专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20080191338A1 Semiconductor memory device, memory device support and memory module 有权
标题翻译：半导体存储器件，存储器件支持和存储器模块
公开(公告)号：US20080191338A1
公开(公告)日：2008-08-14
申请号：US11905675
申请日：2007-10-03
申请人： Sungjoo Park , Ki Hyun KO , Young YUN , Sookyung KIM
发明人： Sungjoo Park , Ki Hyun KO , Young YUN , Sookyung KIM
IPC分类号： H01L23/02 , H01L25/00
CPC分类号： H01L25/0657 , G11C5/04 , H01L2225/06513 , H01L2225/06541 , H01L2924/0002 , H01L2924/00
摘要： In one embodiment, the semiconductor memory device includes at least a first semiconductor memory die, and a surface of the semiconductor memory device includes a plurality of connectors. At least one of the plurality of connectors is electrically connected to the first semiconductor memory die. The plurality of connectors include at least first and second control signal connectors. The first control signal connector is for a first control signal of a first type, the second control signal connector is for a second control signal of the first type, and the first and second control signal connectors are disposed in different areas of the surface. For example, the first type may be a chip select signal, a clock enable signal, or an on die termination enable signal.
摘要翻译：在一个实施例中，半导体存储器件至少包括第一半导体存储器管芯，并且半导体存储器件的表面包括多个连接器。多个连接器中的至少一个电连接到第一半导体存储器管芯。多个连接器包括至少第一和第二控制信号连接器。第一控制信号连接器用于第一类型的第一控制信号，第二控制信号连接器用于第一类型的第二控制信号，并且第一和第二控制信号连接器设置在表面的不同区域中。例如，第一类型可以是芯片选择信号，时钟使能信号或芯片上终止使能信号。

2. 发明申请

US20060125071A1 Memory module and method of mounting memory device on PCB for memory module 有权
标题翻译：存储器模块和将存储器件安装在PCB上用于存储器模块的方法
公开(公告)号：US20060125071A1
公开(公告)日：2006-06-15
申请号：US11301142
申请日：2005-12-12
申请人： Do-Hyung Kim , Chang-Woo Koo , Jung-Joon Lee , Ki-Hyun Ko
发明人： Do-Hyung Kim , Chang-Woo Koo , Jung-Joon Lee , Ki-Hyun Ko
IPC分类号： H01L23/02
CPC分类号： G11C5/04 , H05K1/181 , H05K2201/09418 , H05K2201/10159 , H05K2203/1572 , Y02P70/611
摘要： A memory module and a method of mounting memory devices on a PCB to form the memory module substantially reduce unnecessary routing space and improve signal attenuation characteristics. In the method of mounting and sequentially connecting at least two memory devices on a printed circuit board(PCB) having an axis of elongation to form a memory module, at least one of the memory devices is mounted on at least one face of the PCB so that a base line along an longitudinal axis of the at least one memory device lies at an acute angle with respect to the axis of elongation of the PCB.
摘要翻译：存储器模块和将存储器件安装在PCB上以形成存储器模块的方法基本上减少不必要的路由空间并改善信号衰减特性。在将具有延伸轴的印刷电路板（PCB）上的至少两个存储器件安装并顺序地连接以形成存储器模块的方法中，至少一个存储器件安装在PCB的至少一个面上，沿着至少一个存储器装置的纵向轴线的基线相对于PCB的伸长轴线成锐角。

3. 发明授权

US08399301B2 Mounting structures for integrated circuit modules 有权
标题翻译：集成电路模块的安装结构
公开(公告)号：US08399301B2
公开(公告)日：2013-03-19
申请号：US13064081
申请日：2011-03-04
申请人： Sung-Joo Park , Ki-Hyun Ko , Young Yun , Soo-Kyung Kim
发明人： Sung-Joo Park , Ki-Hyun Ko , Young Yun , Soo-Kyung Kim
IPC分类号： H01L21/02
CPC分类号： H05K1/0246 , H01L2924/0002 , H05K1/181 , H05K2201/10022 , H05K2201/10159 , H05K2201/10522 , H01L2924/00
摘要： A structure of an integrated circuit module includes a wiring board, a plurality of integrated circuits and at least one terminating resistance circuit. The wiring board has a mounting region on at least one surface thereof. The plurality of integrated circuits are mounted in the mounting region of the wiring board and spaced from one another in a first direction. The at least one terminating resistance circuit is arranged between at least two adjacent integrated circuits, and coupled to an output of a last of the plurality of integrated circuits.
摘要翻译：集成电路模块的结构包括布线板，多个集成电路和至少一个终端电阻电路。布线板在其至少一个表面上具有安装区域。多个集成电路安装在布线板的安装区域中并沿第一方向彼此间隔开。至少一个终端电阻电路被布置在至少两个相邻的集成电路之间，并且耦合到多个集成电路的最后一个的输出端。

4. 发明授权

US07738277B2 Semiconductor memory device, memory device support and memory module 有权
标题翻译：半导体存储器件，存储器件支持和存储器模块
公开(公告)号：US07738277B2
公开(公告)日：2010-06-15
申请号：US11905675
申请日：2007-10-03
申请人： Sungjoo Park , Ki-Hyun Ko , Young Yun , Sookyung Kim
发明人： Sungjoo Park , Ki-Hyun Ko , Young Yun , Sookyung Kim
IPC分类号： G11C5/06
CPC分类号： H01L25/0657 , G11C5/04 , H01L2225/06513 , H01L2225/06541 , H01L2924/0002 , H01L2924/00
摘要： In one embodiment, the semiconductor memory device includes at least a first semiconductor memory die, and a surface of the semiconductor memory device includes a plurality of connectors. At least one of the plurality of connectors is electrically connected to the first semiconductor memory die. The plurality of connectors include at least first and second control signal connectors. The first control signal connector is for a first control signal of a first type, the second control signal connector is for a second control signal of the first type, and the first and second control signal connectors are disposed in different areas of the surface. For example, the first type may be a chip select signal, a clock enable signal, or an on die termination enable signal.
摘要翻译：在一个实施例中，半导体存储器件至少包括第一半导体存储器管芯，并且半导体存储器件的表面包括多个连接器。多个连接器中的至少一个电连接到第一半导体存储器管芯。多个连接器包括至少第一和第二控制信号连接器。第一控制信号连接器用于第一类型的第一控制信号，第二控制信号连接器用于第一类型的第二控制信号，并且第一和第二控制信号连接器设置在表面的不同区域中。例如，第一类型可以是芯片选择信号，时钟使能信号或芯片上终止使能信号。

5. 发明授权

US07390973B2 Memory module and signal line arrangement method thereof 有权
标题翻译：存储模块及其信号线排列方法
公开(公告)号：US07390973B2
公开(公告)日：2008-06-24
申请号：US11357500
申请日：2006-02-17
申请人： Chil-Nam Yoon , Kwang-Seop Kim , Do-Hyung Kim , Jae-Jun Lee , Ki-Hyun Ko
发明人： Chil-Nam Yoon , Kwang-Seop Kim , Do-Hyung Kim , Jae-Jun Lee , Ki-Hyun Ko
IPC分类号： H05K1/16
CPC分类号： H05K1/181 , G11C5/025 , G11C5/04 , H05K1/112 , H05K2201/10159 , H05K2201/10545 , Y02P70/611 , Y10T29/49128 , Y10T29/49155
摘要： The pesent invention discloses a memory module and a signal line arrangement method thereof. The memory module includes memory chips mounted on both sidees in a mirror form; and a printed circuit board (PCB) having same signal applying contact pads arranged on both sodes which same signal applying balls of the memory chips contact in the mirror form, wherein a via is formed at a location close to the same signal applying contact pad of one side among the same signal applying contact pads arranged on both sides in the mirror form, the via connecting the other side to the signal line of one side, and a signal transmitted from the other side is connected to a contact junction, the contact junction is connected to the same signal applying contact pad of the other side, the contact junction is connected to the via of the other side, and the via of one side is connected to the same signal applying contact pad of one side.
摘要翻译：本发明公开了一种存储模块及其信号线排列方法。存储器模块包括以镜子形式安装在两侧的存储器芯片; 以及具有相同信号的印刷电路板（PCB），其施加布置在两个信号线上的接触焊盘，所述存储器芯片的相同信号施加球以镜子形式接触，其中通孔形成在接近相同信号的位置处，施加接触焊盘在相同的信号中，以镜面形式设置在两侧的接触焊盘的一侧，将另一侧连接到一侧的信号线的通孔，并且从另一侧传输的信号连接到接触接点，接触接点连接到另一侧的相同信号施加接触焊盘，接触点连接到另一侧的通孔，并且一侧的通孔连接到施加一侧接触焊盘的相同信号。

6. 发明授权

US07348219B2 Method of mounting memory device on PCB for memory module 有权
标题翻译：将存储器件安装在PCB上用于存储器模块的方法
公开(公告)号：US07348219B2
公开(公告)日：2008-03-25
申请号：US11301142
申请日：2005-12-12
申请人： Do-Hyung Kim , Chang-Woo Koo , Jung-Joon Lee , Ki-Hyun Ko
发明人： Do-Hyung Kim , Chang-Woo Koo , Jung-Joon Lee , Ki-Hyun Ko
IPC分类号： H01L21/50 , H05K7/00
CPC分类号： G11C5/04 , H05K1/181 , H05K2201/09418 , H05K2201/10159 , H05K2203/1572 , Y02P70/611
摘要： A memory module and a method of mounting memory devices on a PCB to form the memory module substantially reduce unnecessary routing space and improve signal attenuation characteristics. In the method of mounting and sequentially connecting at least two memory devices on a printed circuit board (PCB) having an axis of elongation to form a memory module, at least one of the memory devices is mounted on at least one face of the PCB so that a base line along an longitudinal axis of the at least one memory device lies at an acute angle with respect to the axis of elongation of the PCB.
摘要翻译：存储器模块和将存储器件安装在PCB上以形成存储器模块的方法基本上减少不必要的路由空间并改善信号衰减特性。在将具有延伸轴的印刷电路板（PCB）上的至少两个存储器件安装并顺序地连接以形成存储器模块的方法中，至少一个存储器件安装在PCB的至少一个面上，沿着至少一个存储器装置的纵向轴线的基线相对于PCB的伸长轴线成锐角。

7. 发明授权

US08144481B2 Memory board structure having stub resistor on main board 有权
标题翻译：内存板结构在主板上具有短路电阻
公开(公告)号：US08144481B2
公开(公告)日：2012-03-27
申请号：US12632853
申请日：2009-12-08
申请人： Sung-Joo Park , Ki-Hyun Ko , Myung-Hee Sung
发明人： Sung-Joo Park , Ki-Hyun Ko , Myung-Hee Sung
IPC分类号： H01R9/00
CPC分类号： H05K1/0246 , H05K1/14 , H05K1/181 , H05K2201/044 , H05K2201/09254 , H05K2201/10022 , H05K2201/10159
摘要： A memory system includes; a main board having memory bus with a wiring line communicating a signal from a memory controller mounted on the main board, first and second module sockets mounted on the main board and connecting the wiring line to first and second memory modules respectively inserted into the first and second module sockets, where the first memory module includes a first electrode connected to the wiring line and the second memory module includes a second electrode connected to the wiring line, and first and second stub resistors disposed on the main board and arranged as primary dual-branching stub resistors forming a T-branch connection structure between the first and second electrodes and a branching node connected to the wiring line.
摘要翻译：存储系统包括：具有存储器总线的主板，具有用于传送来自安装在主板上的存储器控制器的信号的布线的布线;安装在主板上的第一和第二模块插槽，并将布线连接到分别插入第一和第二存储器模块的第一和第二存储器模块; 第二模块插座，其中第一存储器模块包括连接到布线的第一电极，并且第二存储器模块包括连接到布线的第二电极，以及设置在主板上并被布置为主要双绞线的第一和第二短截线电阻器，在第一和第二电极之间形成T分支连接结构的分支短截线电阻器和连接到布线的分支节点。

8. 发明授权

US07919841B2 Mounting structures for integrated circuit modules 有权
公开(公告)号：US07919841B2
公开(公告)日：2011-04-05
申请号：US12010138
申请日：2008-01-22
申请人： Sung-Joo Park , Ki-Hyun Ko , Young Yun , Soo-Kyung Kim
发明人： Sung-Joo Park , Ki-Hyun Ko , Young Yun , Soo-Kyung Kim
IPC分类号： H01L23/02
CPC分类号： H05K1/0246 , H01L2924/0002 , H05K1/181 , H05K2201/10022 , H05K2201/10159 , H05K2201/10522 , H01L2924/00
摘要： A structure of an integrated circuit module includes a wiring board, a plurality of integrated circuits and at least one terminating resistance circuit. The wiring board has a mounting region on at least one surface thereof. The plurality of integrated circuits are mounted in the mounting region of the wiring board and spaced from one another in a first direction. The at least one terminating resistance circuit is arranged between at least two adjacent integrated circuits, and coupled to an output of a last of the plurality of integrated circuits.

9. 发明申请

US20070164448A1 Semiconductor chip package with attached electronic devices, and integrated circuit module having the same 审中-公开
标题翻译：带有电子器件的半导体芯片封装，以及具有相同电路的集成电路模块
公开(公告)号：US20070164448A1
公开(公告)日：2007-07-19
申请号：US11505361
申请日：2006-08-17
申请人： Kyoung-Sun Kim , Ki-Hyun Ko , Byoung-Ha Oh
发明人： Kyoung-Sun Kim , Ki-Hyun Ko , Byoung-Ha Oh
IPC分类号： H01L23/48
CPC分类号： H01L23/66 , H01L23/13 , H01L23/49816 , H01L23/562 , H01L24/48 , H01L2224/16 , H01L2224/4824 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19106 , H05K1/0231 , H05K3/303 , H05K2201/10378 , H05K2201/1053 , H05K2201/10568 , H05K2201/10734 , H05K2201/2036 , Y02P70/613 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Provided are a semiconductor chip package with attached electronic devices, and an integrated circuit module having the same. The semiconductor chip packages may include a supporting substrate, input/output bonding pads arranged on a first plane of the supporting substrate, and device bonding pads arranged on the edges of the first plane or portions of the first plane adjacent to the edges. Accordingly, the mount area of a printed circuit board may be reduced, efficient routing may be possible, and the occurrence of package cracks may be reduced and/or prevented.
摘要翻译：提供了具有附接的电子设备的半导体芯片封装以及具有该电子器件的集成电路模块。半导体芯片封装可以包括支撑衬底，布置在支撑衬底的第一平面上的输入/输出接合焊盘以及布置在第一平面的边缘上的第一平面的边缘或邻近边缘的第一平面的部分的器件接合焊盘。因此，可以减少印刷电路板的安装面积，可以有效地布线，并且可以减少和/或防止包装裂缝的发生。

10. 发明授权

US08044506B2 Thermal-emitting memory module, thermal-emitting module socket, and computer system 失效
标题翻译：发光存储模块，散热模块插座和计算机系统
公开(公告)号：US08044506B2
公开(公告)日：2011-10-25
申请号：US12181488
申请日：2008-07-29
申请人： Young Yun , Soo-Kyung Kim , Kwang-Seop Kim , Ki-Hyun Ko , Sung-Joo Park
发明人： Young Yun , Soo-Kyung Kim , Kwang-Seop Kim , Ki-Hyun Ko , Sung-Joo Park
IPC分类号： H01L23/34
CPC分类号： H01L23/467 , G11C5/04 , H01L2924/0002 , H05K1/0209 , H05K2201/0394 , H05K2201/09781 , H01L2924/00
摘要： The invention provides a thermal-emitting memory module, a thermal-emitting module socket, and a computer system comprising the thermal-emitting memory module and the thermal-emitting module socket. An embodiment of the thermal-emitting module includes: a module substrate having electrically-conductive traces; and a semiconductor device disposed on the module substrate and coupled to the electrically-conductive traces, the module substrate including a thermal-emitting portion disposed in proximity of the semiconductor device without directly contacting the semiconductor device.
摘要翻译：本发明提供了一种发热存储器模块，热发射模块插座和包括热发射存储器模块和热发射模块插座的计算机系统。热发射模块的一个实施例包括：具有导电迹线的模块衬底; 以及设置在所述模块基板上并耦合到所述导电迹线的半导体器件，所述模块基板包括设置在所述半导体器件附近的热发射部分而不直接接触所述半导体器件。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式