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1. 发明授权

US09167698B2 Surface mount clip 有权
标题翻译：表面安装夹
公开(公告)号：US09167698B2
公开(公告)日：2015-10-20
申请号：US13807480
申请日：2011-06-30
申请人： Kenji Konda , Tomohisa Kurita , Hiroki Kitano , Tatsuya Nakamura , Hideo Yumi
发明人： Kenji Konda , Tomohisa Kurita , Hiroki Kitano , Tatsuya Nakamura , Hideo Yumi
IPC分类号： H05K1/18 , H05K9/00 , F16B5/06 , F16B21/07
CPC分类号： H05K1/181 , F16B5/0635 , F16B21/073 , H05K9/0035
摘要： A surface mount clip including: a solder joint part in which a lower surface thereof is to be a solder joint surface to be soldered and connected to a conductor pattern on a printed circuit board. A pair of support parts are connected to the solder joint part and, when the solder joint part is soldered and connected to the printed circuit board, are supported in a position above the printed circuit board at an interval between the pair of support parts. The interval allows a conductive member, other than the printed circuit board, to be inserted therein. A resilient contact part, that is connected at least to one of the pair of support parts, is resiliently deformed and pressed by the conductive member, when the conductive member is inserted between the pair of support parts, and electrically connects the conductor pattern and the conductive member.
摘要翻译：一种表面安装夹具，包括：焊接部，其下表面为要焊接并焊接在印刷电路板上的导体图案的焊点表面。一对支撑部分连接到焊接部分，并且当焊接部分被焊接并连接到印刷电路板时，以一对支撑部分之间的间隔被支撑在印刷电路板上方的位置。间隔允许除了印刷电路板之外的导电构件插入其中。当导电构件插入在该对支撑部分之间时，弹性接触部分至少连接到一对支撑部件中的一个支撑部件之间弹性变形并被导电部件按压，并将导体图案和导电构件。

2. 发明申请

US20120217365A1 SURFACE MOUNT CLIP 有权
标题翻译：表面安装夹
公开(公告)号：US20120217365A1
公开(公告)日：2012-08-30
申请号：US13504633
申请日：2010-11-05
申请人： Kenji Konda
发明人： Kenji Konda
IPC分类号： H05K7/00
CPC分类号： H05K9/0022 , H05K7/14 , H05K9/0035
摘要： A surface mount clip includes: a bottom portion having a flat surface; clip spring portions which extend from parts of the bottom portion and are provided in a standing manner, in a pair facing each other so as to form a gap therebetween, and which are configured to clip a plate material inserted into the gap by a resilient repulsive force; and a bottom spring portion which is formed by cutting and raising a part of the bottom portion or the clip spring portions, and which has an upper surface to be pressed by a lower end of the plate material inserted between the pair of the clip spring portions.
摘要翻译：表面安装夹具包括：具有平坦表面的底部; 夹持弹簧部分，其从底部的一部分延伸并且彼此相对地设置成彼此相对设置，以在它们之间形成间隙，并且其被构造成通过弹性排斥力夹住插入到间隙中的板材料力; 以及底部弹簧部分，其通过切割和提升底部部分或夹子弹簧部分的一部分而形成，并且具有被插入在一对夹子弹簧部分之间的板材的下端被按压的上表面。

3. 发明申请

US20120217050A1 CONTACT 有权
标题翻译：联系
公开(公告)号：US20120217050A1
公开(公告)日：2012-08-30
申请号：US13139099
申请日：2010-11-16
申请人： Tomohisa Kurita , Hideo Yumi , Tatsuya Nakamura , Kenji Konda , Hiroki Kitano
发明人： Tomohisa Kurita , Hideo Yumi , Tatsuya Nakamura , Kenji Konda , Hiroki Kitano
IPC分类号： H05K1/18
CPC分类号： H01R12/57 , H01R13/2442 , H01R13/245 , H01R43/205 , H05K1/0215 , H05K9/0016 , H05K2201/10189 , H05K2201/10265 , H05K2201/1031 , H05K2203/0195 , Y02P70/611
摘要： A contact includes a solder bonding portion, an elastic contact portion, and a suction portion. An undersurface of the solder bonding portion is a solder bonding face which is to be solder bonded to the conductor pattern. The elastic contact portion is connected to one end of the solder bonding portion and bent over the solder bonding portion. When in contact with a conductive member, the elastic contact portion is pressed against the conductive member while being elastically deformed. The suction portion is connected to the solder bonding portion independently of the elastic contact portion. The suction portion is made a suction face for a suction nozzle of an automatic mounter, with its top end being arranged in parallel to the undersurface of the solder bonding portion on the conductive member side of the elastic contact portion.
摘要翻译：触点包括焊接部分，弹性接触部分和抽吸部分。焊接接合部的下表面是要焊接到导体图案的焊料接合面。弹性接触部分连接到焊接接合部分的一端并在焊接部分上弯曲。当与导电构件接触时，弹性接触部分被弹性变形地压靠在导电构件上。吸引部分独立于弹性接触部分连接到焊接接合部分。吸引部分为自动安装机的吸嘴的吸附面，其顶端平行于弹性接触部分的导电部件侧的焊料接合部分的下表面。

4. 发明授权

US07503774B2 Surface mount contact member 有权
标题翻译：表面安装接触件
公开(公告)号：US07503774B2
公开(公告)日：2009-03-17
申请号：US12167410
申请日：2008-07-03
申请人： Hideo Yumi , Kenji Konda
发明人： Hideo Yumi , Kenji Konda
IPC分类号： H01R12/00
CPC分类号： H01R13/2421 , Y10S439/94
摘要： A surface mount contact member includes a metal base and a conductive coil spring. The metal base is provided with a nozzle suction surface to be sucked by a suction nozzle and a soldering surface that can be soldered. The soldering surface is faced downward when the nozzle suction surface is faced upward. The conductive coil spring is attached to the metal base in an electrically conductive manner with the nozzle suction surface being exposed to an inner peripheral side of the coil spring.
摘要翻译：表面安装接触构件包括金属基底和导电螺旋弹簧。金属基座设置有可由吸嘴吸附的喷嘴吸附面和可焊接的焊接面。当喷嘴吸力面向上时，焊接面向下。导电螺旋弹簧以导电的方式附接到金属基座，喷嘴吸附表面暴露于螺旋弹簧的内周侧。

5. 发明申请

US20090011662A1 SURFACE MOUNT CONTACT MEMBER 有权
标题翻译：表面安装联系人
公开(公告)号：US20090011662A1
公开(公告)日：2009-01-08
申请号：US12167410
申请日：2008-07-03
申请人： Hideo YUMI , Kenji KONDA
发明人： Hideo YUMI , Kenji KONDA
IPC分类号： H01R13/33
CPC分类号： H01R13/2421 , Y10S439/94
摘要： A surface mount contact member includes a metal base and a conductive coil spring. The metal base is provided with a nozzle suction surface to be sucked by a suction nozzle and a soldering surface that can be soldered. The soldering surface is faced downward when the nozzle suction surface is faced upward. The conductive coil spring is attached to the metal base in an electrically conductive manner with the nozzle suction surface being exposed to an inner peripheral side of the coil spring.
摘要翻译：表面安装接触构件包括金属基底和导电螺旋弹簧。金属基座设置有可由吸嘴吸附的喷嘴吸附面和可焊接的焊接面。当喷嘴吸力面向上时，焊接面向下。导电螺旋弹簧以导电的方式附接到金属基座，喷嘴吸附表面暴露于螺旋弹簧的内周侧。

6. 发明授权

US09370131B2 Surface mount clip 有权
标题翻译：表面安装夹
公开(公告)号：US09370131B2
公开(公告)日：2016-06-14
申请号：US13504633
申请日：2010-11-05
申请人： Kenji Konda
发明人： Kenji Konda
IPC分类号： A47G1/10 , H05K9/00 , H05K7/14
CPC分类号： H05K9/0022 , H05K7/14 , H05K9/0035
摘要： A surface mount clip includes: a bottom portion having a flat surface; clip spring portions which extend from parts of the bottom portion and are provided in a standing manner, in a pair facing each other so as to form a gap therebetween, and which are configured to clip a plate material inserted into the gap by a resilient repulsive force; and a bottom spring portion which is formed by cutting and raising a part of the bottom portion or the clip spring portions, and which has an upper surface to be pressed by a lower end of the plate material inserted between the pair of the clip spring portions.
摘要翻译：表面安装夹具包括：具有平坦表面的底部; 夹持弹簧部分，其从底部的一部分延伸并且彼此相对地设置成彼此相对设置，以在它们之间形成间隙，并且其被构造成通过弹性排斥力夹住插入到间隙中的板材料力; 以及底部弹簧部分，其通过切割和提升底部部分或夹子弹簧部分的一部分而形成，并且具有被插入在一对夹子弹簧部分之间的板材的下端被按压的上表面。

7. 发明授权

US08569626B2 Contact 有权
标题翻译：联系
公开(公告)号：US08569626B2
公开(公告)日：2013-10-29
申请号：US13139099
申请日：2010-11-16
申请人： Tomohisa Kurita , Hideo Yumi , Tatsuya Nakamura , Kenji Konda , Hiroki Kitano
发明人： Tomohisa Kurita , Hideo Yumi , Tatsuya Nakamura , Kenji Konda , Hiroki Kitano
IPC分类号： H01R4/04
CPC分类号： H01R12/57 , H01R13/2442 , H01R13/245 , H01R43/205 , H05K1/0215 , H05K9/0016 , H05K2201/10189 , H05K2201/10265 , H05K2201/1031 , H05K2203/0195 , Y02P70/611
摘要： A contact includes a solder bonding portion, an elastic contact portion, and a suction portion. An undersurface of the solder bonding portion is a solder bonding face which is to be solder bonded to the conductor pattern. The elastic contact portion is connected to one end of the solder bonding portion and bent over the solder bonding portion. When in contact with a conductive member, the elastic contact portion is pressed against the conductive member while being elastically deformed. The suction portion is connected to the solder bonding portion independently of the elastic contact portion. The suction portion is made a suction face for a suction nozzle of an automatic mounter, with its top end being arranged in parallel to the undersurface of the solder bonding portion on the conductive member side of the elastic contact portion.
摘要翻译：触点包括焊接部分，弹性接触部分和抽吸部分。焊接接合部的下表面是要焊接到导体图案的焊料接合面。弹性接触部分连接到焊接接合部分的一端并在焊接部分上弯曲。当与导电构件接触时，弹性接触部分被弹性变形地压靠在导电构件上。吸引部分独立于弹性接触部分连接到焊接接合部分。吸引部分为自动安装机的吸嘴的吸附面，其顶端平行于弹性接触部分的导电部件侧的焊料接合部分的下表面。

8. 发明申请

US20130206457A1 SURFACE MOUNT CLIP 有权
标题翻译：表面安装夹
公开(公告)号：US20130206457A1
公开(公告)日：2013-08-15
申请号：US13807480
申请日：2011-06-30
申请人： Kenji Konda , Tomohisa Kurita , Hiroki Kitano , Tatsuya Nakamura , Hideo Yumi
发明人： Kenji Konda , Tomohisa Kurita , Hiroki Kitano , Tatsuya Nakamura , Hideo Yumi
IPC分类号： H05K1/18
CPC分类号： H05K1/181 , F16B5/0635 , F16B21/073 , H05K9/0035
摘要： A surface mount clip including: a solder joint part in which a lower surface thereof is to be a solder joint surface to be soldered and connected to a conductor pattern on a printed circuit board; a pair of support parts connected to the solder joint part, and, when the solder joint part is soldered and connected to the printed circuit board, supported in a position above the printed circuit board at an interval between the pair of support parts, the interval allowing a conductive member other than the printed circuit board to be inserted therein; and a resilient contact part that is connected at least to one of the pair of support parts, is resiliently deformed and pressed by the conductive member, when the conductive member is inserted between the pair of support parts, and electrically connects the conductor pattern and the conductive member.
摘要翻译：一种表面安装夹具，包括：焊接部，其下表面为要焊接并焊接到印刷电路板上的导体图案的焊点表面; 连接到焊接部分的一对支撑部件，并且当焊接部件被焊接并连接到印刷电路板时，以一对支撑部件之间的间隔被支撑在印刷电路板上方的位置处，间隔允许除了印刷电路板之外的导电构件插入其中; 并且当所述导电构件插入在所述一对支撑部之间时，所述弹性接触部被至少连接到所述一对支撑部中的一个支撑部中的一个，弹性变形并被所述导电构件按压，并且将所述导体图案和导电构件。

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