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    • 1. 发明授权
    • Optoelectronic device encapsulant
    • 光电器件密封剂
    • US06356686B1
    • 2002-03-12
    • US09389779
    • 1999-09-03
    • Joseph Paul Kuczynski
    • Joseph Paul Kuczynski
    • G02B626
    • G02B6/421G02B6/4212G02B6/4292
    • An optically clear encapsulant for optoelectronic packages exhibits a suitably high viscosity both to replace a silicon nitride passivation layer required on a VCSEL die and to fill a gap between the die and an optical coupler, preventing light signal degradation. The encapsulant exhibits optical transparency to light having a wavelength of about 850 nanometers (nm) with substantially no Mie scattering since particulate fillers are not required to modulate viscosity in the encapsulant. Also, the encapsulant further seals wire bonds between the die and a cable header to prevent abrasive wear. The gap-filling encapsulant is particularly suitable for use with vertical cavity surface emitting laser (VCSEL) technology. The encapsulant includes prior to curing, a difunctional acrylate epoxy resin exhibiting pseudoplastic flow and a viscosity of greater than about 0.7×106 centipoise. Accordingly, a method of manufacturing an optical subassembly may eliminate a separate passivation step and instead fill the gap between the die and optical coupler with an optically clear encapsulant.
    • 用于光电封装的光学透明密封剂表现出适当的高粘度,以替代VCSEL裸片上所需的氮化硅钝化层并填充芯片和光耦合器之间的间隙,从而防止光信号劣化。 密封剂对波长约850纳米(nm)的光具有光学透明性,基本上没有米氏散射,因为不需要颗粒填料来调节密封剂中的粘度。 此外,密封剂还密封模头和电缆接头之间的线接合以防止磨损。 间隙填充密封剂特别适用于垂直腔表面发射激光(VCSEL)技术。 密封剂在固化之前包括显示假塑性流动的二官能丙烯酸酯环氧树脂和大于约0.7×10 6厘泊的粘度。 因此,制造光学子组件的方法可以消除单独的钝化步骤,而是用光学透明的密封剂填充管芯和光耦合器之间的间隙。
    • 2. 发明授权
    • Coating material and method for providing asset protection
    • 涂料和提供资产保护的方法
    • US06280797B1
    • 2001-08-28
    • US09488609
    • 2000-01-20
    • Joseph Paul KuczynskiDavid Otto Lewis
    • Joseph Paul KuczynskiDavid Otto Lewis
    • B05D700
    • H01L23/57G06K19/073G06K19/07372H01L23/58H01L2224/48227H01L2224/49175Y10S428/916Y10T428/31678H01L2924/00
    • A material and a method for forming a tamper-indicating identification coating are provided. The components of the coating are selected such that the coating exhibits a characteristic absorption spectrum with distinct features in individual regions during Fourier-transform infa-red (FTIR) spectroscopy. The coating components are selected to provide a distinct spectrum while, at the same time, providing a sufficiently complex spectrum such that the coating is difficult to duplicate. Also, a blowing agent in the coating decomposes to change the FTIR spectrum due to the heat associated with resoldering of an out-of-warranty electronic part marked with the identification coating to an in-warranty circuit card. In addition, the coating may contain a fluorophore to reveal the presence of a tamper-indicating identification coating, allowing a manufacturer to check the card by exposure with ultra-violet (UV) light. Further, the coating composition may be changed periodically and tracked to provide a date marker.
    • 提供了一种用于形成防篡改识别涂层的材料和方法。 选择涂层的组分使得涂层在傅里叶变换红外(FTIR)光谱学中在各个区域中显示具有不同特征的特征吸收光谱。 选择涂层组分以提供不同的光谱,同时提供足够复杂的光谱,使得涂层难以重复。 此外,涂层中的发泡剂由于与识别涂层标记的保修期外的电子部件的结果相关联到保修电路卡而分解来改变FTIR光谱。 此外,涂层可能含有荧光团以显示篡改指示识别涂层的存在,允许制造商通过用紫外线(UV)光照射来检查卡。 此外,可以周期性地改变涂层组合物并进行跟踪以提供日期标记。
    • 5. 发明授权
    • Conformal coating enhanced to provide heat detection
    • 保形涂层增强,提供热检测
    • US07619867B2
    • 2009-11-17
    • US10268738
    • 2002-10-10
    • Dale Larry ChristensenJoseph Paul KuczynskiNicholas Alexander Poleschuk, Jr.
    • Dale Larry ChristensenJoseph Paul KuczynskiNicholas Alexander Poleschuk, Jr.
    • H02H5/04G08B17/10
    • H05K3/284H05K1/0201H05K2201/10151H05K2203/083
    • Disclosed is an enhanced conformal coating, a process for making the same, and several computer related applications. A commercially available conformal coating is combined with a commercially available blowing agent (sometimes called a “foaming agent”) to create an enhanced conformal coating. The formulation of the enhanced coating is such that it will emit a particular gas when heated to a particular temperature. The enhanced coating is then applied to an object to which pre-damage heat detection is desired. A sensor, located proximate to the object, is then used to detect the emitted gas. Once the gas is detected, actions can be taken to reduce the heat in a manner appropriate for the particular object. Application of the enhanced coating within the computer industry can involve its use with a particular electrical component or a group of electrical components (e.g., a circuit board). For example, the enhanced coating can be applied to one or more circuit boards. The coated boards and an appropriate gas sensor are then installed in a computer system housing. When the sensor detects a particular gas, it conveys information to the system regarding the possibility of excess heat. The system can then take remedial action.
    • 公开了增强的保形涂层,其制造方法以及几个计算机相关应用。 将市售的保形涂层与市售发泡剂(有时称为“发泡剂”)组合以产生增强的保形涂层。 增强涂层的配方使得当加热到特定温度时它将发出特定的气体。 然后将增强的涂层施加到期望进行预损伤热检测的物体。 然后使用位于物体附近的传感器来检测排出的气体。 一旦检测到气体,就可以采取适当的方式减少热量。 增强涂层在计算机工业中的应用可以涉及其与特定电气部件或一组电气部件(例如,电路板)的使用。 例如,增强涂层可以应用于一个或多个电路板。 然后将涂覆的板和适当的气体传感器安装在计算机系统壳体中。 当传感器检测到特定的气体时,它向系统传达关于多余热量的可能性的信息。 系统可以采取补救措施。
    • 7. 发明授权
    • Cleavable diepoxide for removable epoxy compositions
    • 可拆卸的二环氧化物用于可去除的环氧组合物
    • US5932682A
    • 1999-08-03
    • US574806
    • 1995-12-19
    • Stephen Leslie BuchwalterJoseph Paul KuczynskiJohn Gregory Stephanie
    • Stephen Leslie BuchwalterJoseph Paul KuczynskiJohn Gregory Stephanie
    • C08G59/22C08G59/42C08G59/68
    • C08G59/686C08G59/22C08G59/24C08G59/42
    • A cleavable epoxy resin composition suitable for encapsulating electronic chips and a method for making the composition comprises the cured reaction product of a diepoxide; a cyclic dicarboxylic anhydride curing agent mixture; a 1,3-diaza compound having two nitrogen atoms present with one nitrogen atom doubly bonded to the central carbon and singly bonded to one other carbon, and the other nitrogen atom singly bonded to the central carbon and singly bonded to another carbon and singly bonded to a hydrogen. The 1,3-diaza compound serves either as the sole catalyst or in combination with a tertiary amine catalyst different from the diaza compound. The composition may include an optional hydroxy functional compound capable of reacting with the cyclic anhydrides to form a half ester thereby initiating the reaction between the diepoxide and the cyclic dicarboxylic anhydride curing agent. The resin can be used for the encapsulation of electronic parts, but can be removed by a solvent. This feature allows electronic components to be recycled.
    • 适用于包封电子芯片的可切割环氧树脂组合物及其制备方法包括二环氧化物的固化反应产物; 环状二羧酸酐固化剂混合物; 存在两个具有两个氮原子的1,3-二氮杂原子,一个氮原子与中心碳双键结合并单独键合到另一个碳上,另一个氮原子单键地键合到中心碳并单独键合到另一个碳上并单键结合 到氢气。 1,3-二氮杂化合物既可用作唯一催化剂,也可用于与二氮化合物不同的叔胺催化剂。 该组合物可以包括能够与环状酸酐反应形成半酯的任选的羟基官能化合物,从而引发二环氧化物和环状二羧酸酐固化剂之间的反应。 该树脂可用于电子部件的封装,但可以通过溶剂除去。 此功能允许电子元件回收。