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1. 发明申请

US20220369063A1 Device and Method of Tracking an Event 有权
公开(公告)号：US20220369063A1
公开(公告)日：2022-11-17
申请号：US17336328
申请日：2021-06-02
申请人： Kai-Wen Tien
发明人： Kai-Wen Tien , Yen-Ting Lin
IPC分类号： H04W4/02 , H04W4/024 , H04W4/029 , G08B21/24
摘要： A mobile equipment (ME) for tracking an event comprises at least one storage device; and at least one processing circuit, coupled to the at least one storage device. The at least one storage device stores instructions, and the at least one processing circuit is configured to execute the instructions of: activating a digital tag of the event in the ME, to track the event; and generating an indication on the ME according to the digital tag, when a distance between a first position of the ME and a second position at which the event occurs is greater than a threshold.

2. 发明申请

US20160377575A1 DETECTION METHOD, IMAGING METHOD AND RELATED APPARATUS BASED ON MAGNETISM CHARACTERISTIC DETECTION TECHNIQUE 审中-公开
标题翻译：基于磁性特征检测技术的检测方法，成像方法及相关设备
公开(公告)号：US20160377575A1
公开(公告)日：2016-12-29
申请号：US14922204
申请日：2015-10-26
申请人： Jen-Jie Chieh , Shu-Hsien Liao , Kai-Wen Huang , Herng-Er Horng , Hong-Chang Yang , Chin-Yih Hong
发明人： Jen-Jie Chieh , Shu-Hsien Liao , Kai-Wen Huang , Herng-Er Horng , Hong-Chang Yang , Chin-Yih Hong
IPC分类号： G01N27/72 , G01N33/483
CPC分类号： G01N33/4833 , A61B5/0093 , A61B5/01 , A61B5/05 , A61B8/00 , G01R33/4814
摘要： A magnetism characteristic detection method, a magnetism characteristic detection apparatus, an imaging apparatus and an imaging method are provided, where magnetism detection and imaging are based on an integrated excitation field of a direct current (DC) magnetic field and an oscillation wave. The magnetism detection method includes the following steps. A DC magnetic field is selectively applied to an object. Further, an oscillation wave is provided to the object, where the oscillation wave is a sound wave or an ultrasound wave. Then, a magnetism characteristic variation of the object is detected.
摘要翻译：提供了磁特性检测方法，磁特性检测装置，成像装置和成像方法，其中磁检测和成像基于直流（DC）磁场和振荡波的积分激励场。磁检测方法包括以下步骤。选择性地将DC磁场施加到物体上。此外，振荡波被提供给物体，其中振荡波是声波或超声波。然后，检测物体的磁特性变化。

3. 发明授权

US08981274B2 Optical-electrical converting device with increased transmitting efficiency 有权
标题翻译：具有增加发射效率的光电转换装置
公开(公告)号：US08981274B2
公开(公告)日：2015-03-17
申请号：US13552659
申请日：2012-07-19
申请人： Kai-Wen Wu
发明人： Kai-Wen Wu
IPC分类号： G01J1/44 , H01J40/14 , H05K1/11 , H05K3/34
CPC分类号： H05K1/111 , H05K3/3452 , H05K2201/099 , H05K2201/10106 , H05K2201/10121 , Y02P70/611
摘要： An optical-electrical converting device includes a substrate, an electrical circuit layer, at least one auxiliary pad, and an optical-electrical converting lens. The electrical circuit layer includes at least one circuit portion. The optical-electrical lens includes at least one first supporting portion and at least one second supporting portion. Each of the at least one first supporting portion is positioned on a respective one of the at least one first circuit portion, and each of the at least one second supporting portion is positioned on a respective one of the at least one auxiliary pad. The electrical circuit layer and the at least one auxiliary pad are arranged on the substrate. The thickness of the at least one first circuit portion layer is substantially equal to the thickness of the at least one auxiliary pad.
摘要翻译：光电转换装置包括衬底，电路层，至少一个辅助衬垫和光电转换透镜。电路层包括至少一个电路部分。光电透镜包括至少一个第一支撑部分和至少一个第二支撑部分。所述至少一个第一支撑部分中的每一个位于所述至少一个第一电路部分中的相应一个上，并且所述至少一个第二支撑部分中的每个位于所述至少一个辅助垫中的相应一个上。电路层和至少一个辅助垫布置在基板上。至少一个第一电路部分层的厚度基本上等于至少一个辅助焊盘的厚度。

4. 发明授权

US08905652B2 Circuit board assembly having optical connectors for signal transmission 有权
标题翻译：具有用于信号传输的光学连接器的电路板组件
公开(公告)号：US08905652B2
公开(公告)日：2014-12-09
申请号：US13592359
申请日：2012-08-23
申请人： Kai-Wen Wu
发明人： Kai-Wen Wu
IPC分类号： G02B6/36
CPC分类号： G02B6/4214 , G02B6/4206 , G02B6/4245 , G02B6/43
摘要： A circuit board assembly includes a substrate, a first optical connector, a second optical connector, and at least two planar light wave circuits. The first optical connector includes a first circuit board electrically connected to the substrate, at least one first laser diode, at least one first photodiode, and a first transparent shell. The second optical connector includes a second circuit board connected to the substrate, at least one second laser diode, at least one second photodiode, and a second transparent shell. The planar light wave circuits are arranged between the first and second transparent shells. Each first laser diode is optically coupled with a second photodiode through a first transparent shell, a planar light wave circuit, and a second transparent shell. Each second laser diode is optically coupled with a first photodiode through a second transparent shell, a planar light wave circuit, and a first transparent shell.
摘要翻译：电路板组件包括衬底，第一光学连接器，第二光学连接器以及至少两个平面光波形电路。第一光学连接器包括电连接到基板的第一电路板，至少一个第一激光二极管，至少一个第一光电二极管和第一透明外壳。第二光连接器包括连接到基板的第二电路板，至少一个第二激光二极管，至少一个第二光电二极管和第二透明外壳。平面光波电路布置在第一和第二透明壳之间。每个第一激光二极管通过第一透明外壳，平面光波电路和第二透明外壳与第二光电二极管光耦合。每个第二激光二极管通过第二透明壳，平面光波电路和第一透明壳与第一光电二极管光学耦合。

5. 发明授权

US08780574B2 Double-sided printed circuit board 失效
标题翻译：双面印刷电路板
公开(公告)号：US08780574B2
公开(公告)日：2014-07-15
申请号：US13239287
申请日：2011-09-21
申请人： Kai-Wen Wu
发明人： Kai-Wen Wu
IPC分类号： H01R9/00 , H05K7/00
CPC分类号： H05K1/181 , H01L23/16 , H01L23/49822 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/85 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/8592 , H01L2924/00014 , H01L2924/07802 , H01L2924/12042 , H01L2924/16195 , H01L2924/16788 , H01L2924/181 , H01L2924/3025 , H05K3/4611 , H05K2201/10545 , Y02P70/611 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A double-sided PCB includes a circuit plate, a first chip, and a second chip. The circuit plate includes a spacer layer having a first surface and an opposing second surface, a first multilayer structure, and a second multilayer structure. The first multilayer structure includes a first wire layer, a first middle layer, and a second wire layer having a first grounding portion and first conductive pattern portions, that are stacked on each other on the first surface. The second multilayer structure on the second surface is either a mirror image of the first multilayer structure, or is very similar thereto. The first and second chips are each arranged on a grounding portion and are each electrically connected to their respective conductive pattern portions.
摘要翻译：双面PCB包括电路板，第一芯片和第二芯片。电路板包括具有第一表面和相对的第二表面的间隔层，第一多层结构和第二多层结构。第一多层结构包括第一线层，第一中间层和具有第一接地部分和第一导电图案部分的第二导线层，第一接地部分和第一导电图案部分在第一表面上彼此堆叠。第二表面上的第二多层结构是第一多层结构的镜像，或与其非常相似。第一和第二芯片各自布置在接地部分上，并且各自电连接到它们各自的导电图案部分。

6. 发明授权

US08740475B2 High-frequency transmission module and optical connector having stacked chips connected via wire bonding 失效
标题翻译：具有通过引线接合连接的堆叠芯片的高频传输模块和光连接器
公开(公告)号：US08740475B2
公开(公告)日：2014-06-03
申请号：US13555175
申请日：2012-07-22
申请人： Kai-Wen Wu
发明人： Kai-Wen Wu
IPC分类号： G02B6/00 , G02B6/36 , H01L23/48 , H01L21/70
CPC分类号： H01L25/0657 , H01L24/16 , H01L24/32 , H01L24/45 , H01L24/48 , H01L25/167 , H01L2224/05553 , H01L2224/05554 , H01L2224/16 , H01L2224/16225 , H01L2224/32145 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48472 , H01L2224/73253 , H01L2224/73265 , H01L2225/06506 , H01L2924/12042 , H01L2924/30107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A high-frequency transmission module includes a first chip, a second chip, and a conductive wire. The first chip includes a first top surface and a number of pads arranged along a periphery of the first top surface. The pads include a first bonding pad. The second chip includes a second top surface and a second bonding pad on the second top surface. The second chip is positioned on the first top surface such that the pads are uncovered by the second chip and the second bonding pad is mostly closed to the first bonding pad. The conductive wire bonds to the first bonding pad and the second bonding pad to electrically connect the second chip to the first chip and is configured to transmit high-frequency signals between the first chip and the second chip.
摘要翻译：高频传输模块包括第一芯片，第二芯片和导线。第一芯片包括沿着第一顶表面的周边布置的第一顶表面和多个焊盘。焊盘包括第一焊盘。第二芯片包括在第二顶表面上的第二顶表面和第二焊盘。第二芯片位于第一顶表面上，使得焊盘不被第二芯片覆盖，并且第二焊盘大部分封闭到第一焊盘。导线键合到第一焊盘和第二接合焊盘，以将第二芯片电连接到第一芯片，并且被配置为在第一芯片和第二芯片之间传输高频信号。

7. 发明授权

US08721189B2 Optical fiber connector assembly 失效
标题翻译：光纤连接器总成
公开(公告)号：US08721189B2
公开(公告)日：2014-05-13
申请号：US13445924
申请日：2012-04-13
申请人： Kai-Wen Wu
发明人： Kai-Wen Wu
IPC分类号： G02B6/36
CPC分类号： G02B6/3885 , G02B6/3817
摘要： An optical fiber connector assembly includes a first, and second plug connectors, and a socket connector. The first plug connector includes a first main portion and a first plate with a first front surface defining alignment holes. A first distance is defined between the first front surface and the first main portion. The second plug connector includes a second main portion and a second plate with a second front surface. A second distance is defined between the second front surface and the second main portion. The socket connector includes a side surface defining a recess with a bottom surface. A third distance is defined between the side surface and the bottom surface. Alignment pins extend from the bottom surface. The length of each alignment pin is defined as a fourth distance. The third distance is equal to the first distance and greater than sum of the second and fourth distances.
摘要翻译：光纤连接器组件包括第一和第二插头连接器以及插座连接器。第一插头连接器包括第一主要部分和具有限定对准孔的第一前表面的第一板。在第一前表面和第一主要部分之间限定第一距离。第二插头连接器包括第二主要部分和具有第二前表面的第二板。在第二前表面和第二主要部分之间限定第二距离。插座连接器包括限定具有底表面的凹部的侧表面。在侧表面和底表面之间限定第三距离。对准针从底面延伸。每个对准销的长度被定义为第四距离。第三距离等于第一距离并且大于第二和第四距离的和。

8. 发明授权

US08659340B2 Tunable voltage-controlled pseudo-resistor 失效
标题翻译：可调电压控制的伪电阻
公开(公告)号：US08659340B2
公开(公告)日：2014-02-25
申请号：US13421376
申请日：2012-03-15
申请人： Muh-Tian Shiue , Kai-Wen Yao , Cihun-Siyong Gong
发明人： Muh-Tian Shiue , Kai-Wen Yao , Cihun-Siyong Gong
IPC分类号： H03L5/00
CPC分类号： H03H11/53
摘要： A tunable voltage-controlled pseudo-resistor structure, comprising: a symmetric PMOS transistor circuit and an auto-tuning circuit connected in series. Input of the auto-tuning circuit is connected to a central position Vf of the PMOS transistor circuit having its output Vg, with its purpose of keeping Vg−Vf at a constant value. The PMOS transistor circuit may produce body effect through various different bulk voltages. Through the auto-tuning circuit, Vg and Vf are kept constant to make current of transistor to produce compensation effect, such that regardless of Va>Vb or Va
摘要翻译：一种可调电压控制的伪电阻器结构，包括：对称PMOS晶体管电路和串联连接的自动调谐电路。自调谐电路的输入连接到具有其输出Vg的PMOS晶体管电路的中心位置Vf，其目的是将Vg-Vf保持在恒定值。 PMOS晶体管电路可以通过各种不同的体电压产生身体效应。通过自调谐电路，Vg和Vf保持恒定，以使晶体管的电流产生补偿效果，使得不管Va> Vb或Va

9. 发明授权

US08614504B2 Chip package and method for making same 失效
标题翻译：芯片封装及其制作方法
公开(公告)号：US08614504B2
公开(公告)日：2013-12-24
申请号：US13284978
申请日：2011-10-30
申请人： Kai-Wen Wu
发明人： Kai-Wen Wu
IPC分类号： H01L23/02
CPC分类号： H01L23/3185 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L33/48 , H01L2224/26145 , H01L2224/26175 , H01L2224/2919 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/83141 , H01L2224/83192 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2924/00013 , H01L2924/00014 , H01L2924/01029 , H01L2924/12042 , H01S5/0226 , H01L2924/00 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A chip package includes a substrate, a pad, a double-sided adhesive tape, a chip, and a sealing member. The pad is arranged on the substrate and has a top surface facing away from the substrate. The double-sided adhesive tape includes a first paste surface and an opposing second paste surface. The first paste surface is attached to the top surface. The chip is attached onto the second paste surface and includes a light emitting surface or a light receiving surface facing away from the second paste surface. The sealing member is formed on the pad and tightly surrounds the chip and the double-sided adhesive.
摘要翻译：芯片封装包括衬底，衬垫，双面胶带，芯片和密封构件。衬垫布置在衬底上并且具有背离衬底的顶表面。双面胶带包括第一糊状表面和相对的第二糊状表面。第一浆料表面附着到顶部表面。该芯片附着在第二糊状表面上，并且包括背离第二糊状物表面的发光表面或光接收表面。密封构件形成在垫上并紧密地包围芯片和双面粘合剂。

10. 发明申请

US20130306837A1 OPTICAL-ELECTRICAL CONVERTING DEVICE 有权
标题翻译：光电转换器件
公开(公告)号：US20130306837A1
公开(公告)日：2013-11-21
申请号：US13552659
申请日：2012-07-19
申请人： KAI-WEN WU
发明人： KAI-WEN WU
IPC分类号： G01J1/04
CPC分类号： H05K1/111 , H05K3/3452 , H05K2201/099 , H05K2201/10106 , H05K2201/10121 , Y02P70/611
摘要： An optical-electrical converting device includes a substrate, an electrical circuit layer, at least one auxiliary pad, and an optical-electrical converting lens. The electrical circuit layer includes at least one circuit portion. The optical-electrical lens includes at least one first supporting portion and at least one second supporting portion. Each of the at least one first supporting portion is positioned on a respective one of the at least one first circuit portion, and each of the at least one second supporting portion is positioned on a respective one of the at least one auxiliary pad. The electrical circuit layer and the at least one auxiliary pad are arranged on the substrate. The thickness of the at least one first circuit portion layer is substantially equal to the thickness of the at least one auxiliary pad.
摘要翻译：光电转换装置包括衬底，电路层，至少一个辅助衬垫和光电转换透镜。电路层包括至少一个电路部分。光电透镜包括至少一个第一支撑部分和至少一个第二支撑部分。所述至少一个第一支撑部分中的每一个位于所述至少一个第一电路部分中的相应一个上，并且所述至少一个第二支撑部分中的每个位于所述至少一个辅助垫中的相应一个上。电路层和至少一个辅助衬垫布置在衬底上。至少一个第一电路部分层的厚度基本上等于至少一个辅助焊盘的厚度。

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