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1. 发明授权

US09093396B2 Silicon interposer systems 有权
标题翻译：硅插入式系统
公开(公告)号：US09093396B2
公开(公告)日：2015-07-28
申请号：US13653412
申请日：2012-10-17
申请人： Masahiro Lee
发明人： Masahiro Lee
IPC分类号： H05K7/00 , H01L23/32 , H05K1/02 , H05K1/14 , H05K3/34 , H01L23/00 , H01L23/14 , H01L23/498
CPC分类号： H01L23/32 , H01L23/147 , H01L23/49816 , H01L23/49827 , H01L24/81 , H01L24/83 , H01L2224/13009 , H01L2224/1329 , H01L2224/133 , H01L2224/16237 , H01L2224/2929 , H01L2224/293 , H01L2224/81903 , H01L2224/83201 , H01L2224/83851 , H01L2224/83862 , H01L2224/9211 , H05K1/0295 , H05K1/141 , H05K3/3436 , H05K2201/049 , H05K2201/09954 , Y10T29/49144 , H01L2924/00014 , H01L2924/0665 , H01L2224/81 , H01L2224/83
摘要： A universal silicon interposer system and method to enabling the selective use of multiple proprietary microelectronic devices without the need to substantially alter the end-use application(s). The system may be used in the implementation of three-dimensional (stacked) microelectronics having proprietary contact pin patterns.
摘要翻译：通用硅插入器系统和方法，能够选择性地使用多个专利微电子器件，而不需要基本上改变终端应用。该系统可用于实现具有专有接头引脚图案的三维（堆叠）微电子器件。

2. 发明申请

US20070295437A1 Film adhesion device and film adhesion method 审中-公开
标题翻译：薄膜粘合装置和薄膜粘合方法
公开(公告)号：US20070295437A1
公开(公告)日：2007-12-27
申请号：US11546576
申请日：2006-10-12
申请人： Masahiro Lee
发明人： Masahiro Lee
IPC分类号： B32B37/00 , B32B41/00
CPC分类号： H01L21/67132 , B32B37/0046 , B32B2457/14 , H01L21/6836 , H01L2221/68327 , Y10T156/10 , Y10T156/1052 , Y10T156/1082
摘要： A film adhesion device includes a table carrying a semiconductor wafer, a pressing member (pressing roller) which presses a film (photoresist film) onto a surface side of the semiconductor wafer placed on the table, a bumper member provided on an outer peripheral side of the table and including a contact surface which is contacted by the pressing member when the pressing member presses the film, and an elevating support mechanism which supports the bumper member elevatably and positions the bumper member at a predetermined height level.
摘要翻译：薄膜粘合装置包括载有半导体晶片的工作台，将薄膜（光致抗蚀剂膜）压在放置在工作台上的半导体晶片的表面侧上的按压部件（加压辊），设置在工作台的外周侧的保险杠部件并且包括当按压部件按压胶片时由按压部件接触的接触面，以及将保险杠部件升降地支撑并将保险杠部件定位在预定高度水平的升降支撑机构。

3. 发明授权

US06773536B2 Method and apparatus for bonding protection film onto silicon wafer 有权
标题翻译：将保护膜粘合到硅晶片上的方法和装置
公开(公告)号：US06773536B2
公开(公告)日：2004-08-10
申请号：US10238882
申请日：2002-09-11
申请人： Masahiro Lee
发明人： Masahiro Lee
IPC分类号： B32B3118
CPC分类号： H01L21/67132 , B29C63/0056 , B29C63/02 , H01L21/6835 , H01L23/562 , H01L2221/68318 , H01L2924/0002 , Y10T156/1052 , Y10T156/108 , Y10T156/12 , Y10T156/16 , H01L2924/00
摘要： Provided is a protection film bonding method and a protection film bonding apparatus that improves productivity for bonding the protection film onto one surface of a silicon wafer. A carrier film is separated from a three-layer film having a reinforcement film, and is provided on front and rear surfaces of a protection film, to provide a two-layer film. This two-layer film is bonded onto the front surface of the silicon wafer, the reinforcement film is removed from the two-layer film and the protection film is trimmed. An apparatus consists of a supply unit, separation and take-up unit that separates the carrier film from the three-layer film, an assigning and separation unit, a joint unit that joins the two-layer film onto the silicon wafer, and a peel-off unit, that removes the reinforcement film while separating it from the two-layer film.
摘要翻译：提供了一种保护膜接合方法和保护膜接合装置，其提高了将保护膜接合到硅晶片的一个表面上的生产率。将载体膜与具有加强膜的三层膜分离，并且设置在保护膜的前表面和后表面上，以提供双层膜。将该双层膜粘合到硅晶片的正面上，从双层膜除去加强膜，并修整保护膜。一种装置包括供给单元，将载体膜与三层膜分离的分离和卷取单元，分配和分离单元，将两层膜连接到硅晶片上的接合单元和剥离层该单元在将其从两层膜分离时除去加强膜。

4. 发明授权

US06727461B2 Silicon wafer protection film trimming method and trimmer 有权
标题翻译：硅晶片保护膜修边方法和修剪器
公开(公告)号：US06727461B2
公开(公告)日：2004-04-27
申请号：US10238891
申请日：2002-09-11
申请人： Masahiro Lee
发明人： Masahiro Lee
IPC分类号： B23K2600
CPC分类号： B23K26/351 , B23K26/146 , B23K26/1462 , H01L21/67132
摘要： A trimming method and a trimmer capable of ensuring trimming a protection film which protects a silicon wafer and making a cut end of the protection film obtained by trimming neat, are provided. If a laser beam L is applied to the strip protection film 3 bonded onto the silicon wafer 1 to trim the protection film to have a predetermined size and a predetermined shape, an intake flow V such as an air curtain flow is applied to the protection film 3. A trimmer used to execute this method consists of a table 2 on which the silicon wafer 1 is mounted, an assigning and separation unit D for bonding the strip protection film 3 onto the silicon wafer 1, a laser beam unit G provided above the table for forming a cut 28 into the protection film 3 along a peripheral surface 1a of the silicon wafer 1, and an intake unit Av provided below the table for applying an intake flow V to a lower surface of the protection film 3 along the peripheral surface 1a.
摘要翻译：提供了一种修整方法和修剪器，其能够确保修整保护硅片的保护膜并且通过修整整齐地获得保护膜的切割端。如果将激光束L施加到接合到硅晶片1上的带状保护膜3以将保护膜修剪成具有预定尺寸和预定形状，则将诸如气帘流的进气流V施加到保护膜用于执行该方法的修剪器包括安装硅晶片1的工作台2，用于将条形保护膜3接合到硅晶片1上的分配单元D，设置在硅晶片1上方的激光束单元G 沿着硅晶片1的周面1a形成保护膜3的切口28的工作台，以及设置在工作台下方的进气单元Av，用于沿保护膜3的周面施加进气流V到下表面 1a。

5. 发明授权

US5808274A Method of cutting masking sheet to be used to process silicon wafer 失效
标题翻译：切割用于处理硅晶片的掩模片的方法
公开(公告)号：US5808274A
公开(公告)日：1998-09-15
申请号：US684006
申请日：1996-07-19
申请人： Masahiro Lee
发明人： Masahiro Lee
IPC分类号： G01B11/00 , B23K26/00 , B23K26/04 , B23K26/08 , B23K26/40 , H01L21/00 , H01L21/301 , H01L21/304 , B23K26/02
CPC分类号： H01L21/67132 , B23K26/04
摘要： A method of cutting away the unnecessary portions of a masking sheet bonded to a silicon wafer during the IC manufacturing process. The method uses a laser cutting device which includes an optical fiber containing silver halide and a CCD camera to control the position of the laser focal point.
摘要翻译：一种在IC制造过程中切除与硅晶片接合的掩模片的不必要部分的方法。该方法使用包括含有卤化银的光纤和CCD照相机的激光切割装置来控制激光焦点的位置。

6. 发明授权

US5590445A Tape extension device for semiconductor producing apparatus and semiconductor producing apparatus with tape extension device 失效
标题翻译：用于半导体制造装置的磁带扩展装置和具有磁带扩展装置的半导体制造装置
公开(公告)号：US5590445A
公开(公告)日：1997-01-07
申请号：US249770
申请日：1994-05-26
申请人： Masahiro Lee
发明人： Masahiro Lee
IPC分类号： B65H23/022 , B65H23/04 , H01L21/00 , D06C3/00
CPC分类号： H01L21/67132 , B65H23/022 , B65H23/048
摘要： In a tape extension device for a semiconductor producing apparatus having a vertical tension device for tensing a tape, which is withdrawn from a tape roller, in a down-web direction above a semiconductor wafer, the tape extension device in the present invention comprises a lateral tension device. The lateral tension device includes clamp means for clamping an edge of a side of the tape in a cross-web direction which tape is extended in the down-web direction by means of the vertical tension device, another clamp means for clamping another edge of the tape, and drive means for opening and closing both of the clamp means in the cross-web direction.
摘要翻译：在用于半导体制造装置的带延长装置中，本发明的带延伸装置具有一个垂直张紧装置，该垂直张力装置用于张紧从带辊上取下的带子，张力装置。横向张力装置包括夹紧装置，用于通过垂直张力装置沿横向方向夹紧带的侧面边缘，该带通过垂直张力装置沿下腹板方向延伸，另一个夹紧装置用于夹紧带子和驱动装置，用于在跨幅方向上打开和关闭两个夹紧装置。

7. 发明授权

US08905680B2 Ultrathin wafer transport systems 有权
标题翻译：超薄晶圆输送系统
公开(公告)号：US08905680B2
公开(公告)日：2014-12-09
申请号：US13653408
申请日：2012-10-17
申请人： Masahiro Lee
发明人： Masahiro Lee
IPC分类号： B65G47/24 , H01L21/683 , B65G51/03
CPC分类号： H01L21/6838 , B65G51/035
摘要： An improved silicon wafer transport system. More particularly, this invention relates to providing new wafer-transport apparatus having geometries configured to minimize damage to the wafer while assisting in maintaining multi-orientation positioning of the wafer during transport by the tool.
摘要翻译：改进的硅片输送系统。更具体地说，本发明涉及提供具有几何形状的新的晶片输送设备，其被配置为最小化对晶片的损伤，同时在通过工具运输期间帮助保持晶片的多方位定位。

8. 发明申请

US20130105090A1 Ultrathin Wafer Debonding Systems 有权
标题翻译：超薄晶圆剥离系统
公开(公告)号：US20130105090A1
公开(公告)日：2013-05-02
申请号：US13653410
申请日：2012-10-17
申请人： Masahiro Lee
发明人： Masahiro Lee
IPC分类号： B32B38/10
CPC分类号： B32B38/10 , B32B41/00 , B32B43/006 , B32B2310/028 , B32B2457/14 , C09J2205/302 , H01L21/67092 , Y10T156/11 , Y10T156/1121 , Y10T156/1153 , Y10T156/1168 , Y10T156/1189 , Y10T156/19 , Y10T156/1911 , Y10T156/1922
摘要： Improved semiconductor wafer debonding system, method, and apparatus, including a stress-free means for multi-axis debonding utilizing a specialized tool or fixture having at least one ultrasonic transducer.
摘要翻译：改进的半导体晶片剥离系统，方法和装置，包括利用具有至少一个超声换能器的专用工具或夹具的多轴脱粘的无应力装置。

9. 发明授权

US4779497A Device and method of cutting off a portion of masking film adhered to a silicon wafer 失效
标题翻译：切除粘附到硅晶片的掩模膜的一部分的装置和方法
公开(公告)号：US4779497A
公开(公告)日：1988-10-25
申请号：US006193
申请日：1987-01-23
申请人： Masahiro Lee
发明人： Masahiro Lee
IPC分类号： B23D57/00 , B26F3/12 , B23B1/00 , B23B5/00
CPC分类号： B23D57/0046 , B26F3/12 , Y10T156/108 , Y10T82/16081 , Y10T83/0414 , Y10T83/0467 , Y10T83/2092 , Y10T83/293 , Y10T83/6667 , Y10T83/6668 , Y10T83/9292
摘要： A method of cutting off a masking film of a silicon wafer comprising the steps of rotating the silicon wafer, feeding a heat wire continuously to the outer periphery of the silicon wafer and cutting off the outer periphery of the masking film along the outer perphery of the silicon wafer.
摘要翻译：一种切断硅晶片掩模膜的方法，包括以下步骤：旋转硅晶片，将热丝连续地供给到硅晶片的外周，并沿着外晶的外表面切除掩模膜的外周硅晶片。

10. 发明授权

US08858756B2 Ultrathin wafer debonding systems 有权
标题翻译：超薄晶圆剥离系统
公开(公告)号：US08858756B2
公开(公告)日：2014-10-14
申请号：US13653410
申请日：2012-10-17
申请人： Masahiro Lee
发明人： Masahiro Lee
IPC分类号： B32B38/10 , B32B41/00 , H01L21/67 , B32B43/00
CPC分类号： B32B38/10 , B32B41/00 , B32B43/006 , B32B2310/028 , B32B2457/14 , C09J2205/302 , H01L21/67092 , Y10T156/11 , Y10T156/1121 , Y10T156/1153 , Y10T156/1168 , Y10T156/1189 , Y10T156/19 , Y10T156/1911 , Y10T156/1922
摘要： Improved semiconductor wafer debonding system, method, and apparatus, including a stress-free means for multi-axis debonding utilizing a specialized tool or fixture having at least one ultrasonic transducer.
摘要翻译：改进的半导体晶片剥离系统，方法和装置，包括利用具有至少一个超声换能器的专用工具或夹具的多轴脱粘的无应力装置。

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