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    • 1. 发明授权
      US08785813B2 Laser-based material processing methods and systems 失效
    • Laser-based material processing methods and systems
    • 基于激光的材料加工方法和系统
    • US08785813B2
    • 2014-07-22
    • US13421372
    • 2012-03-15
    • Lawrence Shah , Gyu Cheon Cho , Jingzhou Xu
    • Lawrence Shah , Gyu Cheon Cho , Jingzhou Xu
    • B23K26/00 , B23K26/06 , B23K26/40 , B23K26/36
    • H01L21/268 , B23K26/0624 , B23K26/064 , B23K26/0643 , B23K26/0648 , B23K26/082 , B23K26/083 , B23K26/364 , B23K26/38 , B23K26/40 , B23K2101/40 , B23K2103/50
    • Various embodiments may be used for laser-based modification of target material of a workpiece while advantageously achieving improvements in processing throughput and/or quality. Embodiments of a method of processing may include focusing and directing laser pulses to a region of the workpiece at a pulse repetition rate sufficiently high so that material is efficiently removed from the region and a quantity of unwanted material within the region, proximate to the region, or both is reduced relative to a quantity obtainable at a lower repetition rate. Embodiments of an ultrashort pulse laser system may include a fiber amplifier or fiber laser. Various embodiments are suitable for at least one of dicing, cutting, scribing, and forming features on or within a semiconductor substrate. Workpiece materials may include metals, inorganic or organic dielectrics, or any material to be micromachined with femtosecond, picosecond, and/or nanosecond pulses.
    • 各种实施例可以用于对工件的目标材料进行基于激光的修改，同时有利地实现处理生产量和/或质量的改善。 处理方法的实施例可以包括将激光脉冲聚焦并以足够高的脉冲重复频率将激光脉冲引导到工件的区域，使得材料有效地从该区域移除并且在该区域内靠近该区域的一些不想要的材料， 或者两者相对于以较低的重复率可获得的量减少。 超短脉冲激光系统的实施例可以包括光纤放大器或光纤激光器。 各种实施例适合于在半导体衬底上或半导体衬底内的切割，切割，划线和形成特征中的至少一个。 工件材料可以包括金属，无机或有机电介质，或任何要用飞秒，皮秒和/或纳秒脉冲微加工的材料。
    • 基本信息 添加关注 加入工作空间 PDF全文 PDF下载 全文下载 相似专利 双屏查看 权利要求书 说明书全文 Espacenet 法律信息 同族专利 专利引用
    • 3. 发明申请
      US20110240617A1 LASER-BASED MATERIAL PROCESSING APPARATUS AND METHODS 有权
    • LASER-BASED MATERIAL PROCESSING APPARATUS AND METHODS
    • 基于激光的材料加工设备和方法
    • US20110240617A1
    • 2011-10-06
    • US13037614
    • 2011-03-01
    • Jingzhou Xu , Jin Young Sohn , Gyu Cheon Cho , Lawrence Shah
    • Jingzhou Xu , Jin Young Sohn , Gyu Cheon Cho , Lawrence Shah
    • B23K26/36
    • B23K26/00 , Y02P40/57
    • Various embodiments may be used for laser-based modification of target material of a workpiece while advantageously achieving improvements in processing throughput and/or quality. Embodiments of a method of processing may include focusing and directing laser pulses to a region of the workpiece at a pulse width sufficiently short so that material is efficiently removed by nonlinear optical absorption from the region and a quantity of heat affected zone and thermal stress on the material within the region, proximate to the region, or both is reduced relative to a quantity obtainable using a laser with longer pulses. In at least one embodiment, an ultrashort pulse laser system may include at least one of a fiber amplifier or fiber laser. Various embodiments are suitable for at least one of dicing, cutting, scribing, and forming features on or within a composite material.
    • 各种实施例可以用于对工件的目标材料进行基于激光的修改，同时有利地实现处理生产量和/或质量的改善。 处理方法的实施例可以包括将激光脉冲聚焦并且以足够短的脉冲宽度将激光脉冲引导到工件的区域，使得材料通过来自该区域的非线性光学吸收和一定数量的热影响区域以及热应力 区域内的材料，邻近区域或两者都相对于使用具有较长脉冲的激光可获得的量减少。 在至少一个实施例中，超短脉冲激光系统可以包括光纤放大器或光纤激光器中的至少一个。 各种实施例适合于在复合材料上或复合材料内的切割，切割，划线和成形特征中的至少一个。
    • 基本信息 添加关注 加入工作空间 PDF全文 PDF下载 全文下载 相似专利 双屏查看 权利要求书 说明书全文 Global Dossier Espacenet 法律信息 同族专利 专利引用
    • 6. 发明授权
      US09321126B2 Laser-based material processing apparatus and methods 有权
    • Laser-based material processing apparatus and methods
    • 激光材料加工设备及方法
    • US09321126B2
    • 2016-04-26
    • US13037614
    • 2011-03-01
    • Jingzhou Xu , Jin Young Sohn , Gyu Cheon Cho , Lawrence Shah
    • Jingzhou Xu , Jin Young Sohn , Gyu Cheon Cho , Lawrence Shah
    • B23K26/00
    • B23K26/00 , Y02P40/57
    • Various embodiments may be used for laser-based modification of target material of a workpiece while advantageously achieving improvements in processing throughput and/or quality. Embodiments of a method of processing may include focusing and directing laser pulses to a region of the workpiece at a pulse width sufficiently short so that material is efficiently removed by nonlinear optical absorption from the region and a quantity of heat affected zone and thermal stress on the material within the region, proximate to the region, or both is reduced relative to a quantity obtainable using a laser with longer pulses. In at least one embodiment, an ultrashort pulse laser system may include at least one of a fiber amplifier or fiber laser. Various embodiments are suitable for at least one of dicing, cutting, scribing, and forming features on or within a composite material.
    • 各种实施例可以用于对工件的目标材料进行基于激光的修改，同时有利地实现处理生产量和/或质量的改善。 一种处理方法的实施例可以包括将激光脉冲聚焦并且以足够短的脉冲宽度将激光脉冲引导到工件的区域，使得通过来自该区域的非线性光学吸收和一定数量的热影响区域和 区域内的材料，邻近区域或两者都相对于使用具有较长脉冲的激光可获得的量减少。 在至少一个实施例中，超短脉冲激光系统可以包括光纤放大器或光纤激光器中的至少一个。 各种实施例适合于在复合材料上或复合材料内的切割，切割，划线和成形特征中的至少一个。
    • 基本信息 添加关注 加入工作空间 PDF全文 PDF下载 全文下载 相似专利 双屏查看 权利要求书 说明书全文 Espacenet 法律信息 同族专利 专利引用
    • 9. 发明申请
      US20100197116A1 LASER-BASED MATERIAL PROCESSING METHODS AND SYSTEMS 有权
    • LASER-BASED MATERIAL PROCESSING METHODS AND SYSTEMS
    • 基于激光的材料加工方法与系统
    • US20100197116A1
    • 2010-08-05
    • US12641256
    • 2009-12-17
    • Lawrence Shah , Gyu Cheon Cho , Jingzhou Xu
    • Lawrence Shah , Gyu Cheon Cho , Jingzhou Xu
    • H01L21/461 , B23K26/38
    • H01L21/268 , B23K26/0624 , B23K26/064 , B23K26/0643 , B23K26/0648 , B23K26/082 , B23K26/083 , B23K26/364 , B23K26/38 , B23K26/40 , B23K2101/40 , B23K2103/50
    • Various embodiments may be used for laser-based modification of target material of a workpiece while advantageously achieving improvements in processing throughput and/or quality. Embodiments of a method of processing may include focusing and directing laser pulses to a region of the workpiece at a pulse repetition rate sufficiently high so that material is efficiently removed from the region and a quantity of unwanted material within the region, proximate to the region, or both is reduced relative to a quantity obtainable at a lower repetition rate. In at least one embodiment, an ultrashort pulse laser system may include at least one of a fiber amplifier or fiber laser. Various embodiments are suitable for at least one of dicing, cutting, scribing, and forming features on or within a semiconductor substrate. Workpiece materials may also include metals, inorganic or organic dielectrics, or any material to be micromachined with femtosecond and/or picosecond pulses, and in some embodiments with pulse widths up to a few nanoseconds.
    • 各种实施例可以用于对工件的目标材料进行基于激光的修改，同时有利地实现处理生产量和/或质量的改善。 处理方法的实施例可以包括将激光脉冲聚焦并以足够高的脉冲重复频率将激光脉冲引导到工件的区域，使得材料有效地从该区域移除并且在该区域内靠近该区域的一些不想要的材料， 或者两者相对于以较低的重复率可获得的量减少。 在至少一个实施例中，超短脉冲激光系统可以包括光纤放大器或光纤激光器中的至少一个。 各种实施例适合于在半导体衬底上或半导体衬底内的切割，切割，划线和形成特征中的至少一个。 工件材料还可以包括金属，无机或有机电介质，或用飞秒和/或皮秒脉冲微加工的任何材料，在一些实施例中，脉冲宽度可达几纳秒。
    • 基本信息 添加关注 加入工作空间 PDF全文 PDF下载 全文下载 相似专利 双屏查看 权利要求书 说明书全文 Global Dossier Espacenet 法律信息 同族专利 专利引用
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