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    • 3. 外观设计
    • Headphone
    • USD1037201S1
    • 2024-07-30
    • US29839970
    • 2022-05-25
    • Razer (Asia-Pacific) Pte. Ltd.
    • Eugene Hanjie Wang
    • FIG. 1 is a perspective view of a first embodiment of a headphone, showing my new design;
      FIG. 2 is a front elevational view thereof;
      FIG. 3 is a rear elevational view thereof;
      FIG. 4 is a right side elevational view thereof;
      FIG. 5 is a left side elevational view thereof;
      FIG. 6 is a top plan view thereof; and
      FIG. 7 is a bottom plan view thereof.
      FIG. 8 is a perspective view of a second embodiment of a headphone, showing my new design;
      FIG. 9 is a front elevational view thereof;
      FIG. 10 is a rear elevational view thereof;
      FIG. 11 is a right side elevational view thereof;
      FIG. 12 is a left side elevational view thereof;
      FIG. 13 is a top plan view thereof; and
      FIG. 14 is a bottom plan view thereof.
      FIG. 15 is a perspective view of a third embodiment of a headphone, showing my new design;
      FIG. 16 is a front elevational view thereof;
      FIG. 17 is a rear elevational view thereof,
      FIG. 18 is a right side elevational view thereof;
      FIG. 19 is a left side elevational view thereof;
      FIG. 20 is a top plan view thereof; and,
      FIG. 21 is a bottom plan view thereof.
      The broken lines shown in the Figures are environment only and show portions of the headphone that form no part of the claimed design. The broken lines immediately adjacent the shaded areas represent the bounds of the claimed design while all other broken lines are directed to environment and are for illustrative purposes only; the broken lines form no part of the claimed design.
    • 5. 外观设计
    • Headphone
    • USD1026857S1
    • 2024-05-14
    • US29876506
    • 2023-05-23
    • RAZER (ASIA-PACIFIC) PTE. LTD.
    • Charles Richard Bolton
    • FIG. 1 is a perspective view of a first embodiment of a headphone, showing my new design;
      FIG. 2 is a front elevational view thereof;
      FIG. 3 is a rear elevational view thereof;
      FIG. 4 is a right side elevational view thereof;
      FIG. 5 is a left side elevational view thereof;
      FIG. 6 is a top plan view thereof; and
      FIG. 7 is a bottom plan view thereof.
      FIG. 8 is a perspective view of a second embodiment of a headphone, showing my new design;
      FIG. 9 is a front elevational view thereof;
      FIG. 10 is a rear elevational view thereof;
      FIG. 11 is a right side elevational view thereof;
      FIG. 12 is a left side elevational view thereof;
      FIG. 13 is a top plan view thereof; and
      FIG. 14 is a bottom plan view thereof.
      FIG. 15 is a perspective view of a third embodiment of a headphone, showing my new design;
      FIG. 16 is a front elevational view thereof;
      FIG. 17 is a rear elevational view thereof;
      FIG. 18 is a right side elevational view thereof;
      FIG. 19 is a left side elevational view thereof;
      FIG. 20 is a top plan view thereof; and
      FIG. 21 is a bottom plan view thereof.
      FIG. 22 is a perspective view of a fourth embodiment of a headphone, showing my new design;
      FIG. 23 is a front elevational view thereof;
      FIG. 24 is a rear elevational view thereof;
      FIG. 25 is a right side elevational view thereof;
      FIG. 26 is a left side elevational view thereof;
      FIG. 27 is a top plan view thereof; and,
      FIG. 28 is a bottom plan view thereof.
      The broken lines shown in the figures are environment only and show portions of the headphone that form no part of the claimed design. The broken lines immediately adjacent the shaded areas represent the bounds of the claimed design while all other broken lines are directed to environment and are for illustrative purposes only; the broken lines form no part of the claimed design.