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    • 5. 发明授权
    • Modified chain aliphatic polyamine
    • 改性链脂族多胺
    • US07473806B2
    • 2009-01-06
    • US10739006
    • 2003-12-19
    • Masatoshi EchigoHisayuki KuwaharaTakeshi Koyama
    • Masatoshi EchigoHisayuki KuwaharaTakeshi Koyama
    • C07C211/00
    • C09D163/00C07C211/14C07C211/27C07C211/35C07C211/40C07C2601/14C07C2601/16C08G59/5006
    • A modified chain aliphatic polyamine obtained by addition reaction of a chain aliphatic polyamine having a specific structure and an unsaturated hydrocarbon compound has a low viscosity and it provides, when used as a curing agent for epoxy resin, an epoxy resin composition which can provide an epoxy resin cured product having an excellent property. Further, a modified chain aliphatic polyamine composition obtained by addition reaction of a chain aliphatic polyamine having a specific structure and an unsaturated hydrocarbon compound followed by the removing step of unreacted chain aliphatic polyamine to reduce its amount less than 2% by weight provides, when used as a curing agent for epoxy resin, an epoxy resin composition which can provide an epoxy resin cured product having an excellent property.
    • 通过具有特定结构的链状脂肪族多胺和不饱和烃化合物的加成反应获得的改性链状脂肪族聚胺具有低粘度,并且当用作环氧树脂的固化剂时,可提供可提供环氧树脂的环氧树脂组合物 树脂固化物具有优异的性能。 此外,通过具有特定结构的链状脂肪族多胺和不饱和烃化合物的加成反应得到的改性链脂肪族多胺组合物,然后除去未反应的链状脂肪族多胺的去除步骤以减少其小于2重量%的量,提供了当使用时 作为环氧树脂的固化剂,可以提供具有优异性能的环氧树脂固化物的环氧树脂组合物。
    • 6. 发明授权
    • Epoxy resin curing agent of aliphatic diamine/styrene addition product
    • 脂肪族二胺/苯乙烯加成产物的环氧树脂固化剂
    • US07396902B2
    • 2008-07-08
    • US10773277
    • 2004-02-09
    • Hisayuki KuwaharaMasatoshi EchigoTakeshi Koyama
    • Hisayuki KuwaharaMasatoshi EchigoTakeshi Koyama
    • C08G59/50C08L63/02C09K3/00
    • C08G59/5026C08G59/5033C08G59/681
    • The epoxy resin curing agent of the present invention comprises a polyamino compound obtainable by addition reaction of aliphatic diamine represented by the formula (1) and styrene and a curing accelerator comprising an organic compound having at least one carboxyl group and at least one hydroxyl group within the molecule, which can achieve a low viscosity without containing environmental harmful substances such as phenol and solvents. In addition, the epoxy resin composition using said epoxy resin curing agent shows an excellent curability at low temperature and it provides a cured coating film having excellent appearance H2N—H2C-A-CH2—NH2  (1) wherein A is a phenylene group or a cyclohexylene group.
    • 本发明的环氧树脂固化剂包含通过由式(1)表示的脂族二胺和苯乙烯的加成反应获得的聚氨基化合物和包含至少一个羧基和至少一个羟基的有机化合物的固化促进剂, 该分子可以实现低粘度而不含环境有害物质如苯酚和溶剂。 此外,使用所述环氧树脂固化剂的环氧树脂组合物在低温下显示出优异的固化性,并且提供具有优异外观的固化涂膜<?在线配方描述=“在线配方”末端=“铅” (1)&lt;&lt; 2&lt; 2&gt; 2&lt; 2&gt; 式描述=“In-line Formulas”end =“tail”?>其中A是亚苯基或亚环己基。
    • 10. 发明授权
    • Compound for resist and radiation-sensitive composition specification
    • 化合物抗蚀剂和辐射敏感组合物规格
    • US08802353B2
    • 2014-08-12
    • US13614976
    • 2012-09-13
    • Masatoshi EchigoDai Oguro
    • Masatoshi EchigoDai Oguro
    • G03F7/039G03F7/004
    • G03F7/0045C07C39/15C07C43/164C07C43/18C07C43/196C07C43/2055C07C43/225C07C43/315C07C49/747C07C69/96C07C2601/14C07C2603/74G03F7/0392Y10S430/106
    • A radiation-sensitive composition containing 1 to 80% by weight of a solid component and 20 to 99% by weight of a solvent. The solid component contains a compound B which has (a) a structure derived from a polyphenol compound A by introducing an acid-dissociating group to at least one phenolic hydroxyl group of the polyphenol compound A which is synthesized by a condensation between a di- to tetrafunctional aromatic ketone or aromatic aldehyde each having 5 to 36 carbon atoms with a compound having 1 to 3 phenolic hydroxyl groups and 6 to 15 carbon atoms, and (b) a molecular weight of 400 to 2000. The composition containing the compound B is useful as an acid-amplified, non-polymeric resist material, because it is highly sensitive to radiation such as KrF excimer lasers, extreme ultraviolet rays, electron beams, and X-rays, and provides resist patterns with a high resolution, high heat resistance, and high etching resistance.
    • 含有1至80重量%固体组分和20至99重量%溶剂的辐射敏感组合物。 固体成分含有化合物B,该化合物B具有(a)由多酚化合物A导入的结构,该酸结合基通过将多元酚化合物A中的至少一个酚羟基引入到通过二 - 具有5至36个碳原子的四官能芳族酮或芳族醛与具有1至3个酚羟基和6至15个碳原子的化合物,和(b)分子量为400至2000.含有化合物B的组合物是有用的 作为酸性扩增的非聚合抗蚀剂材料,因为它对诸如KrF准分子激光器,极紫外线,电子束和X射线的辐射高度敏感,并且提供具有高分辨率,高耐热性的抗蚀剂图案, 耐腐蚀性高。