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1. 发明授权

US6025893A Liquid crystal display device of reflection type 失效
标题翻译：反射型液晶显示装置
公开(公告)号：US6025893A
公开(公告)日：2000-02-15
申请号：US887898
申请日：1997-07-03
申请人： Takeshi Kadowaki , Mitsuru Koarai
发明人： Takeshi Kadowaki , Mitsuru Koarai
IPC分类号： G02F1/1345 , G02F1/13 , G02F1/1362 , G02F1/1333
CPC分类号： G02F1/133308 , G02F1/136277 , G02F2202/28
摘要： A liquid crystal display device of reflection type has a liquid crystal display panel and a fixture substrate for fixing the liquid crystal display panel. The liquid crystal display panel is provided with: a semiconductor substrate; a transparent substrate opposed to the semiconductor substrate and on which a transparent electrode is formed, the transparent substrate having a width in a first direction along a surface thereof wider than the semiconductor substrate; a liquid crystal layer sealed between the semiconductor substrate and the transparent substrate; a plurality of switching elements formed on the semiconductor substrate in a matrix manner in correspondence with a pixel arrangement; and a plurality of pixel electrodes formed in the matrix manner in correspondence with the pixel arrangement each connected to respective one of the switching elements. The fixture substrate is provided with an aperture portion to which an aperture, which area is larger than an outline of the semiconductor substrate and which width in the first direction is narrower than the transparent substrate, is formed. The semiconductor substrate is disposed within the aperture. And that, both of edge portions in the first direction of the transparent substrate are adhered on the fixture substrate at a peripheral of the aperture by an adhesive agent.
摘要翻译：反射型液晶显示装置具有用于固定液晶显示面板的液晶显示面板和固定基板。液晶显示面板设置有：半导体基板; 与半导体衬底相对的透明衬底，其上形成有透明电极，透明衬底沿其表面宽度大于半导体衬底的第一方向具有宽度; 密封在所述半导体衬底和所述透明衬底之间的液晶层; 多个开关元件，以矩阵方式形成在所述半导体衬底上，与像素布置相对应; 以及与矩阵方式形成的多个像素电极，每个像素布置分别连接到相应的一个开关元件。固定基板设置有开口部，该开口部形成有与该半导体基板的轮廓大的面积，并且第一方向的宽度比透明基板窄的区域。半导体衬底设置在孔内。并且，通过粘合剂将透明基板的第一方向上的两个边缘部分在孔的周边粘附在固定基板上。

2. 发明授权

US08896132B2 Electronic device and fabrication method thereof 有权
标题翻译：电子器件及其制造方法
公开(公告)号：US08896132B2
公开(公告)日：2014-11-25
申请号：US13703810
申请日：2010-06-21
申请人： Naoki Noda , Mitsuru Koarai , Toshio Yokouchi , Masahiro Ishimori
发明人： Naoki Noda , Mitsuru Koarai , Toshio Yokouchi , Masahiro Ishimori
IPC分类号： H01L23/52 , H01L21/30 , H01L23/538 , B81C1/00 , H01L21/02
CPC分类号： H01L23/5384 , B81B2207/012 , B81C1/00238 , B81C2203/035 , H01L21/02 , H01L2924/0002 , H01L2924/00
摘要： An electronic device 1 has a first semiconductor substrate 2 on which a bonding projection section 42 is projected via an insulation film 41, a second semiconductor substrate 3 that is bonded by welding the bonding projection section 42 of the first semiconductor substrate 2 via conductive bonding material, a through hole 54 that is formed to penetrate the bonding projection section 42 and the insulation film 41 in a bonding direction, and a conduction wiring section 44 that is formed by the conductive bonding material filled in the through hole 54 at a time of bonding by welding and conducts the first semiconductor substrate 2 with the second semiconductor substrate 3 to have same electric potential.
摘要翻译：电子设备1具有第一半导体基板2，第一半导体基板2经由绝缘膜41突出接合投影部42，第二半导体基板3通过经由导电接合材料焊接第一半导体基板2的接合突起部42而被接合形成为在接合方向上贯通接合突起部42和绝缘膜41的通孔54以及在接合时由填充在通孔54中的导电性接合材料形成的导电配线部44 通过焊接并将第一半导体衬底2与第二半导体衬底3导通以具有相同的电位。

3. 发明授权

US09162879B2 Electronic device 有权
标题翻译：电子设备
公开(公告)号：US09162879B2
公开(公告)日：2015-10-20
申请号：US14418986
申请日：2012-08-01
申请人： Mitsuru Koarai
发明人： Mitsuru Koarai
IPC分类号： H01L29/40 , B81C1/00 , B81B7/00
CPC分类号： B81C1/00269 , B81B7/008 , B81C1/00238 , B81C2201/019 , B81C2203/0109 , B81C2203/035 , H01L25/00 , H01L2924/0002 , H01L2924/00
摘要： An electronic device is obtained in such a way that a MEMS substrate having a MEMS element mounted thereon and a CMOS substrate are bonded together at bonding surfaces and with a bonding material M having fluidity, wherein the MEMS substrate has a bonding projection part provided to project from a substrate main body and having the bonding surface and a gap formation part disposed between the bonding projection part and the MEMS element, and the gap formation part is supported by the bonding projection part via a plurality of support pieces extending from the bonding projection part and forms reception gaps, which are capable of receiving the bonding material M extruded from the bonding surface to the side of the MEMS element, between the wall surface thereof and the bonding projection part.
摘要翻译：获得电子器件，使得其上安装有MEMS元件的MEMS衬底和CMOS衬底在接合表面处接合在一起并且具有流动性的接合材料M，其中MEMS衬底具有设置成投影的接合突出部分并且具有接合面和设置在接合突起部与MEMS元件之间的间隙形成部，并且间隙形成部通过从接合突出部延伸的多个支撑部被接合突起部支撑，并且形成接收间隙，其能够接收在其壁表面和接合突出部分之间从接合表面到MEMS元件的一侧挤出的接合材料M.

4. 发明申请

US20150239734A1 ELECTRONIC DEVICE 有权
标题翻译：电子设备
公开(公告)号：US20150239734A1
公开(公告)日：2015-08-27
申请号：US14418986
申请日：2012-08-01
申请人： Mitsuru Koarai
发明人： Mitsuru Koarai
IPC分类号： B81C1/00 , B81B7/00
CPC分类号： B81C1/00269 , B81B7/008 , B81C1/00238 , B81C2201/019 , B81C2203/0109 , B81C2203/035 , H01L25/00 , H01L2924/0002 , H01L2924/00
摘要： An electronic device is obtained in such a way that a MEMS substrate having a MEMS element mounted thereon and a CMOS substrate are bonded together at bonding surfaces and with a bonding material M having fluidity, wherein the MEMS substrate has a bonding projection part provided to project from a substrate main body and having the bonding surface and a gap formation part disposed between the bonding projection part and the MEMS element, and the gap formation part is supported by the bonding projection part via a plurality of support pieces extending from the bonding projection part and forms reception gaps, which are capable of receiving the bonding material M extruded from the bonding surface to the side of the MEMS element, between the wall surface thereof and the bonding projection part.
摘要翻译：获得电子器件，使得其上安装有MEMS元件的MEMS衬底和CMOS衬底在接合表面处接合在一起并且具有流动性的接合材料M，其中MEMS衬底具有设置成投影的接合突出部分并且具有接合面和设置在接合突起部与MEMS元件之间的间隙形成部，并且间隙形成部通过从接合突出部延伸的多个支撑部被接合突起部支撑，并且形成接收间隙，其能够接收在其壁表面和接合突出部分之间从接合表面到MEMS元件的一侧挤出的接合材料M.

5. 发明申请

US20130207277A1 ELECTRONIC DEVICE AND FABRICATION METHOD THEREOF 有权
标题翻译：电子设备及其制造方法
公开(公告)号：US20130207277A1
公开(公告)日：2013-08-15
申请号：US13703810
申请日：2010-06-21
申请人： Naoki Noda , Mitsuru Koarai , Toshio Yokouchi , Masahiro Ishimori
发明人： Naoki Noda , Mitsuru Koarai , Toshio Yokouchi , Masahiro Ishimori
IPC分类号： H01L23/538 , H01L21/02
CPC分类号： H01L23/5384 , B81B2207/012 , B81C1/00238 , B81C2203/035 , H01L21/02 , H01L2924/0002 , H01L2924/00
摘要： An electronic device 1 has a first semiconductor substrate 2 on which a bonding projection section 42 is projected via an insulation film 41, a second semiconductor substrate 3 that is bonded by welding the bonding projection section 42 of the first semiconductor substrate 2 via conductive bonding material, a through hole 54 that is formed to penetrate the bonding projection section 42 and the insulation film 41 in a bonding direction, and a conduction wiring section 44 that is formed by the conductive bonding material filled in the through hole 54 at a time of bonding by welding and conducts the first semiconductor substrate 2 with the second semiconductor substrate 3 to have same electric potential.
摘要翻译：电子设备1具有第一半导体基板2，第一半导体基板2经由绝缘膜41突出接合投影部42，第二半导体基板3通过经由导电接合材料焊接第一半导体基板2的接合突起部42而被接合形成为在接合方向上贯通接合突起部42和绝缘膜41的通孔54以及在接合时由填充在通孔54中的导电性接合材料形成的导电配线部44 通过焊接并将第一半导体衬底2与第二半导体衬底3导通以具有相同的电位。

6. 发明申请

US20110185829A1 ROTATIONAL VIBRATION GYRO 审中-公开
标题翻译：旋转振动陀螺仪
公开(公告)号：US20110185829A1
公开(公告)日：2011-08-04
申请号：US13057792
申请日：2008-08-06
申请人： Tetsuo Sugita , Mitsuru Koarai , Yuuichi Yamamura
发明人： Tetsuo Sugita , Mitsuru Koarai , Yuuichi Yamamura
IPC分类号： G01C19/08
CPC分类号： G01C19/5712 , Y10T74/1282
摘要： A rotational vibration type gyro 1 is provided by which a detection sensitivity influence of the other axis direction on detection sensitivity in a detection axis direction. The rotational vibration type gyro 1 has: a drive weight 4, drive electrodes 3, a detection weight 5 having a pair of X-axis divisional detection weights 5A, 5A and a pair of Y-axis divisional detection weights 5B, 5B, an anchor 6, a pair of X-axis weight support springs 7A, 7A and a pair of Y-axis weight support springs 7B, 7B, a pair of X-axis weight connection springs 8A, 8A and a pair of Y-axis weight connection springs 8B, 8B, and a pair of X-axis detection electrodes 9A, 9A and a pair of Y-axis detection electrodes 9B, 9B.
摘要翻译：提供旋转振动型陀螺仪1，通过该旋转振动型陀螺仪1，检测轴方向上的检测灵敏度对另一轴方向的检测灵敏度的影响。旋转振动型陀螺仪1具有：驱动锤4，驱动电极3，具有一对X轴分割检测重量5A，5A的一个检测锤5和一对Y轴分割检测重量5B，5B，锚如图6所示，一对X轴重量支撑弹簧7A，7A和一对Y轴重量支撑弹簧7B，7B，一对X轴重量连接弹簧8A，8A和一对Y轴重量连接弹簧 8B，8B，以及一对X轴检测电极9A，9A和一对Y轴检测电极9B，9B。

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