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1. 发明申请

US20100151629A1 MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICES 有权
标题翻译：半导体器件制造方法
公开(公告)号：US20100151629A1
公开(公告)日：2010-06-17
申请号：US12634350
申请日：2009-12-09
申请人： Takashi ODA , Shigenori MORITA , Naoko YOSHIDA
发明人： Takashi ODA , Shigenori MORITA , Naoko YOSHIDA
IPC分类号： H01L21/60
CPC分类号： H01L24/03 , H01L21/6835 , H01L2221/68372 , H01L2224/02319 , H01L2224/04042 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01057 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12044 , H01L2924/1461 , H01L2924/15788 , H01L2924/00
摘要： A wiring circuit layer 2 having a connecting conductor part 21 that can be connected to an electrode 31 of a semiconductor element 3 is formed on a metal support substrate 1 in a way such that the wiring circuit layer can be separated from the substrate 1, and that the connecting conductor part 21 is exposed on the upper face of the wiring circuit layer. The wiring circuit layer 2 is laminated on the element 3 while in a wafer state, and the connecting conductor part 21 and the electrode 31 are connected. Subsequently, the support substrate 1 is peeled from the wiring circuit layer 2, and the wafer is diced, whereby individual semiconductor devices are obtained.
摘要翻译：在金属支撑基板1上形成具有能够与半导体元件3的电极31连接的连接导体部21的布线电路层2，使得布线电路层能够与基板1分离，并且连接导体部21露出在布线电路层的上表面。布线电路层2在晶片状态下层叠在元件3上，连接导体部21和电极31连接。随后，将支撑基板1从布线电路层2剥离，并对晶片进行切割，从而获得各个半导体器件。

2. 发明申请

US20090280239A1 METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD 审中-公开
标题翻译：制造印刷电路板的方法
公开(公告)号：US20090280239A1
公开(公告)日：2009-11-12
申请号：US12425792
申请日：2009-04-17
申请人： Shigenori MORITA , Takashi ODA , Naoko YOSHIDA
发明人： Shigenori MORITA , Takashi ODA , Naoko YOSHIDA
IPC分类号： H05K3/00
CPC分类号： H05K3/107 , H05K3/182 , H05K2203/0108 , H05K2203/0338 , H05K2203/0709
摘要： First, a catalyst for performing electroless plating in a subsequent step is caused to adhere to surfaces of uneven portions of a matrix. Next, an insulating layer made of a resin material is prepared. Then, the insulating layer is heated to be softened while the uneven portions of the matrix are pressed against one surface of the insulating layer. Thus, grooves corresponding to shapes of the uneven portions of the matrix are formed in the insulating layer while the catalyst is transferred to bottom surfaces and side surfaces of the grooves. The insulating layer is then subjected to electroless plating. In this case, metal is deposited by reduction reaction on portions of the insulating layer where the catalyst exists. Accordingly, conductor traces are formed in the grooves of the insulating layer.
摘要翻译：首先，在随后的步骤中进行无电镀的催化剂附着在基体的不均匀部分的表面。接着，制备由树脂材料制成的绝缘层。然后，将绝缘层加热软化，同时将基体的不均匀部分压在绝缘层的一个表面上。因此，在催化剂转移到槽的底面和侧面的同时，在绝缘层中形成对应于矩阵的不平坦部分的形状的凹槽。然后对绝缘层进行化学镀。在这种情况下，通过还原反应将金属沉积在存在催化剂的绝缘层的部分上。因此，导体迹线形成在绝缘层的沟槽中。

3. 发明授权

US5776358A Electrolyte for driving electrolytic capacitor and electrolytic capacitor using the same 失效
标题翻译：用于驱动电解电容器和电解电容器的电解液
公开(公告)号：US5776358A
公开(公告)日：1998-07-07
申请号：US732372
申请日：1997-05-02
申请人： Nario Niibo , Naoko Yoshida , Yoshinori Takamuku
发明人： Nario Niibo , Naoko Yoshida , Yoshinori Takamuku
IPC分类号： H01G9/035 , H01G9/02 , H01G9/022
CPC分类号： H01G9/022
摘要： The invention relates to an electrolyte for driving electrolytic capacitor and an electrolytic capacitor using the same, and by preparing by using a solvent mainly composed of organic compound, and dissolving one or more solutes selected from the group consisting of inorganic acids and organic acids, more specifically adding and dissolving at least one of copolymers of polyethylene glycol and polypropylene glycol shown in formulas (1) and (2), or both of the copolymers of polyethylene glycol and polypropylene glycol shown in formulas (1) and (2) simultaneously, the spark generation voltage and chemical conversion factor of formed oxidation film are enhanced, thereby improving the reliability of the electrolytic capacitor.HO--(C.sub.2 H.sub.4 O).sub.n --(C.sub.3 H.sub.6 O).sub.m--(C.sub.2 H.sub.4 O).sub.n --H (1) (n and m are arbitrary natural numbers.) HO--�(C.sub.2 H.sub.4 O).sub.n --(C.sub.3 H.sub.6 O).sub.m !.sub.i --H(2) (n, m, and 1 are arbitrary natural numbers.)
摘要翻译： PCT No.PCT / JP96 / 00473 Sec。 371日期：1997年5月2日 102（e）日期1997年5月2日PCT提交1996年2月29日PCT公布。第WO96 / 27201号公报日期1996年9月6日本发明涉及一种用于驱动电解电容器的电解质和使用其的电解电容器，并且通过使用主要由有机化合物组成的溶剂制备，并溶解一种或多种选自无机酸的溶质和有机酸，更具体地加入和溶解式（1）和（2）所示的聚乙二醇和聚丙二醇的共聚物中的至少一种，或式（1）和（2）所示的聚乙二醇和聚丙二醇的共聚物， 2）同时，提高了形成的氧化膜的火花发生电压和化学转化率，从而提高了电解电容器的可靠性。HO-（C2H4O）n-（C3H6O）m-（C2H4O）nH（1）（n和）HO - [（C2H4O）n-（C3H6O）m] iH（2）（n，m和1是任意的自然数）

4. 发明授权

US08183093B2 Method of manufacturing a semiconductor device by lamination 有权
标题翻译：通过层压制造半导体器件的方法
公开(公告)号：US08183093B2
公开(公告)日：2012-05-22
申请号：US12732767
申请日：2010-03-26
申请人： Naoko Yoshida , Takashi Oda , Shigenori Morita
发明人： Naoko Yoshida , Takashi Oda , Shigenori Morita
IPC分类号： H01L21/00
CPC分类号： H01L24/03 , H01L21/6835 , H01L2221/68372 , H01L2224/02319 , H01L2224/0401 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12044 , H01L2924/1461 , H01L2924/15788 , H01L2924/00
摘要： A wiring circuit layer 2 having at least a wiring part and an insulating part, whose top and bottom surfaces (20A, 20B) is adhesive surfaces, is formed on a metal support substrate 1 in a way such that the layer 2 can be peeled from the substrate 1. Exposed in the first adhesive surface 20A of the wiring circuit layer 2 is a first connecting conductor part 21, which is connectable with an electrode 31 of a first semiconductor element 3 in a wafer state. After the wiring circuit layer 2 is laminated on and connected to the element 3, the metal support substrate 1 is peeled from the wiring circuit layer 2 to yield a semiconductor device 4. Another element may be connected to the other adhesive surface 20B exposed upon the peeling.
摘要翻译：具有至少布线部分和绝缘部分的布线电路层2，其顶表面和底表面（20A，20B）是粘合表面，以使得层2可以从金属支撑基板1上剥离的方式形成在金属支撑基板1上基板1.暴露在布线电路层2的第一粘合面20A中的是第一连接导体部21，其与晶片状态的第一半导体元件3的电极31连接。在将电路层2层压并连接到元件3之后，金属支撑基板1从布线电路层2剥离，得到半导体器件4.另一个元件可以连接到暴露在元件3上的另一个粘合表面20B 剥皮

5. 发明授权

US5121444A Pattern recognition apparatus 失效
标题翻译：模式识别装置
公开(公告)号：US5121444A
公开(公告)日：1992-06-09
申请号：US534068
申请日：1990-06-06
申请人： Yoshinori Takizawa , Naoko Yoshida
发明人： Yoshinori Takizawa , Naoko Yoshida
IPC分类号： G06T7/00 , G06K9/64
CPC分类号： G06K9/6202
摘要： A pattern recognition apparatus is disclosed that is capable of high-speed, automatic recognition of input image patterns with a high degree of accuracy and which also has a broad range of operational tolerance to shifts in the position of input image patterns. The pixel data of an input image are compared by separate circuits with pixel data of reference image patterns. Other circuits use these comparisons to select that one of the reference patterns to which the input image corresponds.
摘要翻译：公开了一种能够以高精确度高速自动识别输入图像图案的图案识别装置，并且还具有对输入图像图案的位置偏移的宽范围的操作容限。输入图像的像素数据通过与参考图像图案的像素数据分开的电路进行比较。其他电路使用这些比较来选择输入图像对应的参考图案之一。

6. 发明申请

US20060134119A1 Drugs containing galectin 9 审中-公开
标题翻译：含有半乳凝素的药物9
公开(公告)号：US20060134119A1
公开(公告)日：2006-06-22
申请号：US10543193
申请日：2003-08-21
申请人： Mitsuomi Hirashima , Nozomu Nishi , Akira Yamauchi , Naoko Yoshida , Masako Seki
发明人： Mitsuomi Hirashima , Nozomu Nishi , Akira Yamauchi , Naoko Yoshida , Masako Seki
IPC分类号： A61K48/00 , A61K38/17 , A61K39/395
CPC分类号： A61K38/1709 , C07K16/18
摘要： Galectin 9 exerts various functions depending on its localizations. On the other hand, galectin 9 is expected as participating in various biological functions. Thus, it has been required to clarify the detailed biological activities of galectin 9 and develop galectin 9-related techniques including development of drugs. Human galectin 9 shows a cytotoxic activity and an apoptosis-inducing activity on tumor cells but shows neither cytotoxic activity nor apoptosis-inducing activity on normal cells. Therefore, it is possible to employ galectin 9 proteins, galectin 9 agonists, galectin 9 antagonists, anti-galectin 9 binding protein antibodies, anti-galectin 9 binding sugar chain antibodies, galectin 9-producing, releasing or inducing substances, etc. as antitumor, antiallergic, immunosuppressive agents, drugs for autoimmune diseases, anti-inflammatory agents and active ingredients for adrenocortical steroid hormone alternatives.
摘要翻译： Galectin 9根据其定位具有各种功能。另一方面，半乳凝素9预期参与各种生物学功能。因此，需要阐明半乳凝素9的详细生物学活性，并开发包含药物开发的半乳凝素9相关技术。人半乳凝素9显示对肿瘤细胞的细胞毒活性和细胞凋亡诱导活性，但对正常细胞无细胞毒性活性或细胞凋亡诱导活性。因此，可以使用半乳凝素9蛋白，半乳凝素9激动剂，半乳凝素9拮抗剂，抗半乳凝素9结合蛋白抗体，抗半乳凝素9结合糖链抗体，半乳凝素-9产生，释放或诱导物质等作为抗肿瘤剂，抗过敏药，免疫抑制剂，自身免疫性疾病药物，抗炎药和肾上腺皮质激素替代物的活性成分。

7. 发明授权

US08124457B2 Manufacturing method of transferring a wiring circuit layer on a metal support substrate to a semiconductor element 有权
标题翻译：将金属支撑基板上的布线电路层转印到半导体元件上的制造方法
公开(公告)号：US08124457B2
公开(公告)日：2012-02-28
申请号：US12634350
申请日：2009-12-09
申请人： Takashi Oda , Shigenori Morita , Naoko Yoshida
发明人： Takashi Oda , Shigenori Morita , Naoko Yoshida
IPC分类号： H01L21/00
CPC分类号： H01L24/03 , H01L21/6835 , H01L2221/68372 , H01L2224/02319 , H01L2224/04042 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01057 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12044 , H01L2924/1461 , H01L2924/15788 , H01L2924/00
摘要： A wiring circuit layer 2 having a connecting conductor part 21 that can be connected to an electrode 31 of a semiconductor element 3 is formed on a metal support substrate 1 in a way such that the wiring circuit layer can be separated from the substrate 1, and that the connecting conductor part 21 is exposed on the upper face of the wiring circuit layer. The wiring circuit layer 2 is laminated on the element 3 while in a wafer state, and the connecting conductor part 21 and the electrode 31 are connected. Subsequently, the support substrate 1 is peeled from the wiring circuit layer 2, and the wafer is diced, whereby individual semiconductor devices are obtained.
摘要翻译：在金属支撑基板1上形成具有能够与半导体元件3的电极31连接的连接导体部21的布线电路层2，使得布线电路层能够与基板1分离，并且连接导体部21露出在布线电路层的上表面。布线电路层2在晶片状态下层叠在元件3上，连接导体部21和电极31连接。随后，将支撑基板1从布线电路层2剥离，并对晶片进行切割，从而获得各个半导体器件。

8. 发明申请

US20100248428A1 MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件的制造方法
公开(公告)号：US20100248428A1
公开(公告)日：2010-09-30
申请号：US12732767
申请日：2010-03-26
申请人： Naoko YOSHIDA , Takashi ODA , Shigenori MORITA
发明人： Naoko YOSHIDA , Takashi ODA , Shigenori MORITA
IPC分类号： H01L21/50 , H01L21/60
CPC分类号： H01L24/03 , H01L21/6835 , H01L2221/68372 , H01L2224/02319 , H01L2224/0401 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12044 , H01L2924/1461 , H01L2924/15788 , H01L2924/00
摘要： A wiring circuit layer 2 having at least a wiring part and an insulating part, whose top and bottom surfaces (20A, 20B) is adhesive surfaces, is formed on a metal support substrate 1 in a way such that the layer 2 can be peeled from the substrate 1. Exposed in the first adhesive surface 20A of the wiring circuit layer 2 is a first connecting conductor part 21, which is connectable with an electrode 31 of a first semiconductor element 3 in a wafer state. After the wiring circuit layer 2 is laminated on and connected to the element 3, the metal support substrate 1 is peeled from the wiring circuit layer 2 to yield a semiconductor device 4. Another element may be connected to the other adhesive surface 20B exposed upon the peeling.
摘要翻译：具有至少布线部分和绝缘部分的布线电路层2，其顶表面和底表面（20A，20B）是粘合表面，以使得层2可以从金属支撑基板1上剥离的方式形成在金属支撑基板1上基板1.暴露在布线电路层2的第一粘合面20A中的是第一连接导体部21，其与晶片状态的第一半导体元件3的电极31连接。在将电路层2层压并连接到元件3之后，金属支撑基板1从布线电路层2剥离，得到半导体器件4.另一个元件可以连接到暴露在元件3上的另一个粘合表面20B 剥皮

9. 发明授权

US5065440A Pattern recognition apparatus 失效
标题翻译：模式识别装置
公开(公告)号：US5065440A
公开(公告)日：1991-11-12
申请号：US571364
申请日：1990-08-23
申请人： Naoko Yoshida , Yoshinori Takizawa
发明人： Naoko Yoshida , Yoshinori Takizawa
IPC分类号： G06T7/00 , G06K9/64
CPC分类号： G06K9/6202
摘要： A pattern recognition apparatus is capable of high-speed, automatic recognition of input images with a high degree of accuracy. The apparatus has an extended range of tolerance to shifts in the relative position of the input images and provides insensible regions about reference patterns which are shifted horizontally.
摘要翻译：图案识别装置能够以高精度高速自动识别输入图像。该装置对输入图像的相对位置的偏移具有扩展的公差范围，并提供关于水平偏移的参考图案的不可见区域。

10. 发明申请

US20120260980A1 DYE-SENSITIZED SOLAR CELL, AND SEAL MEMBER TO BE USED FOR THE DYE-SENSITIZED SOLAR CELL 审中-公开
标题翻译：透明的太阳能电池和用于透明的太阳能电池的密封件
公开(公告)号：US20120260980A1
公开(公告)日：2012-10-18
申请号：US13430918
申请日：2012-03-27
申请人： Kazumasa Igarashi , Yuki Hasegawa , Naoko Yoshida , Yasumi Yamada , Kazuaki Sasa
发明人： Kazumasa Igarashi , Yuki Hasegawa , Naoko Yoshida , Yasumi Yamada , Kazuaki Sasa
IPC分类号： H01L31/0224 , H01L31/0216 , H01L31/02
CPC分类号： H01G9/2077 , H01G9/2031 , H01G9/2059 , H01G9/2095 , Y02E10/542 , Y02P70/521
摘要： A dye-sensitized solar cell of a polymer resin type is provided, which is excellent in sealability. A counter electrode substrate provided with an electrically conductive transparent electrode layer and a working electrode substrate provided with an electrically conductive transparent electrode layer are opposed to each other with the electrode layers facing inward. A space defined between the substrates is sealed with a seal member disposed along peripheries of inner surfaces of the substrates. An electrolyte solution is filled in the sealed space. The substrates are each made of a polymer resin material. Inorganic layers are provided between the substrates and the electrode layers. The seal member is composed of a material obtained by curing a photopolymerizable composition essentially comprising a specific hydrogenated elastomer derivative. The inorganic layers each have a portion coated with a (meth)acryloxyalkylsilane silane coupling agent in contact with the seal member.
摘要翻译：提供了一种聚合物树脂型的染料敏化太阳能电池，其密封性优异。设置有导电透明电极层的对置电极基板和设置有导电性透明电极层的工作电极基板相对，电极层面向内。在基板之间限定的空间用沿着基板的内表面的周边设置的密封部件密封。电解液填充在密封空间中。基板各自由聚合物树脂材料制成。无机层设置在基板和电极层之间。密封构件由通过固化基本上包含特定氢化弹性体衍生物的可光聚合组合物获得的材料组成。无机层各自具有涂覆有与密封构件接触的（甲基）丙烯酰氧基烷基硅烷偶联剂的部分。

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