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    • 1. 发明授权
    • Sub-word-line driving circuit, semiconductor memory device having the same, and method of controlling the same
    • 子字线驱动电路,具有其的半导体存储器件及其控制方法
    • US08379477B2
    • 2013-02-19
    • US13019858
    • 2011-02-02
    • Cheol KimSang-Kyun ParkJung-Bae LeeJun-Phyo Lee
    • Cheol KimSang-Kyun ParkJung-Bae LeeJun-Phyo Lee
    • G11C8/10
    • G11C8/14G11C8/08
    • Provided is a semiconductor memory device including a sub-word-line driving circuit capable of reducing an amount of leakage current due to coupling. The semiconductor memory device includes a word-line enable signal generating circuit and a sub-word-line driving circuit. The sub-word-line driving circuit provides a pull-down current path between a selected word line and ground for a pulse type period of time in a precharge mode following an active mode for the selected word line, generates a word line driving signal on the basis of a main word line driving signal, a first sub-word-line control signal, and a second sub-word-line control signal, and provides the word line driving signal to a memory cell array. The semiconductor memory device may reduce an amount of leakage current flowing to a ground through the sub-word-line driving circuit.
    • 提供了一种半导体存储器件,其包括能够减少由耦合引起的漏电流量的子字线驱动电路。 半导体存储器件包括字线使能信号发生电路和子字线驱动电路。 子字线驱动电路在所选字线的有效模式之后的预充电模式中的脉冲类型时段期间,在所选字线和地之间提供下拉电流路径,生成字线驱动信号 主字线驱动信号的基础,第一子字线控制信号和第二子字线控制信号,并将字线驱动信号提供给存储单元阵列。 半导体存储器件可以减少通过子字线驱动电路流向地的漏电流量。
    • 9. 发明授权
    • Radio frequency integrated circuit, and method for manufacturing the same
    • 射频集成电路及其制造方法
    • US07056801B2
    • 2006-06-06
    • US10878567
    • 2004-06-29
    • Sang Kyun ParkChan Soo Shin
    • Sang Kyun ParkChan Soo Shin
    • H01L21/8232H01L21/4763
    • H01L27/0611H01L23/5227H01L25/0657H01L2225/06541H01L2924/0002H01L2924/00
    • The present invention discloses a radio frequency integrated circuit and a method for manufacturing the same. The radio frequency integrated circuit is manufactured by forming an inductor and a passivation layer on an insulator substrate of a first substrate, forming an element layer having a multi-layer wiring structure on a semiconductor substrate, an inductor coupling line formed on the top portion of the element layer, first and second via contact plugs formed on the inductor coupling line, and an input/output pad coupled to the second via contact plug on a second substrate, and bonding the first substrate onto the second substrate, so that the inductor of the first substrate can be coupled to the first via contact plug of the second substrate. As a result, the radio frequency integrated circuit includes the inductor having a high Q value, by forming the inductor sufficiently separately from the semiconductor substrate on which the elements have been formed.
    • 本发明公开了一种射频集成电路及其制造方法。 射频集成电路通过在第一基板的绝缘体基板上形成电感器和钝化层来制造,在半导体基板上形成具有多层布线结构的元件层,形成在第一基板的顶部上的电感器耦合线 元件层,形成在电感器耦合线上的第一和第二通孔接触插塞以及耦合到第二衬底上的第二通孔接触插塞的输入/输出焊盘,以及将第一衬底接合到第二衬底上,使得电感器 第一衬底可以耦合到第二衬底的第一通孔接触插塞。 结果,射频集成电路包括具有高Q值的电感器,通过与其上已经形成有元件的半导体衬底分开形成电感器。