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1. 发明授权

US07576142B2 Polyorganosiloxane and curable composition containing same 有权
标题翻译：聚有机硅氧烷和含有它们的可固化组合物
公开(公告)号：US07576142B2
公开(公告)日：2009-08-18
申请号：US11572502
申请日：2005-08-02
申请人： Kunikazu Tauchi , Hiroshi Suzuki
发明人： Kunikazu Tauchi , Hiroshi Suzuki
IPC分类号： C08G65/18
CPC分类号： C08G77/46 , C08G65/18 , C08G65/336 , C08G77/50 , C08L83/14
摘要： The object of the present invention is to provide a polyorganosiloxane that has a specific structure and is superior to curability and a curable composition which is high in workability during curing, which leads to a cured product excellent in ultraviolet-ray transparency and heat resistance, and further wherein toughness thereof and occurrence of a crack by cyclic heat-cool are improved. The present polyorganosiloxane is one obtained by conducting hydrolysis and condensation of a silicon-containing organic compound represented by the general formula (1) below in the presence of an organic polyol compound having two or more hydroxyl groups and has an oxetanyl group.
摘要翻译：本发明的目的是提供具有特定结构并且优于固化性的聚有机硅氧烷，以及在固化期间加工性高的固化性组合物，其导致紫外线透射性和耐热性优异的固化物，以及此外，通过循环热冷却的韧性和裂纹的发生得到改善。本发明的聚有机硅氧烷是通过在具有两个以上羟基的有机多元醇化合物的存在下，通过下述通式（1）表示的含硅有机化合物的水解和缩合得到的，并具有氧杂环丁烷基。

2. 发明授权

US08329815B2 Silicone-containing polymer and a heat-resistant resin composition comprising the silicon-containing polymer 有权
标题翻译：含有硅酮的聚合物和包含含硅聚合物的耐热树脂组合物
公开(公告)号：US08329815B2
公开(公告)日：2012-12-11
申请号：US12572591
申请日：2009-10-02
申请人： Kunikazu Tauchi , Hiroshi Suzuki
发明人： Kunikazu Tauchi , Hiroshi Suzuki
IPC分类号： C08L83/05 , C08L83/06
CPC分类号： G03F7/0757 , C08G77/14 , C08G77/16 , C08G77/18 , C08G77/20 , C09D183/06 , H01L21/02126 , H01L21/3122 , Y10T428/31663
摘要： A silicon-containing polymer which is represented by general formula (5) below and has a weight-average molecular weight in the range from 500 to 500,000: (In the formula, A2 is an organic group of 2-10 carbons, having a carbon-carbon unsaturated group; R3 is an alkylene group of 1-20 carbons, a bivalent aromatic group of 6-20 carbons, or a bivalent alicyclic group of 3-20 carbons; n is 0 or 1; R4 is a hydrogen atom or an alkyl group of 1-10 carbons (R4 in one molecule may be the same type or a combination of two or more different types.); each of x and y is a positive number; each of w and z is 0 or a positive number; 0≦z/(w+x+y)≦2; and 0.01≦y/(w+x)≦5), and the heat-resistant resin composition comprising the silicon-containing polymer.
摘要翻译：一种由以下通式（5）表示的重均分子量在500至500,000之间的含硅聚合物：（式中，A2为2-10个碳的有机基团，具有碳碳不饱和基团; R3是1-20个碳的亚烷基，6-20个碳原子的二价芳族基团或3-20个碳原子的二价脂环族基团; n是0或1; R4是氢原子或 1-10个碳原子的烷基（一个分子中的R 4可以是相同类型或两种或更多种不同类型的组合）; x和y各自为正数; w和z各自为0或正数 ; 0＆nlE; z /（w + x + y）＆nlE; 2;和0.01＆nlE; y /（w + x）＆nlE; 5）和包含含硅聚合物的耐热树脂组合物。

3. 发明申请

US20070134424A1 Silicon-containing polymer, process for producing the same, heat-resistant resin composition, and heat-resistant film 有权
标题翻译：含硅聚合物，其制造方法，耐热树脂组合物和耐热膜
公开(公告)号：US20070134424A1
公开(公告)日：2007-06-14
申请号：US10565682
申请日：2004-07-29
申请人： Kunikazu Tauchi , Hiroshi Suzuki
发明人： Kunikazu Tauchi , Hiroshi Suzuki
IPC分类号： B05D3/02 , B32B9/04 , C08G77/20
CPC分类号： G03F7/0757 , C08G77/14 , C08G77/16 , C08G77/18 , C08G77/20 , C09D183/06 , H01L21/02126 , H01L21/3122 , Y10T428/31663
摘要： The alkali-soluble silicon-containing polymer of the present invention is represented by the general formula (1) below and has a weight-average molecular weight in the range from 500 to 500,000: (In the formula, A1 is a phenyl group having either a hydroxyl group or an alkoxy group; R1 is an alkylene group of 1-4 carbons; m is 0 or 1; R2 is an alkyl group of 1-4 carbons; each of s and u is a positive number; t is 0 or a positive number; 0≦t/(s+u)≦1; and 0
摘要翻译：本发明的碱溶性含硅聚合物由下述通式（1）表示，重均分子量在500〜500,000的范围内：（式中，A 1〜 SUP>是具有羟基或烷氧基的苯基; R 1是1-4个碳的亚烷基; m是0或1; R 2，是1-4个碳的烷基; s和u各自为正数; t为0或正数; 0 <= t /（s + u）<= 1; 0

4. 发明申请

US20080033137A1 Polyorganosiloxane And Curable Composition Containing Same 有权
标题翻译：聚有机硅氧烷和含有其的可固化组合物
公开(公告)号：US20080033137A1
公开(公告)日：2008-02-07
申请号：US11572502
申请日：2005-08-02
申请人： Kunikazu Tauchi , Hiroshi Suzuki
发明人： Kunikazu Tauchi , Hiroshi Suzuki
IPC分类号： C08G77/18 , C08G77/06 , C08G77/16
CPC分类号： C08G77/46 , C08G65/18 , C08G65/336 , C08G77/50 , C08L83/14
摘要： The object of the present invention is to provide a polyorganosiloxane that has a specific structure and is superior to curability and a curable composition which is high in workability during curing, which leads to a cured product excellent in ultraviolet-ray transparency and heat resistance, and further wherein toughness thereof and occurrence of a crack by cyclic heat-cool are improved. The present polyorganosiloxane is one obtained by conducting hydrolysis and condensation of a silicon-containing organic compound represented by the general formula (1) below in the presence of an organic polyol compound having two or more hydroxyl groups and has an oxetanyl group.
摘要翻译：本发明的目的是提供具有特定结构并且优于固化性的聚有机硅氧烷，以及在固化期间加工性高的固化性组合物，这导致紫外线透过性和耐热性优异的固化产物，以及此外，通过循环热冷却的韧性和裂纹的发生得到改善。本发明的聚有机硅氧烷是通过在具有两个以上羟基的有机多元醇化合物的存在下，通过下述通式（1）表示的含硅有机化合物的水解和缩合得到的，并具有氧杂环丁烷基。

5. 发明授权

US07811637B2 Silicon-containing polymer, process for producing the same, heat-resistant resin composition, and heat-resistant film 有权
标题翻译：含硅聚合物，其制造方法，耐热树脂组合物和耐热膜
公开(公告)号：US07811637B2
公开(公告)日：2010-10-12
申请号：US10565682
申请日：2004-07-29
申请人： Kunikazu Tauchi , Hiroshi Suzuki
发明人： Kunikazu Tauchi , Hiroshi Suzuki
IPC分类号： B05D3/02
CPC分类号： G03F7/0757 , C08G77/14 , C08G77/16 , C08G77/18 , C08G77/20 , C09D183/06 , H01L21/02126 , H01L21/3122 , Y10T428/31663
摘要： The alkali-soluble silicon-containing polymer of the present invention is represented by the general formula (1) below and has a weight-average molecular weight in the range from 500 to 500,000: (In the formula, A1 is a phenyl group having either a hydroxyl group or an alkoxy group; R1 is an alkylene group of 1-4 carbons; m is 0 or 1; R2 is an alkyl group of 1-4 carbons; each of s and u is a positive number; t is 0 or a positive number; 0≦t/(s+u)≦1; and 0
摘要翻译：本发明的碱溶性含硅聚合物由下述通式（1）表示，重均分子量在500〜500,000的范围内（式中，A1为具有羟基或烷氧基; R 1是1-4个碳的亚烷基; m是0或1; R 2是1-4个碳的烷基; s和u各自是正数; t是0或正数; 0＆nlE; t /（s + u）＆nlE; 1;和0

6. 发明申请

US20100029841A1 SILICONE-CONTAINING POLYMER AND A HEAT-RESISTANT RESIN COMPOSITION COMPRISING THE SILICON-CONTAINING POLYMER 有权
标题翻译：含有硅酮的聚合物和包含含硅聚合物的耐热树脂组合物
公开(公告)号：US20100029841A1
公开(公告)日：2010-02-04
申请号：US12572591
申请日：2009-10-02
申请人： Kunikazu TAUCHI , Hiroshi Suzuki
发明人： Kunikazu TAUCHI , Hiroshi Suzuki
IPC分类号： C08L83/05 , C08L83/06 , C08L83/07
CPC分类号： G03F7/0757 , C08G77/14 , C08G77/16 , C08G77/18 , C08G77/20 , C09D183/06 , H01L21/02126 , H01L21/3122 , Y10T428/31663
摘要： A silicon-containing polymer which is represented by general formula (5) below and has a weight-average molecular weight in the range from 500 to 500,000: (In the formula, A2 is an organic group of 2-10 carbons, having a carbon-carbon unsaturated group; R3 is an alkylene group of 1-20 carbons, a bivalent aromatic group of 6-20 carbons, or a bivalent alicyclic group of 3-20 carbons; n is 0 or 1; R4 is a hydrogen atom or an alkyl group of 1-10 carbons (R4 in one molecule may be the same type or a combination of two or more different types.); each of x and y is a positive number; each of w and z is 0 or a positive number; 0≦z/(w+x+y)≦2; and 0.01≦y/(w+x)≦5), and the heat-resistant resin composition comprising the silicon-containing polymer.
摘要翻译：一种由以下通式（5）表示的重均分子量在500至500,000之间的含硅聚合物：（式中，A2为2-10个碳的有机基团，具有碳碳不饱和基团; R3是1-20个碳的亚烷基，6-20个碳原子的二价芳族基团或3-20个碳原子的二价脂环族基团; n是0或1; R4是氢原子或 1-10个碳原子的烷基（一个分子中的R 4可以是相同类型或两种或更多种不同类型的组合）; x和y各自为正数; w和z各自为0或正数 ; 0 <= z /（w + x + y）<= 2;和0.01 <= y /（w + x）≤5），耐热树脂组合物包含含硅聚合物。

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