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    • 3. 发明授权
    • CAD and simulation system for targeting IC designs to multiple
fabrication processes
    • CAD和仿真系统,用于将IC设计定位到多个制造过程
    • US5754826A
    • 1998-05-19
    • US511172
    • 1995-08-04
    • Abbas El GamalDavid P. MarpleJustin M. Reyneri
    • Abbas El GamalDavid P. MarpleJustin M. Reyneri
    • G06F17/50H01L21/70
    • G06F17/5068G06F17/5045
    • Using the present invention, only a single design and development process needs to be conducted for ICs fabricated using a number of different fabrication processes. In one embodiment of this process, the IC is first designed on a CAD system using a generic Cell Based Architecture (CBA) library. This generic CBA library represents several libraries for different process technologies. The resulting generic design is then simulated and verified using best and worst case timing delays and other parameters which are derived from a combination of the various technologies. Hence, only one design need be created and simulated. Generic design rule and parasitic parameters are then used to optimize the placement and routing of the generic design. The post-layout generic design is then simulated and verified using performance characteristics determined by a combination of the technologies. The accepted, generic post-layout design is then ported for each intended fabrication process to create the mask patterns associated with each fabrication process.
    • 使用本发明,仅需要对使用多种不同制造工艺制造的IC进行单一的设计和开发过程。 在该过程的一个实施例中,IC首先在使用通用的基于单元的架构(CBA)库的CAD系统上设计。 该通用CBA库代表用于不同进程技术的多个库。 然后使用最佳和最差情况的时序延迟以及从各种技术的组合导出的其他参数来模拟和验证所得通用设计。 因此,只需要创建和模拟一个设计。 然后通用设计规则和寄生参数用于优化通用设计的布局和路由。 然后使用由技术的组合确定的性能特征来模拟和验证后布局通用设计。 然后,接受的通用后布图设计移植到每个预期的制造工艺,以创建与每个制造工艺相关联的掩模图案。