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1. 发明授权

US08891563B2 Multi-chip OPS-laser 有权
标题翻译：多芯片OPS激光器
公开(公告)号：US08891563B2
公开(公告)日：2014-11-18
申请号：US13545593
申请日：2012-07-10
申请人： Qi-Ze Shu
发明人： Qi-Ze Shu
IPC分类号： H01S3/10
CPC分类号： H01S3/07 , H01S3/08 , H01S3/082 , H01S3/109 , H01S5/041 , H01S5/142 , H01S5/183 , H01S5/4062
摘要： A two-chip OPS laser includes first and second OPS-chips each emitting the same fundamental wavelength in first and second resonators. The first and second resonators are interferometrically combined on a common path terminated by a common end-mirror. The interferometric combination provides for automatic wavelength-locking of the laser, which can eliminate the need for a separate wavelength selective device in the laser.
摘要翻译：双芯片OPS激光器包括在第一和第二谐振器中发射相同基波的第一和第二OPS芯片。第一和第二谐振器被干涉地组合在由公共末端镜端接的公共路径上。干涉组合提供激光的自动波长锁定，这可以消除激光器中单独的波长选择装置的需要。

2. 发明申请

US20120257647A1 COOLING APPARATUS FOR OPTICALLY PUMPED SEMICONDUCTOR LASER 有权
标题翻译：用于光泵浦半导体激光器的冷却装置
公开(公告)号：US20120257647A1
公开(公告)日：2012-10-11
申请号：US13084235
申请日：2011-04-11
申请人： Qi-Ze Shu , Charles King
发明人： Qi-Ze Shu , Charles King
IPC分类号： H01S3/04
CPC分类号： H01S5/02484 , H01S5/02415 , H01S5/041 , H01S5/14 , H01S5/183
摘要： An OPS-chip is soldered mirror-structure-side down on an upper surface of diamond-heat spreader. A metal frame is also soldered to the upper surface of the heat-spreader. The lower surface of the diamond heat-spreader is either soldered to, or clamped against, a surface of a heat-sink. The dimensions of the frame and the heat spreader are selected such that at a solidification temperature of the solder at the center of the upper surface of the heat-spreader has an effective CTE comparable with that of the OPS-chip. The lower surface of the heat-spreader can be soldered to the heat sink surface or clamped against the heat-sink surface by the frame.
摘要翻译：在金刚石散热器的上表面上将OPS芯片焊接在镜面结构侧。金属框架也焊接到散热器的上表面。金刚石散热器的下表面被焊接到散热器的表面上或夹紧在散热器的表面上。选择框架和散热器的尺寸，使得在散热器的上表面的中心处的焊料的固化温度具有与OPS芯片的有效CTE相当的有效CTE。散热器的下表面可以焊接到散热器表面或通过框架夹紧在散热表面上。

3. 发明申请

US20140016657A1 MULTI-CHIP OPS-LASER 有权
标题翻译：多芯片OPS激光
公开(公告)号：US20140016657A1
公开(公告)日：2014-01-16
申请号：US13545593
申请日：2012-07-10
申请人： Qi-Ze SHU
发明人： Qi-Ze SHU
IPC分类号： H01S5/04 , H01S5/06
CPC分类号： H01S3/07 , H01S3/08 , H01S3/082 , H01S3/109 , H01S5/041 , H01S5/142 , H01S5/183 , H01S5/4062
摘要： A two-chip OPS laser includes first and second OPS-chips each emitting the same fundamental wavelength in first and second resonators. The first and second resonators are interferometrically combined on a common path terminated by a common end-mirror. The interferometric combination provides for automatic wavelength-locking of the laser, which can eliminate the need for a separate wavelength selective device in the laser.
摘要翻译：双芯片OPS激光器包括在第一和第二谐振器中发射相同基波的第一和第二OPS芯片。第一和第二谐振器被干涉地组合在由公共末端镜端接的公共路径上。干涉组合提供激光的自动波长锁定，这可以消除激光器中单独的波长选择装置的需要。

4. 发明申请

US20090190623A1 EXTERNAL-CAVITY OPTICALLY-PUMPED SEMICONDUCTOR-LASER WITH A RESONATOR STOP 有权
标题翻译：具有谐振器停止功能的外部腔室光泵浦半导体激光器
公开(公告)号：US20090190623A1
公开(公告)日：2009-07-30
申请号：US12021652
申请日：2008-01-29
申请人： CHRISTOPHER IHLI , Qi-Ze Shu , Andrea Caprara , Juan L. Chilla
发明人： CHRISTOPHER IHLI , Qi-Ze Shu , Andrea Caprara , Juan L. Chilla
IPC分类号： H01S3/081
CPC分类号： H01S3/0604 , H01S3/0621 , H01S3/0805 , H01S3/0816 , H01S3/094053 , H01S3/0941 , H01S3/106 , H01S3/109 , H01S5/041 , H01S5/14 , H01S5/183
摘要： An optically pumped semiconductor-laser (OPS-laser) resonator includes an arrangement for delivering optical pump radiation on an OPS-chip to cause fundamental radiation to circulate in the resonator. The resonator includes second and third-harmonic generating crystals and is arranged deliver third-harmonic radiation. The resonator also includes a stop positioned and configured to stabilize the laser output. The pump radiation arrangement delivers the pump radiation at an angle to the resonator axis and includes wedged GRIN lens arranged such that the pump radiation forms a circular spot on the OPS chip. The third harmonic generating crystal acts as a polarizer for the fundamental radiation and angularly separates fundamental and third harmonic beams.
摘要翻译：光泵浦半导体激光器（OPS激光器）谐振器包括用于在OPS芯片上传送光泵浦辐射以使基本辐射在谐振器中循环的布置。谐振器包括二次和三次谐波产生的晶体，并且被布置成传递三次谐波辐射。谐振器还包括定位和配置以稳定激光输出的停止。泵浦辐射装置将泵浦辐射与谐振器轴线成角度地传送，并且包括楔形GRIN透镜，其布置成使得泵浦辐射在OPS芯片上形成圆形点。三次谐波产生晶体用作基波辐射的偏振器，并且角度地分离基波和三次谐波。

5. 发明授权

US06525867B1 Fast response micro-modulator arrays 失效
标题翻译：快速响应微调制器阵列
公开(公告)号：US06525867B1
公开(公告)日：2003-02-25
申请号：US09603106
申请日：2000-06-22
申请人： William S. Oakley , Mahdad Manavi , Qi-Ze Shu
发明人： William S. Oakley , Mahdad Manavi , Qi-Ze Shu
IPC分类号： G02F100
CPC分类号： G02F1/0551
摘要： Micro fabricated arrays of optical modulators of both a surface electrode and machined mesa nature where the small structure size and low capacitance electrical connections permit each modulator element to be individually electrically addressed thus providing modulator optical rise and fall response times in the low and sub nanosecond range. Both sparsely spaced and closely packed arrays are achieved.
摘要翻译：表面电极和机械加工的台面性质的光学调制器的微制造阵列，其中小结构尺寸和低电容电连接允许每个调制器元件被单独地电寻址，从而在低和亚纳秒范围内提供调制器光学上升和下降响应时间。实现了稀疏间隔和紧密排列的阵列。

6. 发明授权

US08804783B2 Cooling apparatus for optically pumped semiconductor laser 有权
标题翻译：光泵浦半导体激光器冷却装置
公开(公告)号：US08804783B2
公开(公告)日：2014-08-12
申请号：US13084235
申请日：2011-04-11
申请人： Qi-Ze Shu , Charles King
发明人： Qi-Ze Shu , Charles King
IPC分类号： H01S3/04
CPC分类号： H01S5/02484 , H01S5/02415 , H01S5/041 , H01S5/14 , H01S5/183
摘要： An OPS-chip is soldered mirror-structure-side down on an upper surface of diamond-heat spreader. A metal frame is also soldered to the upper surface of the heat-spreader. The lower surface of the diamond heat-spreader is either soldered to, or clamped against, a surface of a heat-sink. The dimensions of the frame and the heat spreader are selected such that at a solidification temperature of the solder at the center of the upper surface of the heat-spreader has an effective CTE comparable with that of the OPS-chip. The lower surface of the heat-spreader can be soldered to the heat sink surface or clamped against the heat-sink surface by the frame.
摘要翻译：在金刚石散热器的上表面上将OPS芯片焊接在镜面结构侧。金属框架也焊接到散热器的上表面。金刚石散热器的下表面被焊接到散热器的表面上或夹紧在散热器的表面上。选择框架和散热器的尺寸，使得在散热器的上表面的中心处的焊料的固化温度具有与OPS芯片的有效CTE相当的有效CTE。散热器的下表面可以焊接到散热器表面或通过框架夹紧在散热表面上。

7. 发明授权

US07881349B2 External-cavity optically-pumped semiconductor-laser with a resonator stop 有权
标题翻译：具有谐振器停止的外腔光泵浦半导体激光器
公开(公告)号：US07881349B2
公开(公告)日：2011-02-01
申请号：US12021652
申请日：2008-01-29
申请人： Christopher Ihli , Qi-Ze Shu , Andrea Caprara , Juan L. Chilla
发明人： Christopher Ihli , Qi-Ze Shu , Andrea Caprara , Juan L. Chilla
IPC分类号： H01S3/109 , H01S3/081 , H01S3/0941
CPC分类号： H01S3/0604 , H01S3/0621 , H01S3/0805 , H01S3/0816 , H01S3/094053 , H01S3/0941 , H01S3/106 , H01S3/109 , H01S5/041 , H01S5/14 , H01S5/183
摘要： An optically pumped semiconductor-laser (OPS-laser) resonator includes an arrangement for delivering optical pump radiation on an OPS-chip to cause fundamental radiation to circulate in the resonator. The resonator includes second and third-harmonic generating crystals and is arranged deliver third-harmonic radiation. The resonator also includes a stop positioned and configured to stabilize the laser output. The pump radiation arrangement delivers the pump radiation at an angle to the resonator axis and includes wedged GRIN lens arranged such that the pump radiation forms a circular spot on the OPS chip. The third harmonic generating crystal acts as a polarizer for the fundamental radiation and angularly separates fundamental and third harmonic beams.
摘要翻译：光泵浦半导体激光器（OPS激光器）谐振器包括用于在OPS芯片上传送光泵浦辐射以使基本辐射在谐振器中循环的布置。谐振器包括二次和三次谐波产生的晶体，并且被布置成传递三次谐波辐射。谐振器还包括定位和配置以稳定激光输出的停止。泵浦辐射装置将泵浦辐射与谐振器轴线成角度地传送，并且包括楔形GRIN透镜，其布置成使得泵浦辐射在OPS芯片上形成圆形点。三次谐波产生晶体用作基波辐射的偏振器，并且角度地分离基波和三次谐波。

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