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    • 4. 发明授权
    • Method of making a micro-fluid ejection device
    • 制造微流体喷射装置的方法
    • US07690115B2
    • 2010-04-06
    • US11386174
    • 2006-03-22
    • Mary C. SmootPaul T. SpiveyMelissa M. WaldeckCraig M. BertelsenSean T. Weaver
    • Mary C. SmootPaul T. SpiveyMelissa M. WaldeckCraig M. BertelsenSean T. Weaver
    • B21D53/76B32B38/14
    • B41J2/17559B41J2/17513B41J2/1752B41J2/17526B41J2/17553C07D235/18C07D401/12C07D403/12Y10S29/001Y10T29/4913Y10T29/49155Y10T29/49401Y10T29/49798Y10T156/1062
    • A method is provided for making a multi-fluid cartridge for holding multiple fluids in segregated containment localities. The cartridge body contains fluid supply paths in fluid flow communication with the containment localities. A nozzle plate is attached to a device side of each of a plurality of defined ejection head substrates on a semiconductor wafer. Each of the ejection head substrates has a fluid supply side and two or more fluid flow paths therein for supplying fluid from the supply side to the device side thereof. The fluid flow paths in the ejection head substrates have a flow path density of greater than about 1.0 flow paths per millimeter. The wafer is diced to provide a plurality of micro-fluid ejection device structures. A circuit device is attached to the device side of each of the substrates. An adhesive is stencil printed with a bond line density of at least about 1.2 mm−1 on the micro-fluid ejection device structures or on the cartridge body. At least one of the micro-fluid ejection device structures and attached circuit is adhesively bonded to the cartridge body for flow of fluid from the containment localities to the device side thereof.
    • 提供了一种用于制造用于将多个流体保持在分离的容纳区域中的多流体盒的方法。 盒体包含与容纳部位流体连通的流体供给路径。 在半导体晶片上的多个限定的喷墨头基板的每一个的装置侧附着喷嘴板。 每个喷射头基板具有流体供应侧和两个或更多个流体流动路径,用于将流体从供给侧提供到其装置侧。 喷射头基板中的流体流动路径具有大于约1.0流动路径/毫米的流路密度。 切割晶片以提供多个微流体喷射装置结构。 电路装置连接到每个基板的装置侧。 在微流体喷射装置结构或盒体上,用粘合线印刷粘合线密度为至少约1.2mm-1的粘合剂。 微流体喷射装置结构和附接电路中的至少一个被粘合到盒主体上,用于将流体从容纳区域流动到其装置侧。
    • 6. 发明授权
    • Inkjet printhead packaging tape for sealing nozzles
    • 用于密封喷嘴的喷墨打印头包装胶带
    • US07669978B2
    • 2010-03-02
    • US11699295
    • 2007-01-29
    • Paul T. SpiveyWilliam B. Rose
    • Paul T. SpiveyWilliam B. Rose
    • B41J2/05B41J2/14B41J2/16B41J2/175
    • B41J2/14072
    • An inkjet printhead has a body and a heater chip attached thereto. A nozzle plate on the heater chip includes a periphery and plurality of nozzle holes. An encapsulant bead lines the periphery of the nozzle plate and has a leading edge extending in a direction away from the periphery toward the plurality of nozzle holes. The boundary of the bead embodies an irregular shape and the leading edge exists less than about 500 microns from any of the nozzle holes. A tape attaches to the nozzle plate and covers each of the nozzle holes. The tape does not, however, touch the encapsulant bead. Preferably, the tape has a narrow width portion shorter than a width of the nozzle plate. In this manner, the encapsulant bead may encroach upon the nozzle holes closer than heretofore known. In turn, the heater chip can have reduced size and silicon savings.
    • 喷墨打印头具有附接到其上的主体和加热器芯片。 加热器芯片上的喷嘴板包括周边和多个喷嘴孔。 密封剂珠沿着喷嘴板的周边排列,并且具有沿远离周边的方向朝向多个喷嘴孔延伸的前缘。 珠的边界体现为不规则形状,并且前缘离任何喷嘴孔小于约500微米。 胶带附着在喷嘴板上并覆盖每个喷嘴孔。 然而,胶带不接触密封剂珠。 优选地,带具有比喷嘴板的宽度短的宽度部分。 以这种方式,密封剂珠可能比以前已知的更接近喷嘴孔。 反过来,加热器芯片可以减小尺寸并节省硅。
    • 10. 发明授权
    • Process for manufacturing a micro-fluid ejection device
    • 微流体喷射装置的制造方法
    • US07043838B2
    • 2006-05-16
    • US10880899
    • 2004-06-30
    • Mary C. SmootPaul T. SpiveyMelissa M. WaldeckCraig M. BertelsenSean T. Weaver
    • Mary C. SmootPaul T. SpiveyMelissa M. WaldeckCraig M. BertelsenSean T. Weaver
    • B21D53/76B32B38/14H05K3/32
    • B41J2/17559B41J2/17513B41J2/1752B41J2/17526B41J2/17553C07D235/18C07D401/12C07D403/12Y10S29/001Y10T29/4913Y10T29/49155Y10T29/49401Y10T29/49798Y10T156/1062
    • A method is provided for making a multi-fluid cartridge for holding multiple fluids in segregated containment localities. The cartridge body contains fluid supply paths in fluid flow communication with the containment localities. A nozzle plate is attached to a device side of each of a plurality of defined ejection head substrates on a semiconductor wafer. Each of the ejection head substrates has a fluid supply side and two or more fluid flow paths therein for supplying fluid from the supply side to the device side thereof. The fluid flow paths in the ejection head substrates have a flow path density of greater than about 1.0 flow paths per millimeter. The wafer is diced to provide a plurality of micro-fluid ejection device structures. A circuit device is attached to the device side of each of the substrates. An adhesive is stencil printed with a bond line density of at least about 1.2 mm−1 on the micro-fluid ejection device structures or on the cartridge body. At least one of the micro-fluid ejection device structures and attached circuit is adhesively bonded to the cartridge body for flow of fluid from the containment localities to the device side thereof.
    • 提供了一种用于制造用于将多个流体保持在分离的容纳区域中的多流体盒的方法。 盒体包含与容纳部位流体连通的流体供给路径。 在半导体晶片上的多个限定的喷墨头基板的每一个的装置侧附着喷嘴板。 每个喷射头基板具有流体供应侧和两个或更多个流体流动路径,用于将流体从供给侧提供到其装置侧。 喷射头基板中的流体流动路径具有大于约1.0流动路径/毫米的流路密度。 切割晶片以提供多个微流体喷射装置结构。 电路装置连接到每个基板的装置侧。 在微流体喷射装置结构上或筒体上的粘合线密度为至少约1.2mm -1的粘合线密度的粘合剂。 微流体喷射装置结构和附接电路中的至少一个被粘合到盒主体上,用于将流体从容纳区域流动到其装置侧。