专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5637176A Methods for producing ordered Z-axis adhesive materials, materials so produced, and devices, incorporating such materials 失效
标题翻译：生产有序Z轴粘合剂材料的方法，如此生产的材料，以及装配这种材料的装置
公开(公告)号：US5637176A
公开(公告)日：1997-06-10
申请号：US261913
申请日：1994-06-16
申请人： Kenneth B. Gilleo , Michael C. Corey
发明人： Kenneth B. Gilleo , Michael C. Corey
IPC分类号： B29C41/12 , B29C67/08 , C09J7/02 , H05K3/32 , H05K3/40 , B32B31/00
CPC分类号： H05K3/321 , B29C41/12 , B29C67/08 , C09J7/0246 , C09J7/026 , H05K3/4069 , B29K2995/0006 , H05K2201/10378 , H05K2203/0139 , H05K2203/0156 , H05K2203/0191 , H05K2203/0759 , Y10T156/109
摘要： Ordered Z-axis electroconductive sheet materials are produced by entrapping bodies of fusible, polymeric, electroconductive adhesive at predetermined spaced locations in a sheet-like carrier of fusible, polymeric, dielectric adhesive including a thermoplastic component. The materials are useful for mechanically joining and electrically connecting electronic circuit components.
摘要翻译：有序的Z轴导电片材是通过在包括热塑性组分的易熔，聚合物，介电粘合剂的片状载体中的预定的间隔位置夹入可熔，聚合物，导电粘合剂的体来制造的。这些材料可用于机械连接和电连接电子电路部件。

2. 发明授权

US06838372B2 Via interconnect forming process and electronic component product thereof 失效
标题翻译：通过互连成型工艺及其电子部件产品
公开(公告)号：US06838372B2
公开(公告)日：2005-01-04
申请号：US10254703
申请日：2002-09-25
申请人： Kenneth B. Gilleo
发明人： Kenneth B. Gilleo
IPC分类号： H01L21/48 , H01L21/768 , H05K3/40 , H01L21/4763
CPC分类号： H05K3/4069 , H01L21/486 , H01L21/76898 , H05K2203/0191 , H05K2203/0759 , H05K2203/0769 , H05K2203/1461
摘要： A process for masking an electronic component substrate involving application of a temporary mask material to the substrate to form a removably adhered temporary mask over the surface. Exemplary mask materials include polymer films and aqueous hardenable liquid coatings. An electronic component substrate having a temporary mask for masking the substrate surface from interconnect fill material.
摘要翻译：一种用于掩蔽电子部件基板的方法，包括将临时掩模材料施加到所述基板上，以在所述表面上形成可移除地粘附的临时掩模。示例性掩模材料包括聚合物膜和水性可硬化液体涂料。一种电子部件基板，具有用于从互连填充材料掩蔽基板表面的临时掩模。

3. 发明授权

US5971253A Microelectronic component mounting with deformable shell terminals 失效
标题翻译：具有可变形外壳端子的微电子部件安装
公开(公告)号：US5971253A
公开(公告)日：1999-10-26
申请号：US777307
申请日：1996-12-27
申请人： Kenneth B. Gilleo , Konstantine Karavakis
发明人： Kenneth B. Gilleo , Konstantine Karavakis
IPC分类号： H01L23/498 , H05K3/34 , B23K31/02 , B23K31/12
CPC分类号： H01L23/49827 , H01L2924/0002 , H01L2924/3011 , H05K3/3436
摘要： A microelectronic element assembly such as a semiconductor chip assembly uses a connection component incorporating a dielectric sheet with electrically conductive elements therein. Each electrically conductive element may include a flexible shell. The flexible shells can be formed to assure reliable engagement with mating contact pads.
摘要翻译：诸如半导体芯片组件的微电子元件组件使用在其中结合有电导元件的电介质片的连接部件。每个导电元件可以包括柔性壳。可以形成柔性壳体以确保与配合接触垫片的可靠接合。

4. 发明授权

US5688584A Multilayer electronic circuit having a conductive adhesive 失效
标题翻译：具有导电粘合剂的多层电子电路
公开(公告)号：US5688584A
公开(公告)日：1997-11-18
申请号：US534630
申请日：1995-09-27
申请人： Keith L. Casson , Carol Myers , Kenneth B. Gilleo , Deanna Suilmann , Edward Mahagnoul , Marion Tibesar
发明人： Keith L. Casson , Carol Myers , Kenneth B. Gilleo , Deanna Suilmann , Edward Mahagnoul , Marion Tibesar
IPC分类号： H05K3/28 , H05K3/32 , H05K3/36 , H05K3/46 , B32B9/00
CPC分类号： H05K3/462 , H05K3/323 , H05K3/368 , H01L2224/293 , H01L2924/01019 , H01L2924/01322 , H01L2924/07811 , H01L2924/09701 , H05K2201/0233 , H05K2201/0266 , H05K2201/09536 , H05K2201/096 , H05K2201/10666 , H05K2203/0425 , H05K2203/061 , H05K2203/1572 , H05K3/28 , H05K3/321 , H05K3/4623 , Y10S428/901 , Y10T29/49126 , Y10T29/49149 , Y10T428/24917 , Y10T428/2857 , Y10T428/287
摘要： A multilayer circuit board having three or more conductive layers, with at least two conductive layers electrically and mechanically connected by an interconnecting adhesive layer, is disclosed. The interconnecting adhesive layer comprises a conductive adhesive material having a plurality of deformable, heat fusible metallic particles dispersed substantially throughout a non-conductive adhesive. The fabricated multilayer circuit boards have interconnections which are reliable, heat resistant, and capable of withstanding thermal cycling and typical circuit board finishing and assembly processes.
摘要翻译：公开了一种具有三个或更多个导电层的多层电路板，其中至少两个导电层通过互连粘合剂层电连接和机械连接。互连粘合剂层包括导电粘合剂材料，其具有基本上分散在非导电粘合剂上分散的多个可变形的热熔金属颗粒。制造的多层电路板具有可靠，耐热和能够承受热循环和典型的电路板精加工和组装过程的互连。

5. 发明授权

US4747211A Method and apparatus for preparing conductive screened through holes employing metallic plated polymer thick films 失效
标题翻译：用金属电镀聚合物厚膜制备导电屏蔽通孔的方法和装置
公开(公告)号：US4747211A
公开(公告)日：1988-05-31
申请号：US58520
申请日：1987-06-05
申请人： Kenneth B. Gilleo , Stephen E. Chabot , Marion A. Tibesar
发明人： Kenneth B. Gilleo , Stephen E. Chabot , Marion A. Tibesar
IPC分类号： B41F15/08 , H05K1/00 , H05K1/09 , H05K3/12 , H05K3/40 , H05K3/46 , H05K3/42
CPC分类号： H05K3/4053 , B41F15/0854 , H05K3/1233 , H05K1/0393 , H05K1/095 , H05K2201/0347 , H05K2201/09981 , H05K2203/082 , H05K3/4069 , H05K3/4664 , Y10T29/49165
摘要： An apparatus and method for preparing conductive bridges to electrically couple discrete electrical conductors arranged on opposed surfaces of a common substrate. The method and apparatus utilized includes subjecting the bore or opening in the substrate to the force of vacuum applied through a vacuum diffusion barrier. The substrate is exposed to the vacuum source through a plurality of spaced-apart bores of relatively small diameter, with the vacuum diffusion layer being in the form of a web of filter paper tracking and moving in synchronism with the substrate. Conventional silk screening techniques are utilized to form the conductors and bridges, with polymer thick conductive fluids being employed as the printing medium. Multiple layers of conductors may be formed, with dual-sided circuitry being applied to the substrate. The multiple layers are fabricated by initially plating a layer of metal upon the exposed surface of the polymer thick conductive films, and thereafter printing a defined pattern of dielectric upon the electroplated copper. Subsequently, a second polymer thick conductive fluid is employed as a printing medium upon the surface of the dielectric, with contact to the copper being available through vias formed in the dielectric layer. Following cure of such second layer, the exposed surfaces may be plated with a film of copper, nickel or other suitable metal.

6. 发明授权

US4353858A Method for forming a boss upon a thermoplastic polymer surface and resulting article 失效
标题翻译：在热塑性聚合物表面和所得制品上形成凸台的方法
公开(公告)号：US4353858A
公开(公告)日：1982-10-12
申请号：US220087
申请日：1980-12-24
申请人： Kenneth B. Gilleo , Willard H. Kriebich
发明人： Kenneth B. Gilleo , Willard H. Kriebich
IPC分类号： B29C39/10 , B29C59/02 , B29C70/78 , B44C1/24 , B32B3/30
CPC分类号： B29C59/026 , B29C39/10 , B29C70/78 , B44C1/24 , B29L2031/744 , Y10T156/1039 , Y10T428/24479 , Y10T428/24736
摘要： An article comprising a thermoplastic polymer having an essentially planar surface provided with a surface pattern defined and encompassed by at least one continuous self-connecting retaining dam; at least a portion of the dam comprising at least one debossed region between at least two essentially parallel raised ridges; a further article comprising the foregoing article having a boss formed from a hardened resin over the surface pattern to a depth at least equal to the height of the highest of the raised ridges; and a method for manufacturing the articles by heating the surface to a temperature above the deformation temperature of the polymer and impressing the surface with a debossing die to form the portion of the article having the debossed region and raised ridges and introducing a liquid resin into the surface pattern followed by solidifying the resin to form the article having the boss.
摘要翻译：一种包含热塑性聚合物的制品，所述热塑性聚合物具有基本平坦的表面，所述表面具有由至少一个连续自连接保持堤限定和包围的表面图案; 所述坝的至少一部分包括至少两个基本平行的隆起脊之间的至少一个凹陷区域; 一种另外的制品，其特征在于，上述制品具有由表面图案上的硬化树脂形成的至少至少等于凸脊最高高度的深度的凸台; 以及通过将表面加热到高于聚合物的变形温度的温度并用凹槽模压制表面的方法来制造制品，以形成具有凹陷区域和凸脊的制品的部分并将液体树脂引入到表面图案，然后使树脂固化以形成具有凸起的制品。

7. 发明授权

US3956236A Synergistic compositions for increasing flame resistance of polymers 失效
标题翻译：增强聚合物阻燃性的协同组合物
公开(公告)号：US3956236A
公开(公告)日：1976-05-11
申请号：US465223
申请日：1974-04-29
申请人： Francis E. Evans , Kenneth B. Gilleo
发明人： Francis E. Evans , Kenneth B. Gilleo
IPC分类号： C08J7/12 , C08K5/00 , C08L87/00 , D06M11/67 , D06M13/02 , D06M13/184 , D06M13/192 , D06M13/248 , D06M13/252 , D06M13/322 , D06M13/35 , D06M13/355 , D06M13/358 , D06M13/364 , D06M13/402 , D06M13/432 , D06M101/00 , D06M101/16 , D06M101/30 , D06M101/34 , C08J3/20
CPC分类号： C08K5/0066 , D06M11/67 , D06M13/184 , D06M13/192 , D06M13/252
摘要： A composition for increasing flame resistance of a step-reaction polymer comprising a metal salt of certain organic acids in combination with certain organic acids or their ammonium salts, the method of treating the step-reaction polymer with the composition and the resulting treated polymer.
摘要翻译：包含某些有机酸的金属盐与某些有机酸或其铵盐的组合的步进反应聚合物的阻燃性的组合物，用组合物处理步骤反应聚合物的方法和所得到的经处理的聚合物。

8. 发明授权

US06204455B1 Microelectronic component mounting with deformable shell terminals 有权
标题翻译：具有可变形外壳端子的微电子部件安装
公开(公告)号：US06204455B1
公开(公告)日：2001-03-20
申请号：US09345548
申请日：1999-06-30
申请人： Kenneth B. Gilleo , Konstantine Karavakis
发明人： Kenneth B. Gilleo , Konstantine Karavakis
IPC分类号： H01R1204
CPC分类号： H01L23/49827 , H01L2924/0002 , H01L2924/3011 , H05K3/3436 , H01L2924/00
摘要： A microelectronic element assembly such as a semiconductor chip assembly uses a connection component incorporating a dielectric sheet with electrically conductive elements therein. Each electrically conductive element may include a flexible shell. The flexible shells can be formed to assure reliable engagement with mating contact pads.
摘要翻译：诸如半导体芯片组件的微电子元件组件使用在其中结合有电导元件的电介质片的连接部件。每个导电元件可以包括柔性壳。可以形成柔性壳体以确保与配合接触垫片的可靠接合。

9. 发明授权

US5477611A Method of forming interface between die and chip carrier 失效
标题翻译：在芯片和芯片载体之间形成界面的方法
公开(公告)号：US5477611A
公开(公告)日：1995-12-26
申请号：US123882
申请日：1993-09-20
申请人： Jason Sweis , Kenneth B. Gilleo
发明人： Jason Sweis , Kenneth B. Gilleo
IPC分类号： H01L23/12 , G06K19/077 , H01L21/54 , H01L23/24 , H05K3/34
CPC分类号： G06K19/07745 , H01L21/54 , H01L23/24 , H01L2924/0002 , Y10T29/49144
摘要： A method for creating an interface between a chip and chip carrier includes spacing the chip a given distance above the chip carrier, and then introducing a liquid in the gap between the chip and carrier. Preferably, the liquid is an elastomer which is hardened into a resilient layer after its introduction into the gap. In another preferred embodiment, the terminals on a chip carrier are planarized or otherwise vertically positioned by deforming the terminals into set vertical locations with a plate, and then hardening a liquid between the chip carrier and chip.
摘要翻译：用于在芯片和芯片载体之间创建接口的方法包括将芯片与芯片载体之上的给定距离间隔开，然后在芯片和载体之间的间隙中引入液体。优选地，液体是在其引入间隙之后被硬化成弹性层的弹性体。在另一个优选实施例中，芯片载体上的端子被平坦化或以其它方式垂直定位，通过使端子变形成具有板的设定的垂直位置，然后在芯片载体和芯片之间固化液体。

10. 发明授权

US3943100A Nylon flame retardants based on certain organic acids 失效
标题翻译：尼龙阻燃剂基于某些有机酸
公开(公告)号：US3943100A
公开(公告)日：1976-03-09
申请号：US425486
申请日：1973-12-17
申请人： Morris B. Berenbaum , Kenneth B. Gilleo , Francis E. Evans
发明人： Morris B. Berenbaum , Kenneth B. Gilleo , Francis E. Evans
IPC分类号： C08J9/40 , C08K5/092 , C08K5/098 , C08K5/13 , C08K5/37 , D06M13/252 , C08J3/20
CPC分类号： C08J9/40 , C08K5/0066 , C08K5/092 , C08K5/098 , C08K5/13 , C08K5/37 , D06M13/252 , C08J2375/04
摘要： A flame resistant organic polymer which decomposes into fragments containing acidic and/or basic groups and the process for making same comprising treating an organic polymer which decomposes into said fragments with from about 0.5 to about 25 weight percent of a compound which contains at least one functional radical selected from --0--, --S-- and --N-- and at least one carboxyl or mercapto group which is able to dissociate in water to provide a free positively charged ion.
摘要翻译：分解成含有酸性和/或碱性基团的片段的阻燃有机聚合物及其制备方法，包括用约0.5至约25重量％的化合物处理分解成所述片段的有机聚合物，所述化合物含有至少一个官能团选自-O-，-S-和-N-以及至少一个羧基或巯基，其能够在水中解离以提供游离带正电的离子。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式