会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 3. 发明授权
    • Process for thick film circuit patterning
    • 厚膜电路图案化工艺
    • US07741013B2
    • 2010-06-22
    • US11312673
    • 2006-02-21
    • Roupen Leon Keusseyan
    • Roupen Leon Keusseyan
    • G03F7/26
    • H05K3/207G03F7/0047G03F7/343H05K1/092H05K1/095H05K3/046H05K2203/0525Y10T428/24802Y10T428/2486Y10T428/31504
    • A process for patterning thick film electrically functional patterns using a photosensitive polymer layer. A tacky photosensitive layer is applied onto a substrate surface. The photosensitive layer is imaged with a pattern using actinic radiation, the exposed areas of the photosensitive layer become hardened and non-tacky. A subsequent application of a thick film composition sheet will cause the thick film to adhere to the remaining tacky areas. Upon peeling the sheet, a thick film print pattern will be produced. This step is followed by a processing profile prescribed by the thick film composition used which results in a pattern having electrically functional properties. The invention also extends to a process wherein a thick film composition is recovered from a used sheet.
    • 使用光敏聚合物层图案化厚膜电功能图案的工艺。 将粘性感光层施加到基材表面上。 感光层用光化辐射的图案成像,感光层的曝光区域变硬并且非粘性。 随后应用厚膜组合物片将导致厚膜粘附到剩余的粘性区域。 在剥离片材时,将产生厚膜印刷图案。 该步骤之后是由所使用的厚膜组合物规定的处理轮廓,其导致具有电功能性质的图案。 本发明还延伸到其中从使用的片材中回收厚膜组合物的方法。