scanning EWB, such that the sheet is heated and cooled to allow for the propagation of the initiation defect into the predetermined path, and further along the predetermined path to result in a separation of the sheet along the predetermined irradiation path. This method can be advantageously used to cut glass sheets having a thin thickness to result in high-quality edge substantially free of major defects carried over from the initiation defect.
    • 使用诸如激光的电磁波束(EWB)来切割厚度最多为400μm的材料片的方法。 该方法包括形成表面起始缺陷并沿着与起始缺陷相对应的扫描EWB的短距离内的预定路径照射片材,使得片材被加热和冷却以允许引发缺陷传播到预定路径中, 并且还沿着预定路径导致片沿着预定照射路径的分离。 该方法可以有利地用于切割具有薄厚度的玻璃板,从而导致基本上没有从起始缺陷承载的主要缺陷的高质量边缘。