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1. 发明授权

US08841172B2 Method for forming package substrate 有权
标题翻译：用于形成封装衬底的方法
公开(公告)号：US08841172B2
公开(公告)日：2014-09-23
申请号：US13593698
申请日：2012-08-24
申请人： Shih-Long Wei , Shen-Li Hsiao , Chien-Hung Ho
发明人： Shih-Long Wei , Shen-Li Hsiao , Chien-Hung Ho
IPC分类号： H01L21/00 , H01L33/64 , H01L33/62
CPC分类号： H01L33/647 , H01L33/62 , H01L33/641 , H01L2224/48227 , H01L2933/0075 , Y10T29/49158
摘要： A method of making a package substrate includes steps of forming a plurality of trenches on a first surface of a metal plate, placing insulation material in the trenches, removing metal plate material under the second surface of the metal plate, and exposing the insulation material in the trenches from substrate. The resulting substrate body includes a conductive portion made of the metal plate, and an insulation portion made of the insulation material. The bonding layers on the opposite sides of the substrate are conducted by the conductive portion for heat dissipation, and are separated from one another by the insulation portion.
摘要翻译：一种制造封装衬底的方法包括在金属板的第一表面上形成多个沟槽的步骤，将绝缘材料放置在沟槽中，在金属板的第二表面下方去除金属板材料，并将金属板材料暴露在底层的沟槽。所得到的基板主体包括由金属板制成的导电部分和由绝缘材料制成的绝缘部分。基板的相对两侧的接合层由用于散热的导电部分导电，并且通过绝缘部分彼此分离。

2. 发明申请

US20130313122A1 Method For Fabricating Conductive Structures of Substrate 审中-公开
标题翻译：制造基片导电结构的方法
公开(公告)号：US20130313122A1
公开(公告)日：2013-11-28
申请号：US13564673
申请日：2012-08-01
申请人： Shih-Long Wei , Shen-Li Hsiao , Chien-Hung Ho , Yuan-Chiang Lin , Chen-Shen Kuo
发明人： Shih-Long Wei , Shen-Li Hsiao , Chien-Hung Ho , Yuan-Chiang Lin , Chen-Shen Kuo
IPC分类号： C25D5/02
CPC分类号： H05K3/426 , H05K1/0306 , H05K2201/09563
摘要： A method for fabricating a conductive structure of a substrate includes the steps of: providing an insulating substrate having opposite first and second surfaces and forming an insulating adhesive film on the second surface of the insulating substrate; forming at least a through hole penetrating the insulating substrate and the insulating adhesive film and forming a conductive foil on the insulating adhesive film so as to cover the through hole; and forming a shielding material on the conductive foil and the second surface of the insulating substrate and performing an electrochemical deposition process through the conductive foil so as to fill the through hole with a conductive material along a direction towards the first surface of the insulating substrate, thereby preventing the formation of voids in the through hole and hence reducing the overall resistance and preventing a blister effect from occurring.
摘要翻译：一种用于制造衬底的导电结构的方法，包括以下步骤：提供具有相对的第一和第二表面的绝缘衬底，并在绝缘衬底的第二表面上形成绝缘粘合剂膜; 至少形成穿过绝缘基板和绝缘粘合膜的通孔，并在绝缘粘合膜上形成导电箔以覆盖通孔; 以及在所述导电箔和所述绝缘基板的所述第二表面上形成屏蔽材料，并且通过所述导电箔进行电化学沉积工艺，以沿着朝向所述绝缘基板的第一表面的方向用导电材料填充所述通孔，从而防止在通孔中形成空隙，从而降低整体阻力并防止发生起泡效应。

3. 发明申请

US20130048602A1 Method of Manufacturing a Metallized Ceramic Substrate 有权
标题翻译：金属化陶瓷基板的制造方法
公开(公告)号：US20130048602A1
公开(公告)日：2013-02-28
申请号：US13309890
申请日：2011-12-02
申请人： Shih-Long Wei , Shen-Li Hsiao , Chien-Hung Ho
发明人： Shih-Long Wei , Shen-Li Hsiao , Chien-Hung Ho
IPC分类号： C23F1/02
CPC分类号： H01L21/4807 , H01L23/15 , H01L2924/0002 , Y10T428/24926 , Y10T428/31678 , H01L2924/00
摘要： A method of manufacturing a metallized ceramic substrate includes forming a metal layer on a ceramic substrate, and forming on the metal layer a resist having a first patterned resist opening and a second patterned resist opening for the metal layer to be exposed therefrom. A first width of the first patterned resist opening is greater than the thickness of the metal layer, and a second width of the second patterned resist opening is less than the thickness of the metal layer. A wet-etching process is conducted, to form in the first patterned resist opening a patterned metal layer opening and form in the second patterned resist opening a patterned metal layer dent. Therefore, an internal stress between the metal layer and the ceramic substrate is reduced, and the yield rate and reliability of the metallized ceramic substrate is increased.
摘要翻译：金属化陶瓷基板的制造方法包括在陶瓷基板上形成金属层，在金属层上形成抗蚀剂，该抗蚀剂具有第一图案化抗蚀剂开口和第二图案化抗蚀剂开口，用于使金属层暴露于其中。第一图案化抗蚀剂开口的第一宽度大于金属层的厚度，第二图案化抗蚀剂开口的第二宽度小于金属层的厚度。进行湿蚀刻工艺，以在第一图案化的抗蚀剂开口中形成图案化的金属层开口，并在第二图案化的抗蚀剂开口中形成图案化的金属层凹陷。因此，金属层与陶瓷基板之间的内应力降低，金属化陶瓷基板的成品率和可靠性提高。

4. 发明授权

US08267581B2 Slide mechanism for electronic device 失效
标题翻译：电子设备滑动机构
公开(公告)号：US08267581B2
公开(公告)日：2012-09-18
申请号：US13216432
申请日：2011-08-24
申请人： Shen Li
发明人： Shen Li
IPC分类号： F16C29/02 , F16C29/12 , F16M13/00
CPC分类号： G06F1/1675 , G06F1/1624
摘要： A slide mechanism includes a fixing plate, a slide plate, and a slide assembly. The fixing plate defines a slide groove and forms a pair of slide rails on opposite sides of the slide groove. The slide plate is positioned on the fixing plate. The slide assembly is positioned between the fixing plate and the slide plate and is allowed an assisted back and forth movement on the slide assembly, and a rotation subjected to friction at the front end of the slide assembly and the slide plate.
摘要翻译：滑动机构包括固定板，滑动板和滑动组件。固定板限定滑动槽，并在滑动槽的相对侧上形成一对滑轨。滑板位于固定板上。滑动组件定位在固定板和滑板之间，并且允许在滑动组件上的辅助来回移动，以及在滑动组件和滑板的前端处经受摩擦的旋转。

5. 发明申请

US20120211792A1 Package Substrate and Method for Forming the Same 审中-公开
标题翻译：封装基板及其形成方法
公开(公告)号：US20120211792A1
公开(公告)日：2012-08-23
申请号：US13111009
申请日：2011-05-19
申请人： Shih-Long Wei , Shen-Li Hsiao , Chien-Hung Ho
发明人： Shih-Long Wei , Shen-Li Hsiao , Chien-Hung Ho
IPC分类号： H01L33/62 , H01L21/28
CPC分类号： H01L33/647 , H01L33/62 , H01L33/641 , H01L2224/48227 , H01L2933/0075 , Y10T29/49158
摘要： A package substrate is disclosed. The package substrate includes a substrate body having a conductive portion, a plurality of insulation portions and two surfaces opposing to each other; and a plurality of bonding layers for heat dissipation formed on the two surfaces of the substrate body, conducted via the conductive portion and separated from one another by the insulation portions. A method for forming the package substrate is also disclosed.
摘要翻译：公开了封装衬底。封装衬底包括具有导电部分，多个绝缘部分和彼此相对的两个表面的衬底本体; 以及多个用于散热的接合层，其形成在基板主体的两个表面上，通过导电部分传导并通过绝缘部分彼此分离。还公开了一种用于形成封装衬底的方法。

6. 发明申请

US20120192380A1 HINGE ASSEMBLY 审中-公开
标题翻译：铰链装配
公开(公告)号：US20120192380A1
公开(公告)日：2012-08-02
申请号：US13219859
申请日：2011-08-29
申请人： LIAN-CHENG HUANG , SHEN LI
发明人： LIAN-CHENG HUANG , SHEN LI
IPC分类号： E05D11/10
CPC分类号： E05D11/082 , D06F39/14 , E05Y2201/21 , E05Y2201/256 , E05Y2201/266 , Y10T16/54
摘要： A hinge assembly includes a sleeve, a rotation shaft, and a sealing subassembly. The rotation shaft is partially received in the sleeve. The sealing subassembly seals the sleeve. The sleeve defines a pivot hole, and an inner side wall defining the pivot hole defines a restricting portion. The rotation shaft has a shaft portion and a buffer portion extending from a side wall of the shaft portion. The shaft portion is received in the pivot hole of the sleeve, and the buffer portion is received in the restricting portion of the sleeve. Damping oil is used between the inside of the sleeve and the rotation shaft.
摘要翻译：铰链组件包括套筒，旋转轴和密封子组件。旋转轴部分地容纳在套筒中。密封子组件密封套筒。套筒限定枢轴孔，并且限定枢转孔的内侧壁限定了限制部分。旋转轴具有轴部和从轴部的侧壁延伸的缓冲部。轴部被容纳在套筒的枢轴孔中，并且缓冲部分被容纳在套筒的限制部分中。在套筒内部和旋转轴之间使用阻尼油。

7. 发明申请

US20120001212A1 Light-Emitting Diode Packaging Structure and Substrate Therefor 审中-公开
标题翻译：发光二极管封装结构及基板
公开(公告)号：US20120001212A1
公开(公告)日：2012-01-05
申请号：US12859845
申请日：2010-08-20
申请人： Shih-Long Wei , Shen-Li Hsiao , Chien-Min Shao , Chien-Hung Ho
发明人： Shih-Long Wei , Shen-Li Hsiao , Chien-Min Shao , Chien-Hung Ho
IPC分类号： H01L33/48
CPC分类号： H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2933/005 , H01L2924/00012 , H01L2924/00014
摘要： A light-emitting diode (LED) packaging structure and a substrate for the packaging structure are provided. The light-emitting diode packaging structure includes a metal substrate having a first surface and a second surface opposite to the first surface, and the first surface has a concave portion with a sidewall and a bottom, allowing an anode film to be formed on the metal substrate; a plurality of electrically conductive pads formed on the bottom of the concave portion; an optical treatment layer formed on the sidewall of the concave portion; and an LED die mounted on the bottom of the concave portion and electrically connected to the electrically conductive pads. Desired electrical insulating property between any two adjacent electrically conductive pads can be obtained by the anode film formed on the metal substrate, while a good thermal conductivity of the metal substrate is maintained.
摘要翻译：提供了一种用于封装结构的发光二极管（LED）封装结构和基板。发光二极管封装结构包括具有第一表面和与第一表面相对的第二表面的金属基底，并且第一表面具有具有侧壁和底部的凹部，允许在金属上形成阳极膜基质; 形成在所述凹部的底部的多个导电焊盘; 形成在所述凹部的侧壁上的光学处理层; 以及安装在凹部的底部并电连接到导电焊盘的LED管芯。可以通过形成在金属基板上的阳极膜获得任意两个相邻的导电焊盘之间期望的电绝缘性能，同时维持金属基板的良好导热性。

8. 发明授权

US07982413B2 Electronic ballast with dimming control from power line sensing 失效
标题翻译：电子镇流器，具有电源线感测的调光控制
公开(公告)号：US07982413B2
公开(公告)日：2011-07-19
申请号：US12434017
申请日：2009-05-01
申请人： Ko-Ming Lin , Yen-Ping Wang , Pei-Yuan Chen , Wei-Chuan Su , Chia-Chieh Hung , Jian-Shen Li
发明人： Ko-Ming Lin , Yen-Ping Wang , Pei-Yuan Chen , Wei-Chuan Su , Chia-Chieh Hung , Jian-Shen Li
IPC分类号： H05B37/02
CPC分类号： H05B41/3921 , Y10S315/04
摘要： The present invention discloses an electronic ballast with dimming control from power line sensing for a fluorescent lamp, comprising: a line switching sensing circuit, used to generate a switching sensing signal by performing a voltage comparison operation on a DC voltage, and generate a reset signal according to the off time of the power line; a dimming voltage generator, used to generate a dimming voltage according to a count of the switching sensing signal; and a phase-controlled non-overlapping driver, used to generate a high side driving signal and a low side driving signal for delivering a lamp current according to the dimming voltage, wherein the dimming voltage is used to generate a phase, and the phase is used to generate the lamp current.
摘要翻译：本发明公开了一种电子镇流器，其具有来自荧光灯的电力线感测的调光控制，包括：线路切换检测电路，用于通过对直流电压进行电压比较运算产生开关感测信号，并产生复位信号根据电力线的关闭时间; 调光电压发生器，用于根据开关感测信号的计数产生调光电压; 以及用于产生高侧驱动信号的相位控制非重叠驱动器和用于根据调光电压传送灯电流的低侧驱动信号，其中调光电压用于产生相位，相位是用于产生灯电流。

9. 发明申请

US20100118460A1 DC drive 审中-公开
标题翻译：直流驱动
公开(公告)号：US20100118460A1
公开(公告)日：2010-05-13
申请号：US12289988
申请日：2008-11-10
申请人： Jian-Shen Li , Cheng-Chih Chu , Chun-Liang Lin
发明人： Jian-Shen Li , Cheng-Chih Chu , Chun-Liang Lin
IPC分类号： H02H3/00 , G05F5/00
CPC分类号： H02P7/285
摘要： A direct current (DC) drive includes a voltage input unit, a comparing unit, a latch unit and a voltage output unit. The voltage input unit has at least one input terminal and at least one output terminal provides a DC voltage. The comparing unit receives the DC voltage and generates a comparison control signal according to a comparison result obtained by comparing a voltage of a positive voltage terminal with a voltage of a negative voltage terminal. The latch unit is connected to the comparing unit and the voltage input unit. The voltage output unit connected to the latch unit receives the DC voltage from the voltage input unit. The latch unit selectively provides the DC voltage to the voltage output unit according to the comparison control signal.
摘要翻译：直流（DC）驱动器包括电压输入单元，比较单元，锁存单元和电压输出单元。电压输入单元具有至少一个输入端子，并且至少一个输出端子提供直流电压。比较单元接收DC电压，并根据通过将正电压端子的电压与负电压端子的电压进行比较而获得的比较结果来生成比较控制信号。闩锁单元连接到比较单元和电压输入单元。连接到闩锁单元的电压输出单元从电压输入单元接收直流电压。闩锁单元根据比较控制信号选择性地将电压提供给电压输出单元。

10. 发明申请

US20080018266A1 DC TO DC CONVERSION CIRCUIT WITH VARIABLE OUTPUT VOLTAGE 有权
标题翻译：具有可变输出电压的直流到直流转换电路
公开(公告)号：US20080018266A1
公开(公告)日：2008-01-24
申请号：US11682001
申请日：2007-03-05
申请人： Ya-yun Yu , Yueh-bao Lee , Jian-shen Li
发明人： Ya-yun Yu , Yueh-bao Lee , Jian-shen Li
IPC分类号： H05B41/36
CPC分类号： H05B33/0851 , H05B33/0815 , H05B33/0827
摘要： The present invention provides a DC to DC conversion circuit, comprising a DC power supply, a DC to DC converter, a power management IC and a load, wherein the load may be a backlight source of a liquid crystal display. The power management IC controls the DC to DC converter to convert a DC voltage supplied by the DC power supply to an output voltage of the DC to DC converter, which is supplied to the load. The power management IC is capable of controlling the DC to DC converter to adjust the output voltage to a minimum voltage actually needed by the load according to the variation of the minimum voltage which is actually needed by the load.
摘要翻译：本发明提供一种直流 - 直流转换电路，包括直流电源，直流 - 直流转换器，电源管理IC和负载，其中负载可以是液晶显示器的背光源。电源管理IC控制DC-DC转换器，将由直流电源提供的直流电压转换为提供给负载的DC-DC转换器的输出电压。电源管理IC能够控制DC-DC转换器，以根据负载实际需要的最小电压的变化将输出电压调整到负载实际需要的最小电压。

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