专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US09007456B2 Device and method for inspecting semiconductor wafers 有权
标题翻译：用于检查半导体晶片的装置和方法
公开(公告)号：US09007456B2
公开(公告)日：2015-04-14
申请号：US12992236
申请日：2009-05-11
申请人： Philippe Gastaldo , François Berger , Cleonisse Serrecchia
发明人： Philippe Gastaldo , François Berger , Cleonisse Serrecchia
IPC分类号： H04N7/18 , H01L21/67 , G01N21/95 , H01L21/687
CPC分类号： H01L21/67288 , G01N21/9501 , H01L21/68707
摘要： Semiconductor wafer inspection device comprising a wager transport arm provided with at least one wafer support element, a wafer gripper, the gripper having two distant branches designed to take hold of the opposed edges of the wafer, the gripper being mounted so as to rotate on a shaft in order to be able to rotate the wafer between an approximately horizontal position and an approximately vertical position, and at least two inspection systems placed on one side of the wafer and on the other, in an approximately vertical position symmetrically with respect to the plane passing through the wafer.
摘要翻译：半导体晶片检查装置包括设置有至少一个晶片支撑元件的投注传送臂，晶片夹持器，所述夹持器具有设计成保持晶片的相对边缘的两个远距离分支，所述夹持器安装成在轴，以便能够在大致水平位置和大致垂直位置之间旋转晶片，以及至少两个检查系统，其放置在晶片的一侧上，另一个放置在相对于平面对称的大致垂直位置穿过晶片。

2. 发明申请

US20090195786A1 DEVICE FOR INSPECTING SEMI-CONDUCTOR WAFERS 审中-公开
标题翻译：用于检查半导体波导的器件
公开(公告)号：US20090195786A1
公开(公告)日：2009-08-06
申请号：US12101674
申请日：2008-04-11
申请人： Philippe Gastaldo
发明人： Philippe Gastaldo
IPC分类号： G01B9/02
CPC分类号： G01N21/9501 , G01N21/8806 , G01N21/9503
摘要： Device for inspecting semi-conductor wafers in motion, including a light source for at least one wafer supported by a transfer element, the said light source being configured to transmit two incident beams on to a surface of the wafer, the incident beams being inclined relative to the normal to the surface, the device also including a unit for detecting interference fringes in the beam reflected by the surface of the wafer.
摘要翻译：用于检查运动中的半导体晶片的装置，包括用于由传输元件支撑的至少一个晶片的光源，所述光源被配置为将两个入射光束传输到晶片的表面上，入射光束相对于该装置还包括用于检测由晶片表面反射的光束中的干涉条纹的单元。

3. 发明申请

US20090051930A1 METHOD FOR DETECTING SURFACE DEFECTS ON A SUBSTRATE AND DEVICE USING SAID METHOD 有权
标题翻译：用于检测基板上的表面缺陷的方法和使用该方法的设备
公开(公告)号：US20090051930A1
公开(公告)日：2009-02-26
申请号：US12057367
申请日：2008-03-27
申请人： Cecile Moulin , Sophie Moritz , Philippe Gastaldo , Francois Berger , Jean-Luc Delcari , Patrice Belin
发明人： Cecile Moulin , Sophie Moritz , Philippe Gastaldo , Francois Berger , Jean-Luc Delcari , Patrice Belin
IPC分类号： G01B11/24
CPC分类号： G01N21/9501 , G01B11/2527 , G01B11/306 , G01N2021/8829
摘要： A method for detecting surface defects, such as slip line type defects, on a substrate designed to be used in electronics, optoelectronics or analogue, including projection of a pattern of light fringes and dark bands onto the substrate, relative displacement of the substrate relative to the pattern, acquisition of a sequence of at least three images of the pattern reflected by the substrate to a sensor, the images corresponding to displacement of the fringes of the pattern, determination of the gradient of the surface of the substrate using displacements of fringes of the pattern, and determination of the presence of a surface defect on the substrate using variations in the gradient of the surface of the substrate. Another embodiment comprises a device using said method.
摘要翻译：在设计用于电子学，光电子学或类似物的衬底上检测表面缺陷（例如滑线型缺陷）的方法，包括将光条纹和暗带的图案投影到衬底上，衬底的相对位移相对于图案，将由衬底反射的图案的至少三个图像的序列的序列获取到传感器，对应于图案条纹位移的图像，使用位移的条纹的位移确定基底的表面的梯度图案，以及使用衬底表面的梯度的变化来确定衬底上表面缺陷的存在。另一实施例包括使用所述方法的装置。

4. 发明申请

US20120057155A1 DEVICE AND METHOD FOR INSPECTING SEMICONDUCTOR WAFERS 有权
标题翻译：用于检查半导体波形的器件和方法
公开(公告)号：US20120057155A1
公开(公告)日：2012-03-08
申请号：US13203117
申请日：2010-02-23
申请人： Philippe Gastaldo
发明人： Philippe Gastaldo
IPC分类号： G01N21/95 , G02B21/06
CPC分类号： G01N21/9501 , G01N21/9503 , G02B21/0016 , G02B21/006 , G02B21/0064 , H01L22/12
摘要： The invention relates to a device for inspecting the edge of semiconductor wafers, including a chromatic confocal microscope (7) with a lighting pathway (10) and an analysis pathway (20), the lighting pathway (10) including a polychromatic light source (11), a slot (12) and an axial chromatism objective lens (15) comprising a lens at least made of a material having an Abbe number lower than 50, and the analysis pathway (20) includes said objective lens, a chromatic filtering slot (22) with a light intensity sensor (24) in that order, the slot of the lighting pathway and the slot of the analysis pathway being provided at substantially the same optical distance from the edge of the wafer to be inspected.
摘要翻译：本发明涉及一种用于检查半导体晶片边缘的装置，包括具有照明路径（10）和分析路径（20）的彩色共聚焦显微镜（7），所述照明路径（10）包括多色光源），狭缝（12）和轴向色度物镜（15），其包括至少由阿贝数小于50的材料制成的透镜，分析通道（20）包括所述物镜，彩色滤光槽 22），光照传感器（24）的顺序，照明路径的槽和分析路径的槽被设置在与待检查的晶片的边缘基本相同的光学距离处。

5. 发明申请

US20110128371A1 DEVICE AND METHOD FOR INSPECTING SEMICONDUCTOR WAFERS 有权
标题翻译：用于检查半导体波形的器件和方法
公开(公告)号：US20110128371A1
公开(公告)日：2011-06-02
申请号：US12992236
申请日：2009-05-11
申请人： Philippe Gastaldo , François Berger , Cleonisse Serrecchia
发明人： Philippe Gastaldo , François Berger , Cleonisse Serrecchia
IPC分类号： H01L21/66 , H01L21/673 , H04N7/18
CPC分类号： H01L21/67288 , G01N21/9501 , H01L21/68707
摘要： Semiconductor wafer inspection device comprising a wager transport arm provided with at least one wafer support element, a wafer gripper, the gripper having two distant branches designed to take hold of the opposed edges of the wafer, the gripper being mounted so as to rotate on a shaft in order to be able to rotate the wafer between an approximately horizontal position and an approximately vertical position, and at least two inspection systems placed on one side of the wafer and on the other, in an approximately vertical position symmetrically with respect to the plane passing through the wafer.
摘要翻译：半导体晶片检查装置包括设置有至少一个晶片支撑元件的投注传送臂，晶片夹持器，所述夹持器具有设计成保持晶片的相对边缘的两个远距离分支，所述夹持器安装成在轴，以便能够在大致水平位置和大致垂直位置之间旋转晶片，以及至少两个检查系统，其放置在晶片的一侧上，另一个放置在相对于平面对称的大致垂直位置穿过晶片。

6. 发明授权

US08654324B2 Device and method for inspecting semiconductor wafers 有权
标题翻译：用于检查半导体晶片的装置和方法
公开(公告)号：US08654324B2
公开(公告)日：2014-02-18
申请号：US13203117
申请日：2010-02-23
申请人： Philippe Gastaldo
发明人： Philippe Gastaldo
IPC分类号： G01N21/00 , G01N21/95
CPC分类号： G01N21/9501 , G01N21/9503 , G02B21/0016 , G02B21/006 , G02B21/0064 , H01L22/12
摘要： The invention relates to a device for inspecting the edge of semiconductor wafers, including a chromatic confocal microscope with a lighting pathway and an analysis pathway, the lighting pathway including a polychromatic light source, a slot and an axial chromatism objective lens comprising a lens at least made of a material having an Abbe number lower than 50, and the analysis pathway includes said objective lens, a chromatic filtering slot with a light intensity sensor in that order, the slot of the lighting pathway and the slot of the analysis pathway being provided at substantially the same optical distance from the edge of the wafer to be inspected.
摘要翻译：本发明涉及一种用于检查半导体晶片边缘的装置，包括具有照明路径和分析路径的彩色共焦显微镜，所述照明路径包括至少包括透镜的多色光源，狭缝和轴向色差物镜由阿贝数小于50的材料制成，分析路径包括所述物镜，依次具有光强度传感器的彩色滤光槽，照明路径的槽和分析通道的槽设置在与待检查的晶片的边缘基本上相同的光学距离。

7. 发明授权

US08817249B2 Device and method for inspecting moving semiconductor wafers 有权
标题翻译：用于检查移动半导体晶片的装置和方法
公开(公告)号：US08817249B2
公开(公告)日：2014-08-26
申请号：US13696322
申请日：2011-05-04
申请人： Philippe Gastaldo , Frederic Pernot , Olivier Piffard
发明人： Philippe Gastaldo , Frederic Pernot , Olivier Piffard
IPC分类号： G01N21/00 , G01N21/47 , G01N21/95
CPC分类号： G01N21/47 , G01N21/9501 , G01N21/9503 , H01L21/67288 , H01L22/12
摘要： Device for inspecting defects in semiconductor wafers, comprising a member for detecting surface defects using variations in the slope of a surface of the wafer, a member for detecting surface defects using variations in the light intensity reflected by a surface of the wafer, at a plurality of points, a member for detecting light intensity scattered by the surface of the wafer, a light source, and a detecting and classifying mechanism connected upstream of said detecting members.
摘要翻译：用于检查半导体晶片中的缺陷的装置，包括使用晶片表面的斜率的变化来检测表面缺陷的部件，用于使用晶片表面反射的光强度的变化来检测表面缺陷的部件，多个的点，用于检测由晶片表面散射的光强度的成员，光源，以及连接在所述检测部件上游的检测和分类机构。

8. 发明申请

US20130044316A1 DEVICE AND METHOD FOR INSPECTING MOVING SEMICONDUTOR WAFERS 有权
标题翻译：用于检测移动半导体波形的装置和方法
公开(公告)号：US20130044316A1
公开(公告)日：2013-02-21
申请号：US13696322
申请日：2011-05-04
申请人： Philippe Gastaldo , Frederic Pernot , Olivier Piffard
发明人： Philippe Gastaldo , Frederic Pernot , Olivier Piffard
IPC分类号： G01N21/00
CPC分类号： G01N21/47 , G01N21/9501 , G01N21/9503 , H01L21/67288 , H01L22/12
摘要： Device for inspecting defects in semiconductor wafers, comprising a member for detecting surface defects using variations in the slope of a surface of the wafer, a member for detecting surface defects using variations in the light intensity reflected by a surface of the wafer, at a plurality of points, a member for detecting light intensity scattered by the surface of the wafer, a light source, and a detecting and classifying mechanism connected upstream of said detecting members.
摘要翻译：用于检查半导体晶片中的缺陷的装置，包括使用晶片表面的斜率的变化来检测表面缺陷的部件，用于使用晶片表面反射的光强度的变化来检测表面缺陷的部件，多个的点，用于检测由晶片表面散射的光强度的成员，光源，以及连接在所述检测部件上游的检测和分类机构。

9. 发明授权

US07812942B2 Method for detecting surface defects on a substrate and device using said method 有权
标题翻译：使用所述方法检测衬底和器件上的表面缺陷的方法
公开(公告)号：US07812942B2
公开(公告)日：2010-10-12
申请号：US12057367
申请日：2008-03-27
申请人： Cécile Moulin , Sophie Moritz , Philippe Gastaldo , François Berger , Jean-Luc Delcarri , Patrice Belin , Christophe Maleville
发明人： Cécile Moulin , Sophie Moritz , Philippe Gastaldo , François Berger , Jean-Luc Delcarri , Patrice Belin , Christophe Maleville
IPC分类号： G01N21/00
CPC分类号： G01N21/9501 , G01B11/2527 , G01B11/306 , G01N2021/8829
摘要： A method for detecting surface defects, such as slip line type defects, on a substrate designed to be used in electronics, optoelectronics or analogue, including projection of a pattern of light fringes and dark bands onto the substrate, relative displacement of the substrate relative to the pattern, acquisition of a sequence of at least three images of the pattern reflected by the substrate to a sensor, the images corresponding to displacement of the fringes of the pattern, determination of the gradient of the surface of the substrate using displacements of fringes of the pattern, and determination of the presence of a surface defect on the substrate using variations in the gradient of the surface of the substrate. Another embodiment comprises a device using said method.
摘要翻译：在设计用于电子学，光电子学或类似物的衬底上检测表面缺陷（例如滑线型缺陷）的方法，包括将光条纹和暗带的图案投影到衬底上，衬底的相对位移相对于图案，将由衬底反射的图案的至少三个图像的序列的序列获取到传感器，对应于图案条纹位移的图像，使用位移的条纹的位移确定基底的表面的梯度图案，以及使用衬底表面的梯度的变化来确定衬底上表面缺陷的存在。另一实施例包括使用所述方法的装置。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式