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    • 1. 发明申请
    • DETERMINING APPARATUS AND DETERMINING METHOD
    • 确定装置和确定方法
    • US20110295524A1
    • 2011-12-01
    • US13109596
    • 2011-05-17
    • Yoshiaki TadaNaoya YamazakiKazuhiro IinoTakashi Shirakami
    • Yoshiaki TadaNaoya YamazakiKazuhiro IinoTakashi Shirakami
    • G06F19/00
    • H05K7/20181
    • A determining method includes: holding a cooled device in a container; detecting a temperature inside the container; detecting a temperature outside the container; facilitating a airflow through an air filter that allows air to flow therethrough between the container and a space outside the container; calculating a packing density of components of the cooled device; detecting a power consumption of the cooled device; detecting the number of revolutions of a fan that facilitates the flow of air through the air filter; and determining that the air filter is clogged when the power consumption is less than or equal to a power threshold value, the number of revolutions is within a specified range, and a difference between the temperature inside the container and the temperature outside the container exceeds a temperature threshold value that depends on the packing density and the power consumption.
    • 确定方法包括:将冷却的装置保持在容器中; 检测容器内的温度; 检测容器外部的温度; 促进通过空气过滤器的气流,其允许空气在容器和容器外部的空间之间流过; 计算冷却装置的部件的堆积密度; 检测冷却装置的功率消耗; 检测有助于空气流过空气过滤器的风扇的转数; 并且当功率消耗小于或等于功率阈值时确定空气过滤器堵塞,转数在规定范围内,并且容器内部的温度与容器外部的温度之间的差超过 温度阈值取决于包装密度和功耗。
    • 8. 发明授权
    • Cooling structure and cooling method for electronic equipment
    • 电子设备冷却结构及冷却方式
    • US07134607B2
    • 2006-11-14
    • US11034138
    • 2005-01-12
    • Fujio OzawaJunichi HayamaTetsuya MurayamaHiroyuki AbeNaoya Yamazaki
    • Fujio OzawaJunichi HayamaTetsuya MurayamaHiroyuki AbeNaoya Yamazaki
    • F24F7/00F25D23/12H05K7/20
    • H05K7/20581H05K7/207
    • A cooling structure for electronic equipment including a plurality of electronic devices superposed on each other, each of the electronic devices having a lower part where an air ventilation part configured to ventilate air so as to cool the electronic device is provided, the cooling structure includes an air intake and exhaust hole forming part which is formed at an upper part of a first one of the electronic devices and below the air ventilation part of a second one of the electronic devices provided on the first electronic device. Air outside of the electronic equipment is taken into an inside of the second electronic device or air inside of the first electronic device is exhausted to the outside of the electronic equipment via the air intake and exhaust hole forming part, so that an amount of the air ventilated inside of the first electronic device is controlled.
    • 一种用于电子设备的冷却结构,包括彼此叠置的多个电子设备,每个电子设备具有下部,其中空气通风部分构造成使空气通风以冷却电子设备,该冷却结构包括: 进气排气孔形成部分,其形成在第一电子设备的上部并且设置在第一电子设备上的第二电子设备的空气通风部分的下方。 电子设备外部的空气被吸入第二电子设备的内部,或者第一电子设备内部的空气经由进气和排气孔形成部件被排出到电子设备的外部,使得空气量 对第一电子装置内的通风进行控制。
    • 9. 发明授权
    • Thermal diffuser and radiator
    • 散热器和散热器
    • US06735077B2
    • 2004-05-11
    • US10074336
    • 2002-02-12
    • Naoya YamazakiKazuhiro IinoTakashi ShirakamiYoshiaki Tada
    • Naoya YamazakiKazuhiro IinoTakashi ShirakamiYoshiaki Tada
    • H05K720
    • H05K7/20418H01L23/473H01L2924/0002H01L2924/00
    • The present invention relates to a thermal diffuser which having a path for close thermal coupling uniformly between an electronic component mounted in an electronic equipment and a desired thermal conductor, and also to a radiator for radiating heat generated in this electronic component via the thermal diffuser. The object of the present invention is to realize flexible adaptability to various devices which are to undergo temperature control at low cost, and to efficiently achieve the temperature control. For this purpose, the thermal diffuser of the present invention has a plate-shaped structure which can be welded or bonded to the case of the electronic component to undergo heat exchange with the exterior and has a channel formed in mesh by a plurality of protrusions with confined heat medium recirculating therethrough.
    • 本发明涉及一种热扩散器,其具有用于在安装在电子设备中的电子部件和期望的热导体之间均匀地紧密地热耦合的路径,以及散热器,用于经由热扩散器散热在该电子部件中产生的热。 本发明的目的是实现对要以低成本进行温度控制的各种装置的灵活适应性,并且有效地实现温度控制。 为此,本发明的热扩散器具有能够与电子部件的壳体焊接或结合的板状结构,与外部进行热交换,并具有通过多个突起形成的通道, 限制热介质循环通过。
    • 10. 发明授权
    • Cable entrance module
    • 电缆入口模块
    • US06232554B1
    • 2001-05-15
    • US09298308
    • 1999-04-23
    • Naoya YamazakiMotoko Nakamura
    • Naoya YamazakiMotoko Nakamura
    • H02G318
    • H02G15/04
    • A cable entrance module is provided at a position of equipment at which a cable enters the equipment from the outside. The cable is inserted through the inside of the cable entrance module. The cable entrance module includes an entrance-side membrane, an exit-side membrane, and a viscous-matter-filling portion. The inside of the filling portion is filled with viscous matter. The entrance-side membrane has such strength that when it is pierced by the extending end of the cable it is pushed by the extending end of the cable. The exit-side membrane has a strength such that it is not pierced by the viscous matter when the cable pierces the entrance-side membrane, enters the viscous-matter filling portion, and moves through the viscous matter in the viscous-matter filling portion while pushing the viscous matter aside. The exit-side membrane is pierced by the extending end of the cable when it is pushed by the extending end of the cable.
    • 电缆入口模块设置在设备的位置,电缆从外部进入设备。 电缆插入电缆入口模块的内部。 电缆入口模块包括入口侧膜,出口侧膜和粘性物质填充部。 填充部分的内部填充有粘性物质。 入口侧膜具有这样的强度,当被电缆的延伸端刺穿时,其被电缆的延伸端推动。 出口侧膜具有这样的强度,使得当电缆穿透入口侧膜时,其不被粘性物质刺穿,进入粘性物质填充部分,并且通过粘性物质填充部分中的粘性物质移动,同时 将粘性物质推到一边。 当电缆的延伸端被推动时,出口侧膜被电缆的延伸端刺穿。