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1. 发明申请

US20050085017A1 Semiconductor wafer manufacturing method, semiconductor wafer mnaufacturing order acceptance method, and semiconductor wafer manufacturing order acceptance system 失效
标题翻译：半导体晶圆制造方法，半导体晶圆制造订单验收方法以及半导体晶圆制造订单验收系统
公开(公告)号：US20050085017A1
公开(公告)日：2005-04-21
申请号：US10502389
申请日：2003-01-22
申请人： Tatsuo Ito , Shigeyoshi Netsu , Masashi Ichikawa , Nobuhiro Ohara
发明人： Tatsuo Ito , Shigeyoshi Netsu , Masashi Ichikawa , Nobuhiro Ohara
IPC分类号： G05B19/418 , G06Q10/00 , G06Q50/00 , G06Q50/04 , H01L21/02 , H01L21/48
CPC分类号： G06Q10/06 , G05B19/418 , G05B2219/32024 , G06Q10/087 , Y02P90/02 , Y02P90/18
摘要： The present invention provides a method for manufacturing a semiconductor wafer comprising steps of obtaining information of a device manufacturing process, selecting a wafer manufacturing process corresponding thereto, and manufacturing a semiconductor wafer according to the selected wafer manufacturing process. The present invention also provides a method for receiving an order for manufacture of a semiconductor wafer comprising a step of connecting a device maker with a customer computer in a wafer maker, a step wherein the customer computer receives information of a device manufacturing process and a step of selecting a wafer manufacturing process corresponding thereto, and provides a system for receiving an order for manufacture of a semiconductor wafer comprising a client terminal in a device maker and a customer computer in a wafer maker wherein information of a device manufacturing process is inputted into the client terminal and is sent, the customer computer receives the information of the device manufacturing process, and a wafer manufacturing process corresponding thereto is selected. Thereby, there can be provided a method for manufacturing a semiconductor wafer, a method for receiving an order for manufacture of a semiconductor wafer, and a system for receiving an order wherein a wafer suitable for a device manufacturing process in a device maker is supplied.
摘要翻译：本发明提供一种制造半导体晶片的方法，包括以下步骤：根据所选择的晶片制造工艺获得器件制造工艺的信息，选择与之对应的晶片制造工艺，以及制造半导体晶片。本发明还提供了一种用于接收制造半导体晶片的顺序的方法，包括在晶片制造机中将设备制造商与客户计算机连接的步骤，其中客户计算机接收设备制造过程的信息和步骤选择与之对应的晶片制造工艺，并且提供一种用于接收制造半导体晶圆的系统的系统，该半导体晶片包括在晶片制造商中的设备制造商和客户计算机中的客户终端，其中将器件制造过程的信息输入到客户终端被发送，客户计算机接收设备制造过程的信息，并且选择与其对应的晶片制造过程。因此，可以提供一种用于制造半导体晶片的方法，用于接收半导体晶片的制造顺序的方法，以及用于接收其中提供适合于器件制造商中的器件制造工艺的晶片的顺序的系统。

2. 发明授权

US4866230A Method of and apparatus for controlling floating zone of semiconductor rod 失效
标题翻译：控制半导体棒浮动区的方法和装置
公开(公告)号：US4866230A
公开(公告)日：1989-09-12
申请号：US132191
申请日：1987-12-11
申请人： Yasuhiro Ikeda , Kunio Suzuki , Masataka Watanabe , Nobuhiro Ohara
发明人： Yasuhiro Ikeda , Kunio Suzuki , Masataka Watanabe , Nobuhiro Ohara
IPC分类号： C30B13/30
CPC分类号： C30B13/30 , Y10T117/1008
摘要： In a method of controlling a floating zone of a semiconductor rod of the present invention shown in FIG. 1, the diameter D.sub.s at a crystallization boundary of a crystal and the axial length of the floating zone are indirectly controlled by controlling a diameter D.sub.m of a crystallizing-side melt shoulder portion and the diameter D.sub.n of a constricted melt portion, respectively. Since these diameters D.sub.m and D.sub.n are used for predicting D.sub.s and L to be obtained after a given time has passed, the response speed and stability of the control are improved as compared with the direct control of D.sub.s and L. An apparatus for controlling a floating zone of a semiconductor rod of the present invention performs the above-described method. In another method, the zone length is directly or indirectly controlled by regulating a relative moving speed of the melting-side semiconductor rod relative to the heater, and the diameter D.sub.s at the crystallization boundary of the crystal is directly or indirectly controlled by regulating the electrical power supplied to the heater.

3. 发明授权

US07203559B2 Method for manufacturing semiconductor wafer, method for receiving order for manufacture of semiconductor wafer, and system for receiving order for manufacture of semiconductor wafer 失效
标题翻译：半导体晶片的制造方法，接收半导体晶片的制造顺序的方法以及接收半导体晶片的制造顺序的系统
公开(公告)号：US07203559B2
公开(公告)日：2007-04-10
申请号：US10502389
申请日：2003-01-22
申请人： Tatsuo Ito , Shigeyoshi Netsu , Masashi Ichikawa , Nobuhiro Ohara
发明人： Tatsuo Ito , Shigeyoshi Netsu , Masashi Ichikawa , Nobuhiro Ohara
IPC分类号： G06F19/00
CPC分类号： G06Q10/06 , G05B19/418 , G05B2219/32024 , G06Q10/087 , Y02P90/02 , Y02P90/18
摘要： The present invention provides a method for manufacturing a semiconductor wafer comprising steps of obtaining information of a device manufacturing process, selecting a wafer manufacturing process corresponding thereto, and manufacturing a semiconductor wafer according to the selected wafer manufacturing process. The present invention also provides a method for receiving an order for manufacture of a semiconductor wafer comprising a step of connecting a device maker with a customer computer in a wafer maker, a step wherein the customer computer receives information of a device manufacturing process and a step of selecting a wafer manufacturing process corresponding thereto, and provides a system for receiving an order for manufacture of a semiconductor wafer comprising a client terminal in a device maker and a customer computer in a wafer maker wherein information of a device manufacturing process is inputted into the client terminal and is sent, the customer computer receives the information of the device manufacturing process, and a wafer manufacturing process corresponding thereto is selected. Thereby, there can be provided a method for manufacturing a semiconductor wafer, a method for receiving an order for manufacture of a semiconductor wafer, and a system for receiving an order wherein a wafer suitable for a device manufacturing process in a device maker is supplied.
摘要翻译：本发明提供一种制造半导体晶片的方法，包括以下步骤：根据所选择的晶片制造工艺获得器件制造工艺的信息，选择与之对应的晶片制造工艺，以及制造半导体晶片。本发明还提供了一种用于接收制造半导体晶片的顺序的方法，包括在晶片制造机中将设备制造商与客户计算机连接的步骤，其中客户计算机接收设备制造过程的信息和步骤选择与之对应的晶片制造工艺，并且提供一种用于接收制造半导体晶圆的系统的系统，该半导体晶片包括在晶片制造商中的设备制造商和客户计算机中的客户终端，其中将器件制造过程的信息输入到客户终端被发送，客户计算机接收设备制造过程的信息，并且选择与其对应的晶片制造过程。因此，可以提供一种用于制造半导体晶片的方法，用于接收半导体晶片的制造顺序的方法，以及用于接收其中提供适合于器件制造商中的器件制造工艺的晶片的顺序的系统。

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