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1. 发明授权

US06822326B2 Wafer bonding hermetic encapsulation 有权
公开(公告)号：US06822326B2
公开(公告)日：2004-11-23
申请号：US10253588
申请日：2002-09-25
申请人： Paul M. Enquist , Qin-Yi Tong , Gaius Gillman Fountain, Jr. , Robert Markunas
发明人： Paul M. Enquist , Qin-Yi Tong , Gaius Gillman Fountain, Jr. , Robert Markunas
IPC分类号： H01L2306
CPC分类号： B81C1/00269 , B81C2203/0118 , H01L21/50 , H01L23/10 , H01L2924/0002 , H01L2924/01079 , H01L2924/00
摘要： A method for providing encapsulation of an electronic device which obtains an encapsulating member configured to enclose the electronic device, prepares a surface of the encapsulating member for non-adhesive direct bonding, prepares a surface of a device carrier including the electronic device for non-adhesive direct bonding, and bonds the prepared surface of the encapsulating member to the prepared surface of the device carrier to form an encapsulation of the electronic device. As such, an encapsulated electronic device results which includes the device carrier having a first bonding region encompassing the electronic device, includes the encapsulating member having at least one relief preventing contact between the electronic device and the encapsulating member and having a second bonding region bonded to the first bonding region of the device carrier, and includes a non-adhesive direct bond formed between the first and second bonding regions thereby to form an encapsulation of the electronic device. The encapsulated electronic device can be an electronic or optoelectronic device.

2. 发明申请

US20050009246A1 Wafer bonding hermetic encapsulation 有权
标题翻译：晶圆粘合气密封装
公开(公告)号：US20050009246A1
公开(公告)日：2005-01-13
申请号：US10913357
申请日：2004-08-09
申请人： Paul Enquist , Qin-Yi Tong , Gaius Fountain , Robert Markunas
发明人： Paul Enquist , Qin-Yi Tong , Gaius Fountain , Robert Markunas
IPC分类号： B81B7/00 , H01L21/50 , H01L23/10 , H01L21/44
CPC分类号： B81C1/00269 , B81C2203/0118 , H01L21/50 , H01L23/10 , H01L2924/0002 , H01L2924/01079 , H01L2924/00
摘要： A method for providing encapsulation of an electronic device which obtains an encapsulating member configured to enclose the electronic device, prepares a surface of the encapsulating member for non-adhesive direct bonding, prepares a surface of a device carrier including the electronic device for non-adhesive direct bonding, and bonds the prepared surface of the encapsulating member to the prepared surface of the device carrier to form an encapsulation of the electronic device. As such, an encapsulated electronic device results which includes the device carrier having a first bonding region encompassing the electronic device, includes the encapsulating member having at least one relief preventing contact between the electronic device and the encapsulating member and having a second bonding region bonded to the first bonding region of the device carrier, and includes a non-adhesive direct bond formed between the first and second bonding regions thereby to form an encapsulation of the electronic device. The encapsulated electronic device can be an electronic or optoelectronic device.
摘要翻译：一种用于提供电子设备的封装的方法，该电子设备获得构造成封闭电子设备的封装构件，准备用于非粘合剂直接接合的封装构件的表面，准备包括用于非粘合剂的电子设备的设备载体的表面直接结合，并将封装构件的制备表面粘合到装置载体的制备表面上以形成电子器件的封装。因此，包括具有包围电子设备的第一接合区域的器件载体的封装的电子器件包括具有至少一个防止接触电子器件与封装元件之间的防止接触的封装元件，并且具有第二接合区域装置载体的第一结合区域，并且包括在第一和第二接合区域之间形成的非粘合性直接结合，从而形成电子器件的封装。封装的电子器件可以是电子或光电器件。

3. 发明授权

US07622324B2 Wafer bonding hermetic encapsulation 有权
标题翻译：晶圆粘合气密封装
公开(公告)号：US07622324B2
公开(公告)日：2009-11-24
申请号：US10913357
申请日：2004-08-09
申请人： Paul M. Enquist , Qin-Yi Tong , Gaius Gillman Fountain, Jr. , Robert Markunas
发明人： Paul M. Enquist , Qin-Yi Tong , Gaius Gillman Fountain, Jr. , Robert Markunas
IPC分类号： H01L21/00
CPC分类号： B81C1/00269 , B81C2203/0118 , H01L21/50 , H01L23/10 , H01L2924/0002 , H01L2924/01079 , H01L2924/00
摘要： A method for providing encapsulation of an electronic device which obtains an encapsulating member configured to enclose the electronic device, prepares a surface of the encapsulating member for non-adhesive direct bonding, prepares a surface of a device carrier including the electronic device for non-adhesive direct bonding, and bonds the prepared surface of the encapsulating member to the prepared surface of the device carrier to form an encapsulation of the electronic device. As such, an encapsulated electronic device results which includes the device carrier having a first bonding region encompassing the electronic device, includes the encapsulating member having at least one relief preventing contact between the electronic device and the encapsulating member and having a second bonding region bonded to the first bonding region of the device carrier, and includes a non-adhesive direct bond formed between the first and second bonding regions thereby to form an encapsulation of the electronic device. The encapsulated electronic device can be an electronic or optoelectronic device.
摘要翻译：一种用于提供电子设备的封装的方法，该电子设备获得构造成封闭电子设备的封装构件，准备用于非粘合剂直接接合的封装构件的表面，准备包括用于非粘合剂的电子设备的设备载体的表面直接结合，并将封装构件的制备表面粘合到装置载体的制备表面上以形成电子器件的封装。因此，包括具有包围电子设备的第一接合区域的器件载体的封装的电子器件包括具有至少一个防止接触电子器件与封装元件之间的防止接触的封装元件，并且具有第二接合区域装置载体的第一结合区域，并且包括在第一和第二接合区域之间形成的非粘合性直接结合，从而形成电子器件的封装。封装的电子器件可以是电子或光电器件。

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