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1. 发明授权

US07836939B2 Non-contacting thermal rotary joint 有权
标题翻译：非接触式热旋转接头
公开(公告)号：US07836939B2
公开(公告)日：2010-11-23
申请号：US11832178
申请日：2007-08-01
申请人： Kurt Zimmerman , Robert F. Meehan , John Rust
发明人： Kurt Zimmerman , Robert F. Meehan , John Rust
IPC分类号： F28D15/00
CPC分类号： F28D15/00 , B25J19/0054 , F28D2021/0029 , F28F5/00 , F28F2013/005
摘要： An apparatus (100) for transferring heat from a first substrate (140) rotatably mounted to a second substrate (150). The apparatus (100) is comprised of at least a first fin ring (145) disposed concentrically on a first side surface (141) of the first substrate (140). A plurality of heat generating devices (130) is disposed on a second side surface (142) of the first substrate (140). There is at least a second fin ring (155) disposed concentrically on a first side surface (151) of the second substrate (150). The first fin ring (145) interleaves with the second fin ring (155) while allowing the first substrate (140) to rotate unobstructed relative to the second substrate (150). The second substrate (150) has at least a first port (160) for introducing moving air into a gap (G) defined between the first fin ring (145) and the second fin ring (155) for improving heat convection there between.
摘要翻译：一种用于从可旋转地安装到第二基板（150）的第一基板（140）传递热量的装置（100）。装置（100）包括至少第一翅片环（145），该第一翅片环同心地设置在第一基板（140）的第一侧表面（141）上。多个发热装置（130）设置在第一基板（140）的第二侧表面（142）上。至少一个第二翅片环（155）同心地设置在第二基板（150）的第一侧表面（151）上。第一鳍片环（145）与第二鳍片环（155）交错，同时允许第一衬底（140）相对于第二衬底（150）不受阻碍地旋转。第二基板（150）具有至少第一端口（160），用于将移动的空气引入到限定在第一翅片环（145）和第二翅片环（155）之间的间隙（G）中，以改善其间的热对流。

2. 发明授权

US4628597A Method of making an electrical connector 失效
标题翻译：制造电连接器的方法
公开(公告)号：US4628597A
公开(公告)日：1986-12-16
申请号：US711685
申请日：1985-03-14
申请人： Robert F. Meehan , William H. Rose , David T. Shaffer
发明人： Robert F. Meehan , William H. Rose , David T. Shaffer
IPC分类号： H05K3/30 , H05K7/10 , H01R43/00
CPC分类号： H05K7/1076 , H05K3/301 , Y10T29/49121 , Y10T29/49222
摘要： An electrical connector for electrical connection to conductive members of a ceramic chip carrier comprises first and second dielectric frame members each of which has opposed side members in which electrical terminal posts are secured at spaced intervals with top sections extending above upper surfaces of the side members and bottom sections extending below bottom surfaces of the side members. Rail members extend between respective side members of each of the frame members so that when the frame members are nested together the rail members of one of the frame members are disposed in engagement with the rail members of the other of the frame members. Latching members on each of the frame members latch the frame members together thereby forming a chip carrier-receiving area so that the top sections of the terminal posts can be electrically connected to respective conductive members when the ceramic chip carrier is positioned within the chip carrier-receiving area.
摘要翻译：用于电连接到陶瓷芯片载体的导电构件的电连接器包括第一和第二电介质框架构件，每个电介体框架构件具有相对的侧构件，其中电端子柱以间隔的间隔固定，顶部在侧构件的上表面上延伸，底部部分延伸到侧部构件的底部表面之下。轨道构件在每个框架构件的相应侧构件之间延伸，使得当框架构件嵌套在一起时，一个框架构件的轨道构件设置成与另一个框架构件的轨道构件接合。每个框架构件上的锁定构件将框架构件卡在一起，从而形成芯片载体接收区域，使得当陶瓷芯片载体位于芯片载体接收区域内时，端子柱的顶部部分可以电连接到相应的导电构件，接收区域。

3. 发明申请

US20090032223A1 Non-Contacting Thermal Rotary Joint 有权
标题翻译：非接触热旋转接头
公开(公告)号：US20090032223A1
公开(公告)日：2009-02-05
申请号：US11832178
申请日：2007-08-01
申请人： Kurt Zimmerman , Robert F. Meehan , John Rust
发明人： Kurt Zimmerman , Robert F. Meehan , John Rust
IPC分类号： F28D15/00
CPC分类号： F28D15/00 , B25J19/0054 , F28D2021/0029 , F28F5/00 , F28F2013/005
摘要： An apparatus (100) for transferring heat from a first substrate (140) rotatably mounted to a second substrate (150). The apparatus (100) is comprised of at least a first fin ring (145) disposed concentrically on a first side surface (141) of the first substrate (140). A plurality of heat generating devices (130) is disposed on a second side surface (142) of the first substrate (140). There is at least a second fin ring (155) disposed concentrically on a first side surface (151) of the second substrate (150). The first fin ring (145) interleaves with the second fin ring (155) while allowing the first substrate (140) to rotate unobstructed relative to the second substrate (150). The second substrate (150) has at least a first port (160) for introducing moving air into a gap (G) defined between the first fin ring (145) and the second fin ring (155) for improving heat convection there between.
摘要翻译：一种用于从可旋转地安装到第二基板（150）的第一基板（140）传递热量的装置（100）。装置（100）包括至少第一翅片环（145），该第一翅片环同心地设置在第一基板（140）的第一侧表面（141）上。多个发热装置（130）设置在第一基板（140）的第二侧表面（142）上。至少一个第二翅片环（155）同心地设置在第二基板（150）的第一侧表面（151）上。第一鳍片环（145）与第二鳍片环（155）交错，同时允许第一衬底（140）相对于第二衬底（150）不受阻碍地旋转。第二基板（150）具有至少第一端口（160），用于将移动的空气引入到限定在第一翅片环（145）和第二翅片环（155）之间的间隙（G）中，以改善其间的热对流。

4. 发明授权

US4552422A Modular receptacle pin grid array 失效
标题翻译：模块化插座针阵列
公开(公告)号：US4552422A
公开(公告)日：1985-11-12
申请号：US475268
申请日：1983-03-14
申请人： Benny M. Bennett , Robert F. Meehan , Dale R. Zell
发明人： Benny M. Bennett , Robert F. Meehan , Dale R. Zell
IPC分类号： H05K7/10 , H01R23/72
CPC分类号： H05K7/1084
摘要： A modular receptacle housing is formed by four identical housing modules of molded rigid insulative material, which modules are interlocked to form a single housing. Each housing module carries a plurality of receptacle terminals. The arrangement of modules can readily be adopted to accommodate a wide variety of pin counts and configurations.
摘要翻译：模块化插座壳体由模制的刚性绝缘材料的四个相同的壳体模块形成，该模块互锁以形成单个壳体。每个壳体模块承载多个插座端子。可以容易地采用模块的布置来适应各种引脚数量和配置。

5. 发明授权

US4530552A Electrical connector for integrated circuit package 失效
标题翻译：集成电路封装的电气连接器
公开(公告)号：US4530552A
公开(公告)日：1985-07-23
申请号：US555257
申请日：1983-11-25
申请人： Robert F. Meehan , William H. Rose , David T. Shaffer
发明人： Robert F. Meehan , William H. Rose , David T. Shaffer
IPC分类号： H05K3/30 , H05K7/10 , H01R23/72
CPC分类号： H05K3/301 , H05K7/1076 , Y10T29/49208
摘要： An electrical connector for electrical connection to conductive members of a ceramic chip carrier comprises first and second dielectric frame members each of which has opposed side members in which electrical terminal posts are secured at spaced intervals with top sections extending above upper surfaces of the side members and bottom sections extending below bottom surfaces of the side members. Rail members extend between respective side members of each of the frame members so that when the frame members are nested together the rail members of one of the frame members are disposed in engagement with the rail members of the other of the frame members. Latching members on each of the frame members latch the frame members together thereby forming a chip carrier-receiving area so that the top sections of the terminal posts can be eletrically connected to respective conductive members when the ceramic chip carrier is positioned within the chip carrier-receiving area.
摘要翻译：用于电连接到陶瓷芯片载体的导电构件的电连接器包括第一和第二电介质框架构件，每个电介体框架构件具有相对的侧构件，其中电端子柱以间隔的间隔固定，顶部在侧构件的上表面上延伸，底部部分延伸到侧部构件的底部表面之下。轨道构件在每个框架构件的相应侧构件之间延伸，使得当框架构件嵌套在一起时，一个框架构件的轨道构件设置成与另一个框架构件的轨道构件接合。每个框架构件上的闩锁构件将框架构件卡在一起，从而形成芯片载体接收区域，使得当陶瓷芯片载体位于芯片载体接收区域内时，端子柱的顶部部分可以电连接到相应的导电构件，接收区域。

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