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    • 8. 发明授权
    • Light source device and display device
    • 光源装置和显示装置
    • US06964200B2
    • 2005-11-15
    • US10469387
    • 2001-03-29
    • Atsushi MiyazakiKatsuhiko KikuchiMasaaki SuzukiRyozo Tomosaki
    • Atsushi MiyazakiKatsuhiko KikuchiMasaaki SuzukiRyozo Tomosaki
    • G01L9/00G01L19/00
    • G01L19/142G01L19/0038G01L19/0084G01L19/0092G01L19/0645
    • The invention is intended to provide a small and highly reliable pressure sensor, which has a smaller number of components and can be produced by using a mold for resin molding in common. A sensor unit (11) is molded with resin and includes a semiconductor chip (1) for converting the change in pressure of a medium introduced through an introduction hole for measurement into an electric signal. A lead member (12) has one end exposed in a connector (23) and is electrically connected to the semiconductor chip (1) in the sensor unit (11) beforehand. Pressure is applied to the semiconductor chip (1) through a pipe (22). An outer case (21) is integrally formed of synthetic resin by insert molding of the sensor unit (11), the lead member (12) and the pipe (22).
    • 本发明旨在提供一种小型且高度可靠的压力传感器,其具有较少数量的部件,并且可以通过使用共同的树脂模制用模具来制造。 传感器单元(11)用树脂模制,并且包括用于将通过测量导入孔引入的介质的压力变化转换为电信号的半导体芯片(1)。 引线构件(12)的一端暴露在连接器(23)中,并预先在传感器单元(11)中电连接到半导体芯片(1)。 通过管道(22)向半导体芯片(1)施加压力。 外壳(21)通过传感器单元(11),引导构件(12)和管道(22)的嵌入成型而由合成树脂一体地形成。